公开(公告)号：US20160028203A1

公开(公告)日：2016-01-28

申请号：US14874275

申请日：2015-10-02

申请人： Joshua D. Heppner ,  Gaurav Chawla

发明人： Joshua D. Heppner ,  Gaurav Chawla

IPC分类号： H01R43/24 ,  H01L21/50

CPC分类号： H01R43/24 ,  H01L21/00 ,  H01L21/50 ,  H01L2021/60 ,  H01R12/716 ,  H01R13/245 ,  H01R13/405 ,  H01R13/6599 ,  H01R43/16 ,  H05K7/10

摘要： Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.

公开(公告)号：US20140273662A1

公开(公告)日：2014-09-18

申请号：US13826393

申请日：2013-03-14

申请人： Joshua D. Heppner ,  Gaurav Chawla

发明人： Joshua D. Heppner ,  Gaurav Chawla

IPC分类号： H01R24/86 ,  H01R43/00

CPC分类号： H01R24/86 ,  H01R12/724 ,  H01R12/727 ,  H01R12/79 ,  H01R24/60 ,  H01R43/00 ,  H01R2107/00 ,  Y10T29/49117

摘要： This disclosure relates generally to a connector assembly. In various examples, first conductive members are secured with respect to one another and form a first row and second conductive members are secured with respect to one another, a first subset of the second conductive members forming a second row and a second subset of the second conductive members forming a third row, the second and third rows being parallel and stacked with respect to one another and the second and third rows being orthogonal to the first row. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding one of contacts. Ones of the first conductive members are arranged to be coupled to a corresponding individual one of the second conductive members proximate a second end of each of the first and second conductive members.

摘要翻译： 本公开总体上涉及连接器组件。 在各种示例中，第一导电构件相对于彼此固定并形成第一行，并且第二导电构件相对于彼此固定，第二导电构件的第一子集形成第二行，第二子集的第二导电构件 形成第三排的导电构件，第二和第三排相对于彼此平行和堆叠，第二和第三行与第一行正交。 第一和第二导电构件中的各个被布置成在第一端耦合到对应的一个触点。 第一导电部件的一部分布置成接近靠近第一和第二导电部件的每一个的第二端的相应的单独的一个第二导电部件。

公开(公告)号：US20170287736A1

公开(公告)日：2017-10-05

申请号：US15085538

申请日：2016-03-30

申请人： Sasha Oster ,  Adel A. Elsherbini ,  Joshua D. Heppner ,  Shawna M. Liff

发明人： Sasha Oster ,  Adel A. Elsherbini ,  Joshua D. Heppner ,  Shawna M. Liff

IPC分类号： H01L21/56 ,  H01L23/31

CPC分类号： H01L23/315 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/467 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/81

摘要： Molded electronics package cavities are formed by placing a sacrificial material in the mold and then decomposing, washing, or etching away this sacrificial material. The electronics package that includes this sacrificial material is then overmolded, with little or no change needed in the overmolding process. Following overmolding, the sacrificial material is removed such as using a thermal, chemical, optical, or other decomposing process. This proposed use of sacrificial material allows for formation of complex 3-D cavities, and reduces or eliminates the need for precise material removal tolerances. Multiple instances of the sacrificial material may be removed simultaneously, replacing a serial drilling process with a parallel material removal manufacturing process.

公开(公告)号：US08025531B1

公开(公告)日：2011-09-27

申请号：US12970663

申请日：2010-12-16

申请人： Zhichao Zhang ,  Joshua D. Heppner ,  Kemal Aygun

发明人： Zhichao Zhang ,  Joshua D. Heppner ,  Kemal Aygun

IPC分类号： H01R13/648

CPC分类号： H01R13/6588 ,  H01R12/52 ,  H01R13/6599

摘要： A shielded socket and method of fabrication is described. In an embodiment, a socket is formed of a conductive polymer socket housing, and at least one conductive contact is in electrical contact with the conductive polymer socket housing. In an embodiment, a socket is formed of an insulative socket housing, and at least one conductive contact is in electrical contact with a conductive grid embedded within the insulative housing.

