公开(公告)号：US20190140149A1

公开(公告)日：2019-05-09

申请号：US16237293

申请日：2018-12-31

Applicant: NICHIA CORPORATION

Inventor： Yuki SHIOTA

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/58 ,  H01L33/54

CPC classification number: H01L33/507 ,  H01L33/486 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting device includes the steps of: disposing a light emitting element on a base; disposing a single or plurality of light-transmissive members on the base so that the light emitting element is interposed between and spaced apart from at least one pair of opposing portions of the single or plurality of light-transmissive members; covering the base, the at least one pair of opposing portions of the single or plurality of light-transmissive members, and the light emitting element with a sealing member containing a phosphor; and cutting the base, the at least one pair of opposing portions of the single or plurality of light-transmissive members, and the sealing member, along paths on which the at least one pair of opposing portions are disposed.

公开(公告)号：US20160190413A1

公开(公告)日：2016-06-30

申请号：US14978641

申请日：2015-12-22

Applicant: Nichia Corporation

Inventor： Koji ABE ,  Yuki SHIOTA

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L21/4846 ,  H01L21/565 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package for mounting a light emitting element includes a recess; a pair of lead electrodes exposed at a bottom surface of the recess; a plating layer covering a surface of each of the pair of lead electrodes; and a resin molded body retaining the pair of lead electrodes, and forming an area between the pair of lead electrodes at the bottom surface of the recess and a lateral surface of the recess. At least one of the lead electrodes has a front surface protrusion that is linearly formed along the resin molded body at the bottom surface of the recess and along a periphery of the bottom surface of the recess, and a back surface protrusion that is formed at a position at a back surface opposite to a position of the front surface protrusion, and at least a tip of each of the front surface protrusion and the back surface protrusion is exposed outside the plating layer.

Abstract translation: 用于安装发光元件的封装包括凹部; 在所述凹部的底面露出的一对引线电极; 覆盖所述一对引线电极中的每一个的表面的镀层; 以及保持所述一对引线电极的树脂成型体，并且在所述凹部的所述底面的所述一对引线电极和所述凹部的侧面之间形成区域。 所述引线电极中的至少一个具有在所述凹部的底面的所述树脂成型体和所述凹部的所述底面的周围沿着所述树脂成形体直线状地形成的前表面突起， 位于与前表面突起的位置相反的后表面，并且至少前表面突起和后表面突起中的每一个的尖端暴露在镀层外部。

公开(公告)号：US20230155098A1

公开(公告)日：2023-05-18

申请号：US18153347

申请日：2023-01-11

Applicant: NICHIA CORPORATION

Inventor： Yuki SHIOTA

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/64 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/507 ,  H01L33/641 ,  H01L33/60

Abstract: A light emitting device includes: a package including a first lead, a second lead, and a molded body; and a light emitting element provided on the second lead. The first lead includes a first electrode terminal having a first thickness in a thickness direction, and a first holding portion connected to the first electrode terminal and having a thickness smaller than the first thickness in the thickness direction, the first holding portion having a front surface and a rear surface opposite to the front surface in the thickness direction. The second lead includes a second electrode terminal facing the first electrode terminal in the thickness direction, and a connection electrically connected to the first lead. The molded body holds the first lead and the second lead and covers the front surface and the rear surface of the first holding portion.

公开(公告)号：US20220403236A1

公开(公告)日：2022-12-22

申请号：US17807845

申请日：2022-06-20

Applicant: NICHIA CORPORATION

Inventor： Yohei YAMAUCHI ,  Tomokazu YOSHIDA ,  Yuki SHIOTA

IPC: C09K11/61 ,  C09K11/64 ,  C09K11/02 ,  H01L33/50

Abstract: A fluoride phosphor, comprising fluoride particles having an average particle size of 0.1 μm to 7 μm and a maximum particle size of 1 μm to 18 μm, wherein a ratio of the maximum particle size with respect to the average particle size is higher than 1. The fluoride particles have a composition containing an element M containing at least one selected from the group consisting of Group 4 elements, Group 13 elements, and Group 14 elements; an alkali metal; Mn; and F. In the composition, when the number of moles of the alkali metal is 2, the number of moles of Mn is more than 0 but less than 0.2, the number of moles of the element M is more than 0.8 but less than 1, and the number of moles of F is more than 5 but less than 7.

