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    Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
    11.
    发明授权
    Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices 失效
    叠层型半导体器件用载体及叠层型半导体器件的制造方法

    公开(公告)号：US07414305B2

    公开(公告)日：2008-08-19

    申请号：US11341984

    申请日：2006-01-27

    申请人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

    发明人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

    IPC分类号： H01L23/02

    CPC分类号： H01L21/6835 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06593 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    摘要： A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.

    摘要翻译： 叠层型半导体器件的载体包括用于容纳堆叠的半导体器件的容纳部分，引导堆叠的半导体器件的引导部分和流体可以通过该沟槽流动到容纳部分和堆叠的半导体器件的侧面的沟槽。 这些凹槽有助于容纳部分侧面上的气体或液体的流动，因此预期在清洗过程中回流过程中的热风和清洗液体的流动可以被方便。 这提高了产量和清洁效果。 用于将容纳部分连接到外部的孔可以设置在容纳部分的角部。 气体可以从容纳部分的下侧引导，使得可以有效地将热量施加到半导体器件，并且可以减少它们之间的接合故障。 此外，可以设置连接相邻孔的槽，用于容纳彼此相邻的部分。

    CARRIER FOR STACKED TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING STACKED TYPE SEMICONDUCTOR DEVICES
    19.
    发明申请
    CARRIER FOR STACKED TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING STACKED TYPE SEMICONDUCTOR DEVICES 有权
    用于堆叠型半导体器件的载体和制造堆叠型半导体器件的方法

    公开(公告)号：US20080274591A1

    公开(公告)日：2008-11-06

    申请号：US12166293

    申请日：2008-07-01

    申请人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

    发明人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

    IPC分类号： H01L21/60

    CPC分类号： H01L21/6835 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06593 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    摘要： A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.

    摘要翻译： 叠层型半导体器件的载体包括用于容纳堆叠的半导体器件的容纳部分，引导堆叠的半导体器件的引导部分和流体可以通过该沟槽流动到容纳部分和堆叠的半导体器件的侧面的沟槽。 这些凹槽有助于容纳部分侧面上的气体或液体的流动，因此预期在清洗过程中回流过程中的热风和清洗液体的流动可以被方便。 这提高了产量和清洁效果。 用于将容纳部分连接到外部的孔可以设置在容纳部分的角部。 气体可以从容纳部分的下侧引导，使得可以有效地将热量施加到半导体器件，并且可以减少它们之间的接合故障。 此外，可以设置连接相邻孔的槽，用于容纳彼此相邻的部分。

    Ic Carrier, Ic Socket and Method for Testing Ic Device
    20.
    发明申请
    Ic Carrier, Ic Socket and Method for Testing Ic Device 有权
    Ic载体，Ic插座和Ic器件测试方法

    公开(公告)号：US20080191723A1

    公开(公告)日：2008-08-14

    申请号：US11886139

    申请日：2005-03-11

    申请人： Eichi Osato ,  Junichi Kasai ,  Kouichi Meguro ,  Masanori Onodera

    发明人： Eichi Osato ,  Junichi Kasai ,  Kouichi Meguro ,  Masanori Onodera

    IPC分类号： G01R31/02 ,  H05K7/00

    CPC分类号： G01R1/0483 ,  G01R1/0466

    摘要： An IC device (10) held on an IC carrier (24) is a double-sided electrode type BGA IC device (10) provided with bump electrodes (14) on a first surface of a package. The IC device has, on a second surface opposite the first surface, (a) a central protrusion (30), (b) a peripheral portion (32) lower than the protrusion by one step, and (c) upper electrodes (18) formed on the peripheral portion of the IC device. The IC carrier is provided with a frame (36), a cover (40), and a holding means (42). The frame forms a device reception space (38) for receiving the IC device. The cover can cover the upper electrodes while in contact with the periphery of the IC device held on the IC carrier. The holding means can hold the IC device on the IC carrier with the cover covering the upper electrodes of the IC device. The IC device can be set in an IC socket while being mounted on the IC carrier.

    摘要翻译： 保持在IC载体（24）上的IC器件（10）是在封装的第一表面上设置有凸块电极（14）的双面电极型BGA IC器件（10）。 IC器件在与第一表面相对的第二表面上具有（a）中心突起（30），（b）比突起低一级的周边部分（32），（c）上电极（18） 形成在IC器件的周边部分上。 IC载体设有框架（36），盖（40）和保持装置（42）。 该帧形成用于接收IC设备的设备接收空间（38）。 盖可以覆盖上电极，同时与保持在IC载体上的IC器件的周边接触。 保持装置可以将IC器件保持在IC载体上，盖子覆盖IC器件的上部电极。 该IC器件可以安装在IC载体上而设置在IC插座中。