公开(公告)号：US09496216B2

公开(公告)日：2016-11-15

申请号：US13725132

申请日：2012-12-21

申请人： Sung-Hoon Chun ,  Hye-Jin Kim ,  Sang-Ho An ,  Kyung-Man Kim ,  Seok-Chan Lee

发明人： Sung-Hoon Chun ,  Hye-Jin Kim ,  Sang-Ho An ,  Kyung-Man Kim ,  Seok-Chan Lee

IPC分类号： H01L21/02 ,  H01L23/50 ,  H01L25/065 ,  H01L25/18 ,  H01L23/522 ,  H01L49/02 ,  H01L23/00 ,  H01L23/525

CPC分类号： H01L23/50 ,  H01L23/5223 ,  H01L23/525 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L28/40 ,  H01L2224/02166 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/06102 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

摘要： Semiconductor packages including stacked semiconductor chips are provided. The semiconductor packages may include first semiconductor chips and a second semiconductor chip that are stacked sequentially on a board. The semiconductor packages may also include a wiring layer on the memory chips and the wiring layer may include redistribution patterns and redistribution pads. Each of the memory chips may include a data pad. The data pads of the first semiconductor chips may be electrically connected to the board via the second semiconductor chip, some of redistribution patterns, and some of redistribution pads.

摘要翻译： 提供包括堆叠半导体芯片的半导体封装。 半导体封装可以包括顺序堆叠在板上的第一半导体芯片和第二半导体芯片。 半导体封装还可以包括存储器芯片上的布线层，并且布线层可以包括再分配图案和再分布垫。 每个存储器芯片可以包括数据焊盘。 第一半导体芯片的数据焊盘可以经由第二半导体芯片电连接到板，一些再分布图案和一些再分布焊盘。

公开(公告)号：US08525349B2

公开(公告)日：2013-09-03

申请号：US13217383

申请日：2011-08-25

申请人： In-Sang Song ,  Kyung-Man Kim

发明人： In-Sang Song ,  Kyung-Man Kim

IPC分类号： H01L29/40 ,  H01L23/02 ,  H01L23/34 ,  H01L21/00

CPC分类号： H01L24/49 ,  H01L22/20 ,  H01L22/32 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package includes a first package including a first substrate and at least one first semiconductor chip mounted on the first substrate, a redistribution wiring layer provided on the first package and including a connection pad, a bonding pad electrically connected to the connection pad and a dummy bonding pad electrically connected to the bonding pad, a second package stacked on the first package via the redistribution wiring layer and electrically connected to the connection pad of the redistribution wiring layer by a first connection member, a bonding wire electrically connecting the bonding pad to the first substrate, and a dummy bonding wire electrically connecting the dummy bonding pad to the first substrate.

摘要翻译： 一种半导体封装，包括：第一封装，包括第一基板和安装在第一基板上的至少一个第一半导体芯片;再分布布线层，设置在第一封装上并包括连接焊盘，电连接到连接焊盘的焊盘和 电连接到接合焊盘的第二封装，经由再分布布线层叠在第一封装上的第二封装，并通过第一连接构件电连接到再分布布线层的连接焊盘; 所述第一基板和将所述虚拟焊盘电连接到所述第一基板的虚拟焊盘。

公开(公告)号：US20120080806A1

公开(公告)日：2012-04-05

申请号：US13217383

申请日：2011-08-25

申请人： IN-SANG SONG ,  Kyung-Man Kim

发明人： IN-SANG SONG ,  Kyung-Man Kim

IPC分类号： H01L23/49

CPC分类号： H01L24/49 ,  H01L22/20 ,  H01L22/32 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package includes a first package including a first substrate and at least one first semiconductor chip mounted on the first substrate, a redistribution wiring layer provided on the first package and including a connection pad, a bonding pad electrically connected to the connection pad and a dummy bonding pad electrically connected to the bonding pad, a second package stacked on the first package via the redistribution wiring layer and electrically connected to the connection pad of the redistribution wiring layer by a first connection member, a bonding wire electrically connecting the bonding pad to the first substrate, and a dummy bonding wire electrically connecting the dummy bonding pad to the first substrate.