摘要翻译： 描述了屏蔽插座和制造方法。 在一个实施例中，插座由导电聚合物插座壳体形成，并且至少一个导电触头与导电聚合物插座壳体电接触。 在一个实施例中，插座由绝缘插座壳体形成，并且至少一个导电触头与嵌入绝缘壳体内的导电栅格电接触。

公开(公告)号：US09491881B2

公开(公告)日：2016-11-08

申请号：US14164403

申请日：2014-01-27

申请人： Joshua D. Heppner ,  Zhichao Zhang ,  Srikant Nekkanty ,  Michael Garcia

发明人： Joshua D. Heppner ,  Zhichao Zhang ,  Srikant Nekkanty ,  Michael Garcia

IPC分类号： H05K7/10 ,  H01R12/70 ,  H05K1/18 ,  H05K3/42

CPC分类号： H05K7/1069 ,  H01R12/7076 ,  H01R12/7082 ,  H05K1/184 ,  H05K3/42 ,  H05K2201/09545 ,  H05K2201/10189 ,  H05K2201/10265 ,  Y10T29/49222

摘要： A microelectronic socket having a two piece construction, wherein a first piece comprises a conductive socket substrate and the second piece comprises an insulative insert. The conductive socket substrate has a first surface, a second surface, and at least one opening extending therebetween. The insulative insert has a base portion with at least one projection extending therefrom. The insulative insert is mated with the conductive socket substrate such that the at least one projection resides within a corresponding conductive socket substrate opening. The insulative insert further includes a plurality of vias, wherein at least one of the plurality of vias extends through the insulative base and through an insulative insert projection, wherein a contact may be disposed within the via.

摘要翻译： 一种具有两件式结构的微电子插座，其中第一件包括导电插座衬底，第二件包括绝缘插入件。 导电插座基板具有第一表面，第二表面和在它们之间延伸的至少一个开口。 绝缘插入件具有从其延伸的至少一个突起的基部。 绝缘插入件与导电插座基板配合，使得至少一个突起位于相应的导电插座衬底开口内。 绝缘插入件还包括多个通孔，其中多个通孔中的至少一个延伸穿过绝缘基底并穿过绝缘插入物突起，其中触点可以设置在通孔内。

公开(公告)号：US20170094799A1

公开(公告)日：2017-03-30

申请号：US14866648

申请日：2015-09-25

申请人： Shipeng Qiu ,  Shawna Liff ,  Kayleen L. Helms ,  Joshua D. Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

发明人： Shipeng Qiu ,  Shawna Liff ,  Kayleen L. Helms ,  Joshua D. Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

IPC分类号： H05K1/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/22 ,  H05K3/30 ,  H05K1/02 ,  H05K3/36

CPC分类号： H05K1/189 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/036 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/22 ,  H05K3/303 ,  H05K3/326 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0308 ,  H05K2201/041 ,  H05K2201/047 ,  H05K2201/057 ,  H05K2201/10007 ,  H05K2201/10128 ,  H05K2203/10 ,  H05K2203/104 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1194

摘要： An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.

公开(公告)号：US20140273553A1

公开(公告)日：2014-09-18

申请号：US13801730

申请日：2013-03-13

申请人： Joshua D. Heppner ,  Sriram Srinivasan

发明人： Joshua D. Heppner ,  Sriram Srinivasan

IPC分类号： H01R12/70 ,  H01R43/16

CPC分类号： H01R12/7076 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/06727 ,  G01R1/06733 ,  G06F1/1613 ,  H01R12/714 ,  H01R12/716 ,  H01R13/2471 ,  H01R43/205 ,  H05K1/181 ,  Y10T29/49204

摘要： An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.

