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公开(公告)号:US20190172981A1
公开(公告)日:2019-06-06
申请号:US16269935
申请日:2019-02-07
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG
IPC: H01L33/48 , H01L33/32 , H01L33/62 , H01L33/56 , H01L33/54 , F21V8/00 , H01L33/30 , H01L33/60 , H01L33/50
CPC classification number: H01L33/486 , G02B6/0031 , G02B6/0073 , H01L33/30 , H01L33/32 , H01L33/483 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
Abstract: Embodiments of a light emitting device and a method for fabricating the same are provided. The light emitting device comprises a cavity and one or more light emitting elements. The cavity is formed to a depth of 450 μm or less, and the light emitting elements are installed in the cavity. A fabricating method includes forming a package body having a cavity with a depth of 250 μm to 450 μm and at least one lead frame disposed at the bottom surface of the cavity, mounting at least one light emitting element on the lead frame, and molding a molding member in the cavity.
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公开(公告)号:US20180102462A1
公开(公告)日:2018-04-12
申请号:US15840967
申请日:2017-12-13
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG
IPC: H01L33/48 , F21V8/00 , H01L33/54 , H01L33/50 , H01L33/56 , H01L33/32 , H01L33/30 , H01L33/60 , H01L33/62
CPC classification number: H01L33/486 , G02B6/0031 , G02B6/0073 , H01L33/30 , H01L33/32 , H01L33/483 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
Abstract: Embodiments of a light emitting device and a method for fabricating the same are provided. The light emitting device comprises a cavity and one or more light emitting elements. The cavity is formed to a depth of 450 μm or less, and the light emitting elements are installed in the cavity. A fabricating method includes forming a package body having a cavity with a depth of 250 μm to 450 μm and at least one lead frame disposed at the bottom surface of the cavity, mounting at least one light emitting element on the lead frame, and molding a molding member in the cavity.
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公开(公告)号:US20170317248A1
公开(公告)日:2017-11-02
申请号:US15581464
申请日:2017-04-28
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG
CPC classification number: H01L33/56 , H01L25/0753 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/58 , H01L33/62
Abstract: Embodiments of the present invention relate to a light emitting device package having uniform color characteristics, wherein the light emitting device package includes: a substrate including first and second lead frames; at least two light emitting devices disposed on the substrate and electrically connected to the first and second lead frames; an integrated wavelength conversion film disposed on the at least two light emitting devices and including a first region which overlaps the light emitting devices and a second region other than the first region; at least one recess which passes through the wavelength conversion film in a region corresponding to a gap between the adjacent light emitting devices; and a lens disposed on the substrate to cover the light emitting devices and the first and second lead frames.
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14.
公开(公告)号:US20130049057A1
公开(公告)日:2013-02-28
申请号:US13662508
申请日:2012-10-28
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
IPC: H01L33/60
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.
Abstract translation: 公开了一种LED封装。 LED封装包括封装主体,封装主体上的第一框架和第二框架以及第一框架上的发光器件芯片。 第一框架与第二框架分离,并且第一框架包括封装主体上的底部框架和从底部框架延伸并相对于底部框架倾斜的至少两个侧壁框架。
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公开(公告)号:US20210175392A1
公开(公告)日:2021-06-10
申请号:US16770910
申请日:2018-12-06
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Ki Seok KIM , Young Shin KIM
Abstract: The light emitting device package disclosed in an embodiment of the invention includes first and second frames; a body disposed between the first and second frames; and a light emitting device disposed on the first and second frames, wherein the first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and facing the first end portion, wherein the first end portion includes a first protruding portion protruding toward the second frame, and the second end portion includes a second protruding portion protruding toward the first frame. The light emitting device may include a first bonding portion disposed on the first protruding portion and a second bonding portion disposed on the second protruding portion.
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公开(公告)号:US20210066552A1
公开(公告)日:2021-03-04
申请号:US16958043
申请日:2018-12-18
Applicant: LG INNOTEK CO., LTD.