摘要翻译： 一种半导体封装，包括：第一封装，包括第一基板和安装在第一基板上的至少一个第一半导体芯片;再分布布线层，设置在第一封装上并包括连接焊盘，电连接到连接焊盘的焊盘和 电连接到接合焊盘的第二封装，经由再分布布线层叠在第一封装上的第二封装，并通过第一连接构件电连接到再分布布线层的连接焊盘; 所述第一基板和将所述虚拟焊盘电连接到所述第一基板的虚拟焊盘。

公开(公告)号：US20110095424A1

公开(公告)日：2011-04-28

申请号：US12855322

申请日：2010-08-12

申请人： In-Sang Song ,  Hye-Jin Kim ,  Kyung-Man Kim

发明人： In-Sang Song ,  Hye-Jin Kim ,  Kyung-Man Kim

IPC分类号： H01L23/498

CPC分类号： H01L25/105 ,  H01L21/568 ,  H01L23/481 ,  H01L23/49833 ,  H01L25/0657 ,  H01L2224/02377 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/13024 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/9205 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311

摘要： The semiconductor package structure includes first and second packages. The first package has at least one first semiconductor chip disposed on a first printed circuit board, and at least one first pad disposed on the at least one first semiconductor chip. The second package has at least one second pad disposed on the first package, and at least one second semiconductor chip disposed on the at least one second pad. The at least one first semiconductor chip is electrically connected to the first printed circuit board. The at least one second pad is electrically connected to the at least one second semiconductor chip. The at least one second pad faces the at least one first pad.

摘要翻译： 半导体封装结构包括第一和第二封装。 第一封装具有设置在第一印刷电路板上的至少一个第一半导体芯片和设置在至少一个第一半导体芯片上的至少一个第一焊盘。 所述第二封装具有设置在所述第一封装上的至少一个第二焊盘以及设置在所述至少一个第二焊盘上的至少一个第二半导体芯片。 所述至少一个第一半导体芯片电连接到所述第一印刷电路板。 所述至少一个第二焊盘电连接到所述至少一个第二半导体芯片。 所述至少一个第二垫面对所述至少一个第一垫。

公开(公告)号：US20050140303A1

公开(公告)日：2005-06-30

申请号：US10878532

申请日：2004-06-29

申请人： Yae-Yoon Lee ,  Kyung-Man Kim ,  Yae-Yong Park ,  Choong-Keun Yoo ,  Ock-Hee Kim

发明人： Yae-Yoon Lee ,  Kyung-Man Kim ,  Yae-Yong Park ,  Choong-Keun Yoo ,  Ock-Hee Kim

IPC分类号： H05B33/22 ,  G09F9/30 ,  G09F9/33 ,  G09F13/22 ,  G09G3/10 ,  G09G3/30 ,  G09G3/32 ,  H01L27/15 ,  H01L27/32 ,  H01L51/00 ,  H01L51/50 ,  H01L51/56 ,  H05B33/02 ,  H05B33/04 ,  H05B33/06 ,  H05B33/08 ,  H05B33/10 ,  H05B33/12 ,  H05B33/14 ,  H05B33/26

CPC分类号： H01L27/3251 ,  H01L27/3246 ,  H01L51/56

摘要： An organic electroluminescent device includes first and second substrates facing and spaced apart from each other, the first and second substrates including a pixel region; a gate line on an inner surface of the first substrate; a data line crossing the gate line; a switching thin film transistor connected with the gate line and the data line; a driving thin film transistor connected with the switching thin film transistor; a power line connected with the driving thin film transistor; a first electrode on an inner surface of the second substrate; a first sidewall and a second sidewall on the first electrode at a boundary of the pixel region, the first sidewall and the second sidewall spaced apart from each other; an electroluminescent layer on the first electrode in the pixel region; a second electrode on the electroluminescent layer in the pixel region; and a connection electrode electrically connected to the first and -second substrates.