摘要翻译： 一种装置包括多个接触元件，以在集成电路和电子子组件之间提供电连续性，其中接触元件包括弹簧元件和单独的引线元件，其中弹簧元件布置成基本上可垂直滑动至少一个 引导元件的一部分响应于施加到接触元件的力。

公开(公告)号：US20170287847A1

公开(公告)日：2017-10-05

申请号：US15088857

申请日：2016-04-01

申请人： Rajendra C. Dias ,  Robert L. Sankman ,  Joshua D. Heppner ,  Mitul B. Modi ,  Yoshihiro Tomita

发明人： Rajendra C. Dias ,  Robert L. Sankman ,  Joshua D. Heppner ,  Mitul B. Modi ,  Yoshihiro Tomita

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/538 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5389 ,  H01L2224/16227 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3025

摘要： Apparatus and methods are provided for an integrated circuit package that includes an integrated EMI shield. In an example, an integrated circuit package can include an integrated circuit mounted to a substrate via connections on the bottom surface of the integrated circuit, a conductive fence surrounding side surfaces of the integrated circuit, a conductive film coupled to the conductive fence, the film located above a top surface of the integrated circuit and coextensive with a footprint defined by the conductive fence.

公开(公告)号：US20150214665A1

公开(公告)日：2015-07-30

申请号：US14164403

申请日：2014-01-27

申请人： Joshua D. Heppner ,  Zhichao Zhang ,  Srikant Nekkanty ,  Michael Garcia

发明人： Joshua D. Heppner ,  Zhichao Zhang ,  Srikant Nekkanty ,  Michael Garcia

IPC分类号： H01R13/6461 ,  H01R43/18 ,  H01R12/71

CPC分类号： H05K7/1069 ,  H01R12/7076 ,  H01R12/7082 ,  H05K1/184 ,  H05K3/42 ,  H05K2201/09545 ,  H05K2201/10189 ,  H05K2201/10265 ,  Y10T29/49222

摘要： A microelectronic socket having a two piece construction, wherein a first piece comprises a conductive socket substrate and the second piece comprises an insulative insert. The conductive socket substrate has a first surface, a second surface, and at least one opening extending therebetween. The insulative insert has a base portion with at least one projection extending therefrom. The insulative insert is mated with the conductive socket substrate such that the at least one projection resides within a corresponding conductive socket substrate opening. The insulative insert further includes a plurality of vias, wherein at least one of the plurality of vias extends through the insulative base and through an insulative insert projection, wherein a contact may be disposed within the via.

摘要翻译： 一种具有两件式结构的微电子插座，其中第一件包括导电插座衬底，第二件包括绝缘插入件。 导电插座基板具有第一表面，第二表面和在它们之间延伸的至少一个开口。 绝缘插入件具有从其延伸的至少一个突起的基部。 绝缘插入件与导电插座基板配合，使得至少一个突起位于相应的导电插座衬底开口内。 绝缘插入件还包括多个通孔，其中多个通孔中的至少一个延伸穿过绝缘基底并穿过绝缘插入物突起，其中触点可以设置在通孔内。

公开(公告)号：US20140167900A1

公开(公告)日：2014-06-19

申请号：US13715016

申请日：2012-12-14

申请人： Gregorio R. Murtagian ,  Robert L. Sankman ,  Brent S. Stone ,  Kaladhar Radhakrishnan ,  Joshua D. Heppner

发明人： Gregorio R. Murtagian ,  Robert L. Sankman ,  Brent S. Stone ,  Kaladhar Radhakrishnan ,  Joshua D. Heppner

IPC分类号： H01F27/29 ,  H01F41/00

CPC分类号： H01F27/2852 ,  H01F17/045 ,  H01F27/02 ,  H01F27/027 ,  H01F27/06 ,  H01F27/2847 ,  H01F27/292 ,  H01F2027/065 ,  H01F2027/297 ,  H01L2224/16225 ,  H01L2924/181 ,  Y10T29/4902 ,  H01L2924/00012

摘要： Embodiments of the present disclosure are directed towards an inductor structure having one or more strips of conductive material disposed around a core. The strips may have contacts at a first end and a second end of the strips, and may be disposed around the core with a gap between the contacts. The inductor structure may be mounted on a surface of a substrate, and one or more traces may be formed in the surface of the substrate to electrically couple two or more of the strips of conductive material to one another to form inductive coils. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及具有围绕芯设置的一个或多个导电材料条的电感器结构。 条带可以在条的第一端和第二端处具有触点，并且可以在接触件之间具有间隙而围绕芯设置。 电感器结构可以安装在衬底的表面上，并且可以在衬底的表面中形成一个或多个迹线，以将两个或更多个导电材料条彼此电耦合以形成感应线圈。 可以描述和/或要求保护其他实施例。