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    Wafer transport assembly with integrated buffers
    11.
    发明授权
    Wafer transport assembly with integrated buffers 有权

    公开(公告)号：US10790174B2

    公开(公告)日：2020-09-29

    申请号：US15951333

    申请日：2018-04-12

    Applicant: LAM RESEARCH CORPORATION

    Inventor： John Daugherty ,  David Trussell ,  Michael Kellogg ,  Christopher Pena ,  Richard H. Gould ,  Klay Kunkel

    IPC: H01L21/67

    Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

    Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
    13.
    发明申请
    Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ 审中-公开

    公开(公告)号：US20170115657A1

    公开(公告)日：2017-04-27

    申请号：US14920090

    申请日：2015-10-22

    Applicant: Lam Research Corporation

    Inventor： David D. Trussell ,  Alan J. Miller ,  John Daugherty ,  Alex Paterson

    IPC: G05B19/418

    CPC classification number: G05B19/418 ,  G05B19/41875 ,  G05B2219/32212 ,  G05B2219/45031 ,  G05B2219/50291 ,  H01L21/67167 ,  H01L21/6719 ,  Y02P90/22

    Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module. The lift mechanism is configured to receive the consumable part provided for replacement by the exchange handler and lower the consumable part to an installed position. The replacement by the exchange handler and the process module is conducted while the process module and the replacement station are maintained in a vacuum state.

    Load lock interface and integrated post-processing module
    19.
    发明授权
    Load lock interface and integrated post-processing module 有权

    公开(公告)号：US10304707B2

    公开(公告)日：2019-05-28

    申请号：US14887959

    申请日：2015-10-20

    Applicant: Lam Research Corporation

    Inventor： David Trussell ,  Richard Gould ,  John Daugherty

    IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

    Abstract: A load lock assembly includes a first load lock connected between an equipment front end module (EFEM) and a wafer transport module, the EFEM being at a lab ambient condition, the wafer transport module being at a vacuum condition, the wafer transport module being part of a wafer transport assembly that is configured to transport wafers to and from one or more process modules that are connected to the wafer transport assembly; a second load lock disposed over the first load lock, the second load lock connected between the EFEM and the wafer transport module; a post-processing module disposed over the second load lock, the post-processing module configured for performing a post-processing operation on a processed wafer that has been processed in at least one of the process modules that are connected to the wafer transport assembly, the post-processing module being configured for connection to the wafer transport module.

    System Implementing Machine Learning in Complex Multivariate Wafer Processing Equipment
    20.
    发明申请
    System Implementing Machine Learning in Complex Multivariate Wafer Processing Equipment 审中-公开

    公开(公告)号：US20180247798A1

    公开(公告)日：2018-08-30

    申请号：US15967541

    申请日：2018-04-30

    Applicant: Lam Research Corporation

    Inventor： Joydeep Guha ,  John Daugherty ,  Vahid Vahedi ,  Richard Alan Gottscho

    IPC: H01J37/32 ,  H01L21/67 ,  H01L21/3065

    CPC classification number: H01J37/32935 ,  B81C2201/0138 ,  H01J37/32082 ,  H01J37/32926 ,  H01J2237/334 ,  H01L21/3065 ,  H01L21/67069 ,  H01L21/67242 ,  H01L21/67248 ,  H01L21/67253

    Abstract: A system for controlling processing state of a plasma process is provided. One example system includes a plasma reactor having a plurality of tuning knobs for making settings to operational conditions of the plasma reactor. A plurality of sensors of the plasma reactor is included, where each of the plurality of sensors is configured to produce a data stream of information during operation of the plasma reactor for carrying out the plasma process. A controller of the plasma reactor is configured to execute a multivariate processing that is configured to use as input desired processing state values that define intended measurable conditions within a processing environment of the plasma reactor and identify current plasma processing values. The multivariate processing uses a machine learning engine that receives as inputs the desired processing state values and data streams from the plurality of sensors during processing of the plasma process. The machine learning engine is configured to identify current processing state values used to produce a compensation vector, such that the compensation vector defines differences between the desired process state values and the current processing state values. The controller is further configured to execute a compensation processing operation that transforms the compensation vector expressed in terms of measured conditions within the processing environment to changes of specific one or more of the tuning knobs of the plasma reactor.

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