摘要:
An electronic device includes an electronic component 2, 3, such as a SAW (=Surface Acoustic Wave) filter 2, 3 having connection areas 4, 5. The filter 2, 3 is sealed off from the environment by means of a cover 6 forming a cavity 7 above the filter 2, 3. According to the invention, the cover 6 is formed by a lacquer layer 6A which is provided, at the location of the filter 2, 3, with an opening 7′ and which is covered with a photoresist layer 6B closing the opening 7′ such that the cavity 7 thus formed has a thickness above zero everywhere above the filter 2, 3. This enables an accurate and stable frequency selection by means of the filter 2, 3 and allows the device according to the invention to be very compact and easy to manufacture. Thus, the device according to the invention is very suitable for use in an application such as a mobile telephone, also after integration of the device with a semiconductor device. The photoresist layer 6B and the lacquer layer 6A preferably contain further openings 8, at the location of the connection regions 4, 5, which are provided with bumps 9, preferably solder bumps 9. Preferably, the photoresist layer 6B includes a solid foil 6B, which is solder-repellent.
摘要:
A field effect transistor (T) of the (quasi-)vertical type, which means that in the semiconductor body (10) of the transistor (T), a source (1) and a drain (3) are positioned (approximately) above each other and are separated from each other by the channel region (2), which is connected to a gate region (4), each one of said regions being connected to a connection conductor (6, 7, 11) joining a connection region (7, 8, 12). The connection regions (7, 8) of the source (1) and the gate (4) are situated on top of the semiconductor body (10). The semiconductor body (10) is provided with a through-hole (9) at least one wall of which is covered with a conductive layer (11), which is connected to the drain (3), and which forms the connection conductor (11) of the drain (3) and which is connected to the connection region (12) for the drain (3) situated on top of the semiconductor body (10). In this way, the transistor (T) is very well suited for surface mounting and is also very easy to manufacture. The through-hole (9) can be made by means of a cheap technique, such as laser cutting or sandblasting. Moreover, the transistor (T) is insensitive to the thickness of the channel region (2), which, in addition, may be comparatively thick. This simplifies the manufacture thereof and renders the transistor (T) suitable for both high power and high voltage applications. An additional advantage is that the transistor (T) can be manufactured without using a comparatively expensive epitaxial process.
摘要:
The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.
摘要:
The invention relates to a method of manufacturing a semiconductor device (10), whereby an electric element (11) is attached on or above a carrier plate (4) which comprises a first layer (5) of a first material and a second layer (2) of a second material which differs from the first, which is electrically conducting, which has a smaller thickness than the first layer (5), and in which a cavity (6) is formed that extends at least to the first layer (5). The element (11) is electrically connected to parts (2) of the carrier plate (4) at first connection regions (1), and an encapsulation is deposited around the element (11) and in the cavity (6). Then so much of the first layer (5) of the carrier plate (4) is removed that the cavity (6) is reached, whereby second connection conductors (2) are formed from the remaining portion of the carrier plate (4).According to the invention, at least one further cavity (7) is formed in a portion of the carrier plate (4) surrounded by the cavity (6) before the encapsulation (3) is deposited, which further cavity (7) becomes at least substantially filled with a portion of the encapsulation (3) during the deposition thereof and, within the second connection regions (2), separates a portion (2A) thereof from the remaining portion (2B) thereof, the smallest dimension of the portion (2A) being chosen to be smaller than the smallest dimension of the remaining portion (2B) of each second connection region (2). The portion (2A) may thus be readily provided with solder (8A) having a smaller thickness than the solder (8B) in the remaining portion of the second connection region (2). This is an advantage, for example in the case of surface mounting of the device (10). Preferably, the first connection regions (1) are connected to the portion (2A) of the connection region (2).
摘要:
A method of connecting a metal (1) with a ceramic material (2) comprises the steps of providing a through-hole (3) in the ceramic material and positioning the metal (1) to be connected to the ceramic material (2) proximate to the ceramic material (2) with the through-hole (3). Subsequently, the metal (1) is melted (7) proximate to the through-hole (3). A pressure difference prevails between the side of the ceramic (2) remote from the metal and the side of the metal (1) remote from the ceramic material (2). A larger pressure prevails at the side of the metal (1) remote from the ceramic material (2). The pressure difference causes the melt (7) to be pressed into the through-hole (3) in the ceramic material (2). The through-hole (3) has such a shape that, after solidification, the solidified material (14) and the through-hole (3) have a complementary locking form.