摘要翻译： 有机电致发光器件包括面对并彼此间隔开的第一和第二衬底，第一和第二衬底包括像素区域; 在第一基板的内表面上的栅极线; 跨越栅极线的数据线; 与栅极线和数据线连接的开关薄膜晶体管; 与开关薄膜晶体管连接的驱动薄膜晶体管; 与驱动薄膜晶体管连接的电源线; 在所述第二基板的内表面上的第一电极; 第一侧壁和第二侧壁在第一电极上在像素区域的边界处，第一侧壁和第二侧壁彼此间隔开; 像素区域中的第一电极上的电致发光层; 像素区域中的电致发光层上的第二电极; 以及电连接到所述第一和第二基板的连接电极。

公开(公告)号：US06689632B2

公开(公告)日：2004-02-10

申请号：US10329427

申请日：2002-12-27

申请人： Kyung-Man Kim ,  Jin-Ook Kim

发明人： Kyung-Man Kim ,  Jin-Ook Kim

IPC分类号： H01L2100

CPC分类号： H01L27/3246 ,  H01L27/3211 ,  H01L27/3283 ,  H01L51/0037 ,  H01L51/5048 ,  H01L51/5088 ,  H01L51/56

摘要： An organic electroluminescence display device includes a substrate including an emission region and a non-emission region, a first electrode on the substrate, a buffer layer on the first electrode, the buffer layer corresponding to the non-emission region, a partition wall on the buffer layer, the partition wall including a polymer, a first carrier transporting layer on the substrate including the partition wall, the first carrier transporting layer having a hydrophilic portion corresponding to the emission region and a hydrophobic portion corresponding to the non-emission region, an emissive layer on the first carrier transporting layer, the emissive layer corresponding to the hydrophilic portion, a second carrier transporting layer on the emissive layer, and a second electrode on the second carrier transporting layer.

公开(公告)号：US20130161788A1

公开(公告)日：2013-06-27

申请号：US13725132

申请日：2012-12-21

申请人： Sung-Hoon Chun ,  Hye-Jin Kim ,  Sang-Ho An ,  Kyung-Man Kim ,  Seok-Chan Lee

发明人： Sung-Hoon Chun ,  Hye-Jin Kim ,  Sang-Ho An ,  Kyung-Man Kim ,  Seok-Chan Lee

IPC分类号： H01L23/50

CPC分类号： H01L23/50 ,  H01L23/5223 ,  H01L23/525 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L28/40 ,  H01L2224/02166 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/06102 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

摘要： Semiconductor packages including stacked semiconductor chips are provided. The semiconductor packages may include first semiconductor chips and a second semiconductor chip that are stacked sequentially on a board. The semiconductor packages may also include a wiring layer on the memory chips and the wiring layer may include redistribution patterns and redistribution pads. Each of the memory chips may include a data pad. The data pads of the first semiconductor chips may be electrically connected to the board via the second semiconductor chip, some of redistribution patterns, and some of redistribution pads.

摘要翻译： 提供包括堆叠半导体芯片的半导体封装。 半导体封装可以包括顺序堆叠在板上的第一半导体芯片和第二半导体芯片。 半导体封装还可以包括存储器芯片上的布线层，并且布线层可以包括再分配图案和再分布垫。 每个存储器芯片可以包括数据焊盘。 第一半导体芯片的数据焊盘可以经由第二半导体芯片电连接到板，一些再分布图案和一些再分布焊盘。

公开(公告)号：US08426956B2

公开(公告)日：2013-04-23

申请号：US12855322

申请日：2010-08-12

申请人： In-Sang Song ,  Hye-Jin Kim ,  Kyung-Man Kim

发明人： In-Sang Song ,  Hye-Jin Kim ,  Kyung-Man Kim

IPC分类号： H01L23/488

CPC分类号： H01L25/105 ,  H01L21/568 ,  H01L23/481 ,  H01L23/49833 ,  H01L25/0657 ,  H01L2224/02377 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/13024 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/9205 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311

摘要： The semiconductor package structure includes first and second packages. The first package has at least one first semiconductor chip disposed on a first printed circuit board, and at least one first pad disposed on the at least one first semiconductor chip. The second package has at least one second pad disposed on the first package, and at least one second semiconductor chip disposed on the at least one second pad. The at least one first semiconductor chip is electrically connected to the first printed circuit board. The at least one second pad is electrically connected to the at least one second semiconductor chip. The at least one second pad faces the at least one first pad.

