公开(公告)号：US11420255B2

公开(公告)日：2022-08-23

申请号：US16645916

申请日：2018-09-03

Applicant: LINTEC CORPORATION

Inventor： Isao Ichikawa ,  Hidekazu Nakayama

IPC: B22F7/04 ,  B22F7/08 ,  B32B7/12 ,  B32B27/18 ,  H01L23/00

Abstract: A film-shaped firing material 1 is provided, including sinterable metal particles 10 and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a shrinkage factor in a planar direction of the film-shaped firing material after being pressurized and fired under conditions of a temperature of 350° C. and a pressure of 10 MPa for 3 minutes is 10% or less with respect to the shrinkage factor before the firing, and a volume shrinkage factor thereof is in a range of 15% to 90% with respect to the volume shrinkage factor before the firing, and a contact ratio of the film-shaped firing material with an adherend after being pressurized and fired under conditions of a temperature of 350° C. and a pressure of 10 MPa for 3 minutes in a state in which the film-shaped firing material is in contact with the adherend is 90% or greater with respect to a contact area of the adherend.

公开(公告)号：US10131824B2

公开(公告)日：2018-11-20

申请号：US14906284

申请日：2014-08-01

Applicant: Lintec Corporation

Inventor： Sayaka Tsuchiyama ,  Isao Ichikawa

IPC: C09J133/00 ,  C09J163/00 ,  C09J175/04 ,  H01L21/683 ,  C09J133/06 ,  H01L23/00 ,  C08G18/80 ,  C08L33/06 ,  C09J7/22 ,  C09J7/30 ,  C08F220/20

Abstract: An adhesive composition includes an acrylic polymer (A) having a weight-average molecular weight (Mw) of 350,000 or higher obtained by polymerizing an acrylic monomer by living radical polymerization using an organotellurium-containing compound as the polymerization initiator, an epoxy thermosetting resin (B), and a thermosetting agent (C). The adhesive composition is capable of joining with sufficient adhesive strength and capable of achieving high package reliability in a semiconductor device.

公开(公告)号：US11219946B2

公开(公告)日：2022-01-11

申请号：US16650225

申请日：2018-09-28

Applicant: LINTEC Corporation

Inventor： Takeshi Mori ,  Hidekazu Nakayama ,  Isao Ichikawa ,  Yukiharu Nose

IPC: B22F1/00 ,  H01B1/22 ,  H01L21/52 ,  B22F7/08 ,  H01R11/01 ,  H01B1/02

Abstract: The present invention provides a film-shaped firing composition with excellent printability, a method of producing a film-shaped firing material obtained by using the firing material composition, and a method of producing a film-shaped firing material with a support sheet. A paste-like firing material composition is provided, including sinterable metal particles (10), a binder component (20), and a solvent having a relative evaporation rate of 4.0 or less with respect to butyl acetate, in which a content of the solvent is in a range of 12% to 50% by mass with respect to a total mass of the firing material composition.

公开(公告)号：US09434865B2

公开(公告)日：2016-09-06

申请号：US13832170

申请日：2013-03-15

Applicant: LINTEC Corporation

Inventor： Sayaka Tsuchiyama ,  Isao Ichikawa

IPC: C09J5/00 ,  C09J7/02 ,  C09J133/08 ,  C09J133/10 ,  C09J133/12 ,  C09J133/14 ,  C09J133/24 ,  H01L21/78 ,  H01L21/58 ,  C09J133/00 ,  H01L21/683 ,  C09J133/06 ,  C09J143/04 ,  H01L23/00 ,  H01L25/00 ,  H01L23/29 ,  H01L25/065

CPC classification number: C09J133/00 ,  C09J5/00 ,  C09J7/35 ,  C09J133/06 ,  C09J133/066 ,  C09J133/14 ,  C09J133/24 ,  C09J143/04 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/83 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/2826 ,  H01L2224/27 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有不饱和烃基的热固性树脂（B）和具有双键基团的反应性的偶联剂（C）。

公开(公告)号：US20150225613A1

公开(公告)日：2015-08-13

申请号：US14418661

申请日：2013-08-02

Applicant: LINTEC Corporation

Inventor： Yoji Wakayama ,  Isao Ichikawa ,  Takashi Akutsu

IPC: C09J7/02 ,  C09J163/00 ,  C09J133/00 ,  H01L21/78 ,  H01L23/00

CPC classification number: C09J7/0235 ,  C08F220/18 ,  C08G18/10 ,  C08G18/755 ,  C08G18/8029 ,  C08K5/5419 ,  C08L33/068 ,  C08L61/00 ,  C08L63/04 ,  C09J7/22 ,  C09J7/30 ,  C09J7/405 ,  C09J133/00 ,  C09J133/068 ,  C09J133/14 ,  C09J163/00 ,  C09J175/16 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68336 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32221 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73104 ,  H01L2224/8113 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/069 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10T428/1405 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L21/463 ,  H01L2221/68381 ,  H01L2924/00 ,  C08F2220/1825 ,  C08F2220/325 ,  C08F220/20 ,  C08F220/14 ,  C08G18/672 ,  C08G18/4825 ,  C08F2220/1858

Abstract: A film is obtained by forming a film of and curing an energy ray-curable composition including a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25° C. of 100-5,000,000 mPa·S.

Abstract translation: 通过形成含有可聚合硅氧烷化合物的能量射线固化性组合物和在25℃下的粘度为100-5,000,000mPa·S的能量射线固化性树脂的膜而得到膜。

公开(公告)号：US20130244402A1

公开(公告)日：2013-09-19

申请号：US13832210

申请日：2013-03-15

Applicant: LINTEC CORPORATION

Inventor： Sayaka Tsuchiyama ,  Isao Ichikawa

IPC: C09J133/00 ,  H01L21/683 ,  H01L21/78

CPC classification number: C09J133/00 ,  B32B17/10697 ,  B32B17/10733 ,  B32B17/10743 ,  C09J133/066 ,  C09J133/08 ,  C09J133/10 ,  C09J163/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/83 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/2826 ,  H01L2224/27 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a filler (C) having reactive double bond on a surface.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有不饱和烃基的热固性树脂（B）和表面具有反应性双键的填料（C）。