公开(公告)号：US20060175419A1

公开(公告)日：2006-08-10

申请号：US11341892

申请日：2006-01-30

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： G06K19/06

CPC分类号： H01L21/568 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07747 ,  H01L21/561 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

公开(公告)号：US20050087851A1

公开(公告)日：2005-04-28

申请号：US10928458

申请日：2004-08-27

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/02

CPC分类号： H01L24/82 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/96 ,  H01L2224/82

摘要： The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, an overall top side, there being arranged on the latter a rewiring layer with plug contact areas and rewiring lines that connect the plug contact areas to contact areas of the top side of the semiconductor chip.

摘要翻译： 本发明涉及一种具有插头触点的电子模块，其具有嵌入塑料组合物中的半导体芯片，其后侧及其边缘侧。 半导体芯片的有源顶侧与塑料组合物一起形成整个顶侧，其上布置有具有插头接触区域的重新布线层和将插头接触区域连接到顶侧的接触区域的重新布线 的半导体芯片。

公开(公告)号：US07524699B2

公开(公告)日：2009-04-28

申请号：US10529565

申请日：2004-07-08

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/065 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/00012

摘要： One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

摘要翻译： 本发明的一个实施例涉及具有堆叠的半导体芯片的电子部件和用于生产部件的面板。 在一种情况下，堆叠具有平坦的导体结构，其中布置有堆叠半导体芯片的芯片岛，而第一半导体芯片位于其下方。 芯片岛由具有接触柱的扁平导体包围。 这些接触柱具有支柱接触垫，其与第一半导体芯片的有源上表面和塑料封装化合物的上表面区域一起形成共面的整个上表面。

公开(公告)号：US20060125042A1

公开(公告)日：2006-06-15

申请号：US10529565

申请日：2004-07-08

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L29/00

CPC分类号： H01L23/3128 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/065 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/00012

摘要： One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

摘要翻译： 本发明的一个实施例涉及具有堆叠的半导体芯片的电子部件和用于生产部件的面板。 在一种情况下，堆叠具有平坦的导体结构，其中布置有堆叠半导体芯片的芯片岛，而第一半导体芯片位于其下方。 芯片岛由具有接触柱的扁平导体包围。 这些接触柱具有支柱接触垫，其与第一半导体芯片的有源上表面和塑料封装化合物的上表面区域一起形成共面的整个上表面。

公开(公告)号：US07575173B2

公开(公告)日：2009-08-18

申请号：US11341892

申请日：2006-01-30

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： G06K19/00

CPC分类号： H01L21/568 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07747 ,  H01L21/561 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

摘要翻译： 用于联系数据传输的智能卡包括安装在卡体内的卡体和智能卡模块。 智能卡模块包括具有有源上表面的半导体芯片，围绕半导体芯片的塑料壳体化合物，并且包括至少一个与半导体芯片的有源上表面共面的表面;第一介电层，其布置在 塑料外壳复合表面和半导体芯片的有源上表面上，一个或多个中介层金属化层，其通过另外的电介质层隔离并连接到半导体芯片的有源上表面和外部接触表面。 外部接触表面形成在最外侧的插入层上，便于接触数据传输。 智能卡模块不使用接合线，体积非常小。

公开(公告)号：US20070128754A1

公开(公告)日：2007-06-07

申请号：US10561819

申请日：2004-06-04

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L21/00 ,  H01L29/82

CPC分类号： H04N5/2253 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0411 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01032 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H04N5/2254 ,  H04N5/2257

摘要： A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

摘要翻译： 公开了用于生产传感器部件和面板。 除了具有传感器区域的传感器芯片之外，传感器部件还具有后侧和无源部件。 它们共同地嵌入塑料组合物中，使得它们各自的电极可以从塑料板的整个顶侧布线。

公开(公告)号：US20080284043A1

公开(公告)日：2008-11-20

申请号：US10598483

申请日：2005-02-23

申请人： Robert-Christian Hagen ,  Jens Pohl

发明人： Robert-Christian Hagen ,  Jens Pohl

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A base semiconductor component for a semiconductor component stack is disclosed. In one embodiment, the base semiconductor component has a semiconductor chip arranged centrally on a stiff wiring substrate. The wiring substrate has, in its edge regions, contact pads which are electrically connected to external contacts and at the same time to contact areas of the semiconductor chip and also to stack contact areas. The stack contact areas simultaneously form the upper side of the base semiconductor component and have an arrangement pattern corresponding to an arrangement pattern of external contacts of a semiconductor component to be stacked.