摘要:
The invention relates to a method of manufacturing a semiconductor device (10), wherein a semiconductor element (1) provided with a number of connection regions (2) is fitted between a first, electroconductive plate (3) and a second plate (4), wherein two connection conductors (3A, 3B) are formed, from the first plate (3), for the two connection regions (2A, 2B) of the element (1), wherein a passivating encapsulation (5) is provided between the plates (3, 4) and around the element (1), and wherein the device (10) is formed by applying a mechanical separating technique in two mutually perpendicular directions (L, M).In a method according to the invention, the connection conductors (3A, 3B) are formed by providing a mask (6) on the first conducting plate (3) in such a manner that a part (3C) of the plate (3) situated between the connection regions (2A, 2B) remains exposed, which part is subsequently removed by etching. Such a method enables a very compact discrete or at least semi-discrete semiconductor device (10) to be readily obtained at low cost, while a high yield is achieved. In a preferred embodiment, also further parts (3D) of the conducting plate (3) situated at the location where the device (10) is to be sawn, cut or broken remain uncovered by the mask (6) and are removed during etching.
摘要:
The present invention relates to a laser projection system (1) having means for reducing the coherence of a generated laser beam (3) in order to reduce the occurrence of annoying speckle artifacts in images produced by the system. Coherence is reduced by letting the laser beam (3) pass through a transparent cell (6) comprising first (A) and second (B) immiscible fluids having different refractive indices. The fluids are displaced in the cell, preferably using an electrowetting technique. The cell (6) may thus be realized as an electrowetting lens, which is driven with a pseudo random driving signal.
摘要:
The sensing device (100) comprises a first sensing element (10) having a reference plane (1), between which sensing element (10) and a contacting side (3) of the device (100) a predefined angle is present. Conductors couple the sensing element (10) to external contacting means (30). The sensing device (100) is further provided with a body (21), which encapsulates the first sensing element (10) and at the same time acts as a carrier for the conductors, so that the contacting side (3) is a face of the body (21). The sensing device (100) may contain more than one sensing element (10,20), which are by preference magneto-resistive sensors. It can be suitably manufactured in that parts (21A, 21B) of the body are rotated with respect to the contacting side (3), the parts (21A, 21B) of the body having complementary shapes.
摘要:
In a method of manufacturing modules (4), each with at least one integrated circuit (2), the integrated circuits (2) are separated from a previously manufactured circuit configuration (1), which is in the form of a flexible film comprising a plurality of integrated circuits (2) on the basis of a polymer, by a combined stamping-vacuum conveying device (6), after which each of the separated integrated circuits (2) is conveyed to a module substrate (5) and connected to the module substrate (5) so as to form a module (4).
摘要:
An X-ray apparatus includes an X-ray source for producing a beam of X-rays, an X-ray detector for detecting this radiation, and an X-ray filter with filter elements which is arranged between the X-ray source and the X-ray detector so as to attenuate the X-ray beam in each independent filter element individually. Each filter element can contain a liquid filling (22) which is electrically conductive and X-ray absorbing, the value of the X-ray absorptivity of each filter element being discretely adjustable by step-wise adjustment of the level of the liquid filling within each filter element. Each filter element includes an electrode (23) which is positioned between an isolator layer (34) and a substrate (38) in a wall of the filter element in order to apply an electric potential to the wall of this element. Another electric potential is applied to the liquid filling. Therefore, an electric capacitance can be defined per unit of surface area of the filter element. In order to achieve step-wise filling of the filter element, in accordance with the invention the electric capacitance per unit of surface area of the filter element is varied in its longitudinal direction z. This is realized, for example, by subdividing the electrode (23) into electrode segments of different surface area in the longitudinal direction z of the filter element, the first electrode segment (37) having a surface area which is larger than that of the second electrode segment (39).