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公开(公告)号：US11322664B2
公开(公告)日：2022-05-03
申请号：US17119570
申请日：2020-12-11
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi
Abstract: A method of manufacturing a light emitting device includes: providing a light emitting element including a light extraction surface, an electrode-formed surface on a side opposite to the light extraction surface, lateral surfaces positioned between the light extraction surface and the electrode-formed surface, and a pair of electrodes on the electrode-formed surface; providing a covering member including a lens portion and a first recess on a side different from the lens portion; disposing the light emitting element on a bottom surface of the first recess, with the light extraction surface and the bottom surface of the first recess facing each other; and forming a reflective member in the first recess to cover the lateral surfaces of the light emitting element while at least a part of the pair of electrodes is exposed from the reflective member.
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公开(公告)号：US11269215B2
公开(公告)日：2022-03-08
申请号：US17091061
申请日：2020-11-06
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi
IPC: F21V9/00 , G02F1/13357 , H01L25/075 , F21V9/08 , G09G3/36 , H01L33/50 , H01L33/60 , H01L33/62 , G02F1/1335
Abstract: A light emitting module with a reduced thickness is provided.
A method of manufacturing a light emitting module sequentially includes: providing a light guiding plate having a first main surface being a light emitting surface, and a second main surface on the side opposite to the first main surface; providing a plurality of light emitting elements on the light guiding plate; and forming a wiring electrically connecting the plurality of light emitting elements. A light emitting module includes: a light guiding plate having a first main surface and a second main surface; a plurality of wavelength conversion parts disposed at the second main surface of the light guiding plate so as to be spaced apart from each other; a plurality of light emitting elements respectively bonded to the plurality of wavelength conversion parts; and a wiring connected to the plurality of light emitting elements.-
公开(公告)号：US10811560B2
公开(公告)日：2020-10-20
申请号：US16742315
申请日：2020-01-14
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi
Abstract: A method for manufacturing a light-emitting device includes: providing a light-transmissive member comprising: a base portion, and a projecting portion on a first surface side of the base portion; providing a light-emitting element that has a main emitting surface and an electrode formation surface opposite to the main emitting surface; disposing the light-emitting element on the projecting portion of the light-transmissive member such that the main emitting surface of the light-emitting element faces an upper surface of the projecting portion of the light-transmissive member; and forming a light-reflective member that covers at least one of (i) lateral surfaces of the light-emitting element, and/or (ii) lateral surfaces of the projecting portion of the light-transmissive member.
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公开(公告)号：US10580932B2
公开(公告)日：2020-03-03
申请号：US15849123
申请日：2017-12-20
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi
Abstract: A method for manufacturing a light-emitting device includes: providing a light-transmissive member comprising: a base portion, and a projecting portion on a first surface side of the base portion; providing a light-emitting element that has a main emitting surface and an electrode formation surface opposite to the main emitting surface; disposing the light-emitting element on the projecting portion of the light-transmissive member such that the main emitting surface of the light-emitting element faces an upper surface of the projecting portion of the light-transmissive member; and forming a light-reflective member that covers at least one of (i) lateral surfaces of the light-emitting element, and/or (ii) lateral surfaces of the projecting portion of the light-transmissive member.
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公开(公告)号：US10415801B2
公开(公告)日：2019-09-17
申请号：US15721381
申请日：2017-09-29
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi
Abstract: A method for manufacturing a linear light emitting device includes: providing a light transmissive member having a long side and a short side in a plan view; mounting a plurality of light emitting elements on the light transmissive member via a light transmissive adhesive, such that the light emitting elements are arranged in a row along the long side of the light transmissive member; and forming a reflective member that covers the light transmissive adhesive and lateral faces of the light emitting elements. The linear light emitting device has an emission face having a long side and a short side in a plan view, and a length of the short side of the light transmissive member is substantially equal to a length of the short side of the emission face of the linear light emitting device.