公开(公告)号：US20190393144A1

公开(公告)日：2019-12-26

申请号：US16449446

申请日：2019-06-24

Applicant: NICHIA CORPORATION

Inventor： Yuki SHIOTA

IPC: H01L23/498 ,  H01L31/0203 ,  H01L33/48 ,  H01L23/00 ,  H01L23/495

Abstract: A package includes a first lead and a second lead. The first lead includes a first part and a second part connected to the first part. The second lead includes a third part and a fourth part connected to the third part. A molded body having a front surface and rear surface opposite to the front surface. The first part has a first terminal exposed from the rear surface. The first terminal is provided within an outer peripheral edge of the rear surface. The third part has a second terminal exposed from the rear surface. The second terminal is provided within the outer peripheral edge. The first lead or the second lead has a heat releasing terminal exposed from the rear surface. The heat releasing terminal is disposed between the first terminal and the second terminal to be spaced apart from the first terminal and the second terminal.

公开(公告)号：US20190172980A1

公开(公告)日：2019-06-06

申请号：US16249782

申请日：2019-01-16

Applicant: Nichia Corporation

Inventor： Koji ABE ,  Yuki SHIOTA

IPC: H01L33/48 ,  H01L33/00 ,  H01L23/31 ,  H01L33/56 ,  H01L21/56 ,  H01L33/50

Abstract: A package for mounting a light emitting element includes: a first lead electrode having, in a plan view, a first region, a second region surrounding a periphery of the first region having a width of 110 μm or more and a thickness greater than that of the first region, and a third region partially surrounding a periphery of the second region and having a thickness smaller than that of the second region; a second lead electrode spaced apart from the first lead electrode; and a resin molded body fixing a portion of each of the first and second lead electrodes. A portion of each of the first and second lead electrodes and a portion of the resin molded body exposed therebetween form a bottom surface of a recess.

公开(公告)号：US20160240518A1

公开(公告)日：2016-08-18

申请号：US15042151

申请日：2016-02-12

Applicant: NICHIA CORPORATION

Inventor： Masaki HAYASHI ,  Yuki SHIOTA ,  Junya NARITA ,  Keisuke KURASHITA ,  Takanori AKAISHI

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/56 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/18 ,  H01L33/20 ,  H01L33/486 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10156 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Each of a plurality of light emitting elements has a polygonal shape with five or more corners. An interior angle at each of the corners is less than 180°. The plurality of light emitting elements include a first light emitting element having a first bottom surface, a first top surface opposite to the first bottom surface, and a first lateral side surface between the first bottom surface and the first top surface. The second light emitting element has a second bottom surface, a second top surface opposite to the second bottom surface, and a second lateral side surface between the second bottom surface and the second top surface. The second lateral side surface is provided not to oppose to the first lateral side surface in substantially parallel.

Abstract translation: 多个发光元件中的每一个都具有五角或更多角的多边形。 每个拐角处的内角小于180°。 多个发光元件包括具有第一底表面的第一发光元件，与第一底表面相对的第一顶表面，以及在第一底表面和第一顶表面之间的第一横向侧表面。 第二发光元件具有第二底表面，与第二底表面相对的第二顶表面，以及在第二底表面和第二顶表面之间的第二横向侧表面。 第二横向侧表面设置成不与第一横向侧表面大致平行地相对。

公开(公告)号：US20140306245A1

公开(公告)日：2014-10-16

申请号：US14247891

申请日：2014-04-08

Applicant: NICHIA CORPORATION

Inventor： Masaki HAYASHI ,  Yuki SHIOTA

IPC: H01L33/62

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting device has: a first lead which is mounted a light emitting element, a second lead separated by an interval from the first lead, an insulating member configured to fix the first lead and the second lead, a wavelength conversion portion configured to cover the light emitting element, and a lens portion configured to cover the wavelength conversion portion, a thickness of the insulating member is equal to the thickness of the first lead and the second lead, a groove or a recessed portion is provided to retain the wavelength conversion portion in a specific region is formed in the first lead, and a lower surface of the first lead that forms an opposite side of a region formed on the wavelength conversion portion is not covered by the insulating member and is exposed to the outside.

Abstract translation: 一种发光器件具有：安装有发光元件的第一引线，与第一引线隔开间隔的第二引线，被配置为固定第一引线和第二引线的绝缘构件，被配置为覆盖 发光元件和被配置为覆盖波长转换部分的透镜部分，绝缘构件的厚度等于第一引线和第二引线的厚度，设置槽或凹部以保持波长转换 特定区域中的部分形成在第一引线中，并且形成在波长转换部分上形成的区域的相对侧的第一引线的下表面不被绝缘构件覆盖并暴露于外部。