摘要翻译： 公开了一种用于半导体部件堆叠的基底半导体部件。 在一个实施例中，基底半导体部件具有中央布置在刚性布线基板上的半导体芯片。 布线基板在其边缘区域中具有电连接到外部触点并且同时接触半导体芯片的区域并且还与堆叠接触区域的接触焊盘。 堆叠接触区域同时形成基底半导体部件的上侧，并且具有对应于待堆叠的半导体部件的外部触头的布置图案的布置图案。

公开(公告)号：US07755178B2

公开(公告)日：2010-07-13

申请号：US10598483

申请日：2005-02-23

申请人： Robert-Christian Hagen ,  Jens Pohl

发明人： Robert-Christian Hagen ,  Jens Pohl

IPC分类号： H01L23/498

CPC分类号： H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A base semiconductor component for a semiconductor component stack is disclosed. In one embodiment, the base semiconductor component has a semiconductor chip arranged centrally on a stiff wiring substrate. The wiring substrate has, in its edge regions, contact pads which are electrically connected to external contacts and at the same time to contact areas of the semiconductor chip and also to stack contact areas. The stack contact areas simultaneously form the upper side of the base semiconductor component and have an arrangement pattern corresponding to an arrangement pattern of external contacts of a semiconductor component to be stacked.

摘要翻译： 公开了一种用于半导体部件堆叠的基底半导体部件。 在一个实施例中，基底半导体部件具有中央布置在刚性布线基板上的半导体芯片。 布线基板在其边缘区域中具有电连接到外部触点并且同时接触半导体芯片的区域并且还与堆叠接触区域的接触焊盘。 堆叠接触区域同时形成基底半导体部件的上侧，并且具有对应于待堆叠的半导体部件的外部触头的布置图案的布置图案。

公开(公告)号：US07514273B2

公开(公告)日：2009-04-07

申请号：US10566454

申请日：2004-06-28

申请人： Harry Hedler ,  Jens Pohl ,  Holger Woerner

发明人： Harry Hedler ,  Jens Pohl ,  Holger Woerner

IPC分类号： H01L21/20

CPC分类号： H01L24/19 ,  H01L22/12 ,  H01L22/20 ,  H01L23/5389 ,  H01L24/25 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01004 ,  H01L2924/0101 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/12044 ,  H01L2924/15173

摘要： The invention relates to a method for applying rewiring to a panel. For this purpose, a panel is provided which has a coplanar overall upper side of an upper side of a plastic compound and the upper sides of semiconductor chips. The method provides a rewiring layer with implementation of external contacts and rewiring lines which, by means of a two-stage exposure step, compensates for position errors of the semiconductor chips in the component positions of the panel.

摘要翻译： 本发明涉及一种将布线应用于面板的方法。 为此，提供了具有塑料化合物的上侧的整体上侧的共面和半导体芯片的上侧的面板。 该方法提供了具有外部触点和重新布线的实现的重新布线层，其通过两级曝光步骤补偿面板的部件位置中的半导体芯片的位置误差。

公开(公告)号：US08330273B2

公开(公告)日：2012-12-11

申请号：US12904628

申请日：2010-10-14

申请人： Markus Brunnbauer ,  Jens Pohl ,  Rainer Steiner

发明人： Markus Brunnbauer ,  Jens Pohl ,  Rainer Steiner

IPC分类号： H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05099

摘要： A semiconductor device and method is disclosed. In one embodiment, the method includes placing a first semiconductor over an electrically conductive carrier. The first semiconductor is covered with a molding compound. A through hole is formed in the molding compound. A first material is deposited in the through hole.

摘要翻译： 公开了半导体器件和方法。 在一个实施例中，该方法包括将第一半导体放置在导电载体上。 第一半导体被模塑料覆盖。 在模塑料中形成通孔。 第一种材料沉积在通孔中。