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Patent Agency Ranking
公开(公告)号：US10374134B2
公开(公告)日：2019-08-06
申请号：US15167570
申请日：2016-05-27
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi , Teruhito Azuma , Suguru Beppu , Kunihiro Izuno , Tsuyoshi Okahisa
Abstract: A light emitting device includes: a covering member including a first light-reflective member having a through-hole, and a light-transmissive resin disposed in the through-hole; a light-emitting element arranged to face the light-transmissive resin; a second light-reflective member arranged to face the first light-reflective member around the light-emitting element, the second light-reflective member covering a lateral surface of the light-emitting element; and a bonding member bonding the light-transmissive resin and the light-emitting element, the bonding member covering at least a part of the lateral surface of the light-emitting element. The light-transmissive resin contains a wavelength-conversion material distributed predominantly on either (i) a side of a lower surface of the light-transmissive resin facing the light-emitting element, or (ii) a side of an upper surface of the light-transmissive resin apart from the light-emitting element.
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公开(公告)号：US10270011B2
公开(公告)日：2019-04-23
申请号：US15468540
申请日：2017-03-24
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Takeshi Ikegami , Tadaaki Ikeda , Tadao Hayashi , Hiroto Tamaki
Abstract: A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within ±10 ppm/° C. of a linear expansion coefficient of the light emitting element.
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公开(公告)号：US12050338B2
公开(公告)日：2024-07-30
申请号：US18188453
申请日：2023-03-22
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi
CPC classification number: G02B6/0091 , G02B6/0021 , G02B6/0023 , G02B6/0031 , G02B6/0055 , G02B6/0058 , G02B6/0065 , G02B6/0073 , G02B6/0083 , H01L33/50 , H01L33/60 , H01L2933/0058
Abstract: A light emitting module includes a light guide plate including a first face, a second face opposing the first face, and a through part penetrating between the first face and the second face, a light emitting device disposed in the through part on a second face side, a light transmissive member disposed on the light emitting device in the through hole on a first face side and between the light emitting device and a lateral wall of the through part, and a first light reflecting member disposed between an upper face of the light emitting device and the light transmissive member while being in contact with the upper face of the light emitting device.
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公开(公告)号：US11688838B2
公开(公告)日：2023-06-27
申请号：US17200227
申请日：2021-03-12
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi
CPC classification number: H01L33/58 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/0093 , H01L33/0095 , H01L33/32 , H01L33/502 , H01L33/507 , H01L33/56 , H01L2933/005 , H01L2933/0033 , H01L2933/0058 , H01L2933/0083
Abstract: A method of manufacturing a light emitting device includes: providing two light emitting elements disposed on a first surface of a light transmissive member; disposing a light guide member covering a part of the first surface of the light transmissive member, and lateral surfaces of the two light emitting elements; disposing a light reflective member covering the two light emitting elements, a second surface of the light transmissive member, and the light guide member, the second surface of the light transmissive member being opposite to the first surface; and cutting the light reflective member and/or the light transmissive member between the two light emitting elements.
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公开(公告)号：US11681090B2
公开(公告)日：2023-06-20
申请号：US16885254
申请日：2020-05-27
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi
CPC classification number: G02B6/0091 , G02B6/0055 , G02B6/0058 , G02B6/0065 , G02B6/0068 , G02B6/0073 , G02B6/0083 , H01L33/486 , H01L33/507 , H01L33/62 , H01L33/50 , H01L33/60 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
Abstract: A light emitting module includes a light guide plate including a first face, a second face opposing the first face, and a through part penetrating between the first face and the second face, a light emitting device disposed in the through part on a second face side, a light transmissive member disposed on the light emitting device in the through hole on a first face side and between the light emitting device and a lateral wall of the through part, and a first light reflecting member disposed between an upper face of the light emitting device and the light transmissive member while being in contact with the upper face of the light emitting device.
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