摘要翻译： 半导体封装结构包括第一和第二封装。 第一封装具有设置在第一印刷电路板上的至少一个第一半导体芯片和设置在至少一个第一半导体芯片上的至少一个第一焊盘。 所述第二封装具有设置在所述第一封装上的至少一个第二焊盘以及设置在所述至少一个第二焊盘上的至少一个第二半导体芯片。 所述至少一个第一半导体芯片电连接到所述第一印刷电路板。 所述至少一个第二焊盘电连接到所述至少一个第二半导体芯片。 所述至少一个第二垫面对所述至少一个第一垫。

公开(公告)号：US08399992B2

公开(公告)日：2013-03-19

申请号：US12872448

申请日：2010-08-31

申请人： Sung-Kyu Park ,  Tae-Sung Park ,  Kyung-Man Kim ,  Hye-Jin Kim

发明人： Sung-Kyu Park ,  Tae-Sung Park ,  Kyung-Man Kim ,  Hye-Jin Kim

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided are a semiconductor package and a method for fabricating the same. The semiconductor package includes a lower package comprising a lower substrate, a lower semiconductor chip mounted on the lower substrate and comprising a redistribution, and a molding layer molding the lower semiconductor chip, an upper package comprising an upper substrate and an upper semiconductor chip mounted on the upper substrate, with the upper package being stacked on the lower package. The semiconductor package further includes an electrical interconnector extending from the upper substrate into the molding layer and connected to the redistribution to electrically connect the upper and lower packages to each other, and a dummy interconnector extending from the upper substrate into the molding layer to physically couple the upper and lower packages to each other.

摘要翻译： 提供半导体封装及其制造方法。 半导体封装包括下封装，其包括下基板，安装在下基板上的下半导体芯片，并且包括再分布，以及模制下半导体芯片的模制层，上封装，包括上基板和上半导体芯片， 上部衬底，其中上部封装堆叠在下部封装上。 所述半导体封装还包括电连接器，所述电互连器从所述上衬底延伸到所述模制层中并且连接到所述重新分配以将所述上部和下部封装彼此电连接;以及虚设互连器，其从所述上衬底延伸到所述模制层中以物理耦合 上下包装彼此。

公开(公告)号：US07843051B2

公开(公告)日：2010-11-30

申请号：US12212566

申请日：2008-09-17

申请人： In-Sang Song ,  In-Ku Kang ,  Kyung-Man Kim

发明人： In-Sang Song ,  In-Ku Kang ,  Kyung-Man Kim

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2924/01087 ,  H01L2924/00014

摘要： Provided are a semiconductor device and a method of fabricating the same, and more particularly, a semiconductor package and a method of fabricating the semiconductor package. The semiconductor package includes a first package that comprises a first substrate, at least one first semiconductor chip stacked on the first substrate, and first conductive pads exposed on a top surface of the first substrate; a second package disposed below the first package such that the second package comprises a second substrate, at least one second semiconductor chip, and second conductive pads exposed on a bottom surface of the second substrate; and a connection unit that extends from the first conductive pads to the second conductive pads such that the connection unit covers a side surface of the first package and a side surface of the second package in order to electrically connect the first package to the second package.

摘要翻译： 提供一种半导体器件及其制造方法，更具体地，涉及一种半导体封装以及半导体封装的制造方法。 半导体封装包括第一封装，其包括第一衬底，堆叠在第一衬底上的至少一个第一半导体芯片和暴露在第一衬底的顶表面上的第一导电焊盘; 设置在所述第一封装下方的第二封装，使得所述第二封装包括第二衬底，至少一个第二半导体芯片和暴露在所述第二衬底的底表面上的第二导电焊盘; 以及连接单元，其从所述第一导电焊盘延伸到所述第二导电焊盘，使得所述连接单元覆盖所述第一封装的侧表面和所述第二封装的侧表面，以将所述第一封装电连接到所述第二封装。