Abstract:
A nonvolatile memory array has a multiple erase procedures of different durations. A block of memory cells of the array can be erased by one of the different erase procedures.
Abstract:
An integrated circuit memory device includes an array of non-volatile, charge trapping memory cells, configured to store data values in memory cells in the array using threshold states, including a higher threshold state characterized by a minimum threshold exceeding a selected read bias. A controller includes a stand-by mode, a write mode and a read mode. Retention check logic executes on power-up, or during the stand-by mode, to identify memory cells in the higher threshold state which fail a threshold retention check. Also, logic is provided to reprogram the identified memory cells.
Abstract:
In the disclosed technology, the device identification code of a memory integrated circuit is changeable. In some cases, multiple device identification codes are stored on the memory integrated circuit, and multiple device identification code selection data are stored on the memory integrated circuit. A device identification code register can store a selected device identification code.
Abstract:
A read operation for a memory device is provided. A selected word line, first and second global bit line groups and a selected first bit line group are precharged. A first cell current flowing through the selected word line, the first and the selected first bit line groups is generated. A first reference current flowing through the second global bit line group is generated. A first half page data is read based on the first cell current and the first reference current. The selected word line, the first and the second global bit line groups are kept precharged.
Abstract:
Techniques are described herein for detecting and recovering over-erased memory cells in a flash memory device. In one embodiment, a flash memory device includes a memory array including a plurality of blocks of memory cells. The device also includes a command interface to receive a command from a source external to the memory device. The device also includes a controller including logic to perform a leakage-suppression process in response to the command. The leakage-suppression process includes performing a soft program operation to increase a threshold voltage of one or more over-erased memory cells in a given block of memory cells and establish an erased state.
Abstract:
A memory device, such as a 3D AND flash memory, includes a memory cell block, a word line driver, and a plurality of bit line switches. The word line driver has a plurality of complementary transistor pairs for respectively generating a plurality of word line signals for a plurality of word lines. Substrates of a first transistor and a second transistor of each of the complementary transistor pairs respectively receive a first voltage and a second voltage. Each of the bit line switches includes a third transistor. A substrate of the third transistor receives a third voltage. The first voltage, the second voltage, and the third voltage are constant static voltages during a soft program operation and a soft program verify operation.
Abstract:
A memory device and an associated control method are provided. The memory device includes a non-volatile memory array and a memory control circuit. The non-volatile memory array includes M secured memory zones. The memory control circuit is electrically connected to the non-volatile memory array. The memory control circuit provides a set of mapping information and searches a request key in the set of mapping information. The set of mapping information represents correspondences between N access keys and the M secured memory zones. The memory control circuit acquires at least one of the M secured memory zones if the request key is one of the N access keys, and performs an access command to the at least one of the M secured memory zones. M and N are positive integers.
Abstract:
A three dimension memory device, such as an AND-type memory, includes a memory cell tile, multiple source line switches, multiple first bit line switches to fourth bit line switches. The memory cell tile is divided into a first and a second memory cell sub-tiles. The first bit line switches are respectively coupled to multiple first bit lines of a first part of the first memory cell sub-tile. The second bit line switches are respectively coupled to multiple second bit lines of a second part of the first memory cell sub-tile. The third bit line switches are respectively coupled to multiple third bit lines of a first part of the second memory cell sub-tile. The fourth bit line switches are respectively coupled to multiple fourth bit lines of a second part of the second memory cell sub-tile.
Abstract:
A system and method use a physical unclonable function in a PUF circuit on an integrated circuit to generate a security key, and stabilize the security key by storage in a set of nonvolatile memory cells. The stabilized security key is moved from the set of nonvolatile memory cells to a cache memory, and utilized as stored in the cache memory in a security protocol. Also, data transfer from the PUF circuit to the set of nonvolatile memory cells can be disabled after using the PUF circuit to produce the security key, at a safe time, such as after the security key has been moved from the set of nonvolatile memory cells to the cache memory.
Abstract:
A memory device comprises a memory array with I/O path and security circuitry coupled to the I/O path of the memory array. The memory device comprises control circuitry, responsive to configuration data, to invoke the security circuitry. The memory device comprises a configuration store, storing the configuration data accessible by the control circuitry to specify location and size of a security memory region in the memory array. Responsive to an external command and the configuration data, the control circuitry can be configured to invoke the security circuitry on an operation specified in the external command in response to accesses into the security memory region, or to not invoke the security circuitry in response to accesses to outside the security memory region.