Inventor: Young Shin KIM , Soon Yong KANG , Sung Min KONG , Ju Hyeon OH
Abstract: The light emitting device package disclosed in the embodiment of the invention includes first and second frames; a body disposed between the first and second frames; and a light emitting devices disposed on the first and second frames. The first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and facing the first end portion, the first end portion includes a first protrusion protruding toward the second frame, and the second end portion includes a second protrusion protruding toward the first frame. The light emitting device includes first and second bonding portions disposed on the first and second protrusions. The body includes first and second reflective portions extending toward both sides of the first protrusion toward the first frame, and third and fourth reflective portions extending toward both sides of the second protrusion toward the second frame. The light emitting device may overlap the first to fourth reflective portions in a vertical direction.
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公开(公告)号:US20200279982A1
公开(公告)日:2020-09-03
申请号:US16646660
申请日:2018-09-12
Applicant: LG INNOTEK CO., LTD.
Inventor: Chang Man LIM , June O SONG , Sung Min KONG , Ki Seok KIM
Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device disposed on the first and second frames; a first resin disposed between the body and the light emitting device, wherein each of the first and second frames includes a through hole, the through hole overlaps the light emitting device in a vertical direction, and the body includes a recess recessed toward a lower surface of the body between the first and second frames, and the recess overlaps the light emitting device in the vertical direction, the first resin is disposed in the recess, and a length of the recess is smaller than a width of the light emitting device.
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公开(公告)号:US20170104142A1
公开(公告)日:2017-04-13
申请号:US15382553
申请日:2016-12-16
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: A light emitting device package including a package body including a recess which is provided with a bottom face and a plurality of inner walls surrounding the bottom face, the plurality of inner walls including a first inner wall and a second inner wall, which are opposing walls; a lead frame including a first portion disposed on the bottom face of the package body and at least one second portion extending from the first portion, the first portion including a planar upper surface exposed at the bottom face and a planar lowermost surface positioned opposite to the planar upper surface; a light emitting element provided on the planar upper surface of the first portion; and a transparent material provided in the recess of the package body to cover the light emitting element. The at least one second portion includes an upper surface exposed at the first inner walls and a lower surface opposite to the upper surface; the lower surface of the at least one second portion includes a lower curved surface; the planar lowermost surface of the first portion is positioned lower than the lower curved surface of the at least one second portion; a stepped portion is positioned between the lower curved surface of the at least one second portion and the lowermost surface of the first portion; and the stepped portion contacts the package body.
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公开(公告)号:US20170104136A1
公开(公告)日:2017-04-13
申请号:US15385355
申请日:2016-12-20
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG
IPC: H01L33/48 , H01L33/60 , H01L33/30 , F21V8/00 , H01L33/56 , H01L33/50 , H01L33/54 , H01L33/62 , H01L33/32
CPC classification number: H01L33/486 , G02B6/0031 , G02B6/0073 , H01L33/30 , H01L33/32 , H01L33/483 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
Abstract: Embodiments of a light emitting device and a method for fabricating the same are provided. The light emitting device comprises a cavity and one or more light emitting elements. The cavity is formed to a depth of 450 μm or less, and the light emitting elements are installed in the cavity. A fabricating method includes forming a package body having a cavity with a depth of 250 μm to 450 μm and at least one lead frame disposed at the bottom surface of the cavity, mounting at least one light emitting element on the lead frame, and molding a molding member in the cavity.
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20.
公开(公告)号:US20130334554A1
公开(公告)日:2013-12-19
申请号:US13937899
申请日:2013-07-09
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG
IPC: H01L33/48
CPC classification number: H01L33/486 , G02B6/0031 , G02B6/0073 , H01L33/30 , H01L33/32 , H01L33/483 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
Abstract: Embodiments of a light emitting device and a method for fabricating the same are provided. The light emitting device comprises a cavity and one or more light emitting elements. The cavity is formed to a depth of 450 μm or less, and the light emitting elements are installed in the cavity. A fabricating method includes forming a package body having a cavity with a depth of 250 μm to 450 μm and at least one lead frame disposed at the bottom surface of the cavity, mounting at least one light emitting element on the lead frame, and molding a molding member in the cavity.
Abstract translation: 提供了发光器件及其制造方法的实施例。 发光器件包括空腔和一个或多个发光元件。 空腔形成为450μm以下的深度,发光元件安装在空腔中。 一种制造方法包括形成具有深度为250μm至450μm的空腔的封装主体和设置在所述腔的底表面处的至少一个引线框架,将至少一个发光元件安装在引线框架上,并且模制 模腔中的成型件。
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