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    HEAD GIMBAL ASSEMBLY
    11.
    发明申请
    HEAD GIMBAL ASSEMBLY 有权

    公开(公告)号：US20150179196A1

    公开(公告)日：2015-06-25

    申请号：US14580850

    申请日：2014-12-23

    Applicant: NITTO DENKO CORPORATION

    Inventor： Tomoaki OKUNO ,  Hiroyuki TANABE ,  Yoshito FUJIMURA ,  Naohiro TERADA

    IPC: G11B5/48

    CPC classification number: G11B5/4826 ,  G11B5/4853 ,  G11B5/4873 ,  G11B21/24

    Abstract: A head gimbal assembly includes a suspension board with circuit, a pair of piezoelectric elements mounted on the suspension board with circuit to be expandable/contractible, and a slider on which a magnetic head is mounted and which is mounted on the suspension board with circuit and configured to be able to swing with expansion/contraction of the pair of piezoelectric elements. The pair of piezoelectric elements are placed on the suspension board with circuit such that a first imaginary line extending along an expanding/contracting direction of one of the piezoelectric elements crosses a second imaginary line extending along an expanding/contracting direction of the other piezoelectric element.

    Abstract translation: 头万向架组件包括具有电路的悬挂板，安装在具有可扩张/收缩的电路的悬挂板上的一对压电元件和安装有磁头的滑块，并且其上安装有具有电路的悬挂板 被构造成能够随着所述一对压电元件的膨胀/收缩而摆动。 一对压电元件被放置在具有电路的悬挂板上，使得沿着一个压电元件的扩张/收缩方向延伸的第一假想线与沿另一个压电元件的扩展/收缩方向延伸的第二假想线交叉。

    SUSPENSION BOARD WITH CIRCUIT AND METHOD OF MANUFACTURING THE SAME
    12.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT AND METHOD OF MANUFACTURING THE SAME 有权
    具有电路的悬挂板及其制造方法

    公开(公告)号：US20140345920A1

    公开(公告)日：2014-11-27

    申请号：US14273657

    申请日：2014-05-09

    Applicant: Nitto Denko Corporation

    Inventor： Terukazu IHARA ,  Naohiro TERADA

    IPC: H05K1/09 ,  H05K3/34

    CPC classification number: H05K3/3405 ,  G11B5/4853 ,  H05K2201/09427 ,  H05K2201/09727 ,  H05K2203/046 ,  Y10T29/49147

    Abstract: Heat-assisted wiring traces and a conductive support substrate are respectively formed on first and second surfaces of an insulating layer. Further, connection terminals electrically insulated from the support substrate and electrically respectively connected to the heat-assisted wiring traces are formed on the second surface of the insulating layer. Each connection terminal has an element connection portion, a pattern connection portion and a spread blocking portion. When a circuit element is connected to the element connection portion of the connection terminal by solder, spreading of a molten solder applied to the element connection portion to the pattern connection portion is blocked by the spread blocking portion.

    Abstract translation: 分别在绝缘层的第一和第二表面上形成热辅助布线和导电支撑基板。 此外，在绝缘层的第二表面上形成与支撑基板电绝缘并电连接到热辅助布线的连接端子。 每个连接端子具有元件连接部分，图案连接部分和展开阻挡部分。 当通过焊料将电路元件连接到连接端子的元件连接部分时，施加到元件连接部分的熔融焊料向图案连接部分的扩散被扩展阻挡部分阻挡。

    SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
    14.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF 有权
    具有电路的悬挂板及其制造方法

    公开(公告)号：US20160270216A1

    公开(公告)日：2016-09-15

    申请号：US15054391

    申请日：2016-02-26

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yoshito FUJIMURA ,  Saori KANEZAKI ,  Naohiro TERADA

    IPC: H05K1/02 ,  H05K3/00 ,  H05K1/05 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10

    CPC classification number: G11B5/4846

    Abstract: A suspension board with circuit includes a metal supporting board having a support opening portion, a base insulating layer disposed at one side of the metal supporting board, and a conductive layer disposed at one side of the base insulating layer and including a plurality of terminal portions overlapped with the support opening portion and disposed at spaced intervals to each other. The base insulating layer includes a plurality of base opening portions that are disposed between the plurality of terminal portions in an arrangement direction, a plurality of thick portions that are overlapped with each of end portions of the plurality of terminal portions in a direction orthogonal to both directions of the thickness direction and the arrangement direction, and a plurality of thin portions that are disposed along edge portions of the plurality of base opening portions between the plurality of thick portions and are thinner than the plurality of thick portions.

    Abstract translation: 具有电路的悬挂板包括具有支撑开口部分的金属支撑板，设置在金属支撑板一侧的基底绝缘层和设置在基底绝缘层一侧的导电层，并且包括多个端子部分 与支撑开口部分重叠并且以彼此间隔开的间隔设置。 基底绝缘层包括多个基部开口部，其设置在排列方向上的多个端子部之间，多个厚部与多个端子部的各端部在与两个正交的方向上重叠 厚度方向和排列方向的方向以及多个基部开口部的沿着多个厚壁部的边缘部配置的多个薄壁部，并且比多个厚部更薄。

    SUSPENSION BOARD WITH CIRCUIT
    15.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT 有权
    悬挂板与电路

    公开(公告)号：US20160239055A1

    公开(公告)日：2016-08-18

    申请号：US15040199

    申请日：2016-02-10

    Applicant: NITTO DENKO CORPORATION

    Inventor： Naohiro TERADA ,  Saori KANEZAKI ,  Hiroyuki TANABE ,  Yoshito FUJIMURA

    IPC: G06F1/18 ,  H05K1/09 ,  H05K1/03 ,  G06F1/20

    CPC classification number: G11B5/4853 ,  G06F1/184 ,  G11B5/4826 ,  G11B5/4873 ,  H05K1/056 ,  H05K3/305 ,  Y02P70/613

    Abstract: A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.

    Abstract translation: 具有电路的悬挂板包括一对基座。 一个基座的基座导电层具有风扇部分和连续部分。 另一基座的基座导电层至少具有风扇部。 当另一个基座的基座导电层仅具有风扇部分时，基座支撑层设置成在每个基座中在厚度方向上与风扇部分重叠，并且不与连续部分重叠 在一个基座中，并且当另一个基座的基座导电层具有连续部分时，基座支撑层设置成与连续部分重叠或者设置成与风扇部分重叠，并且不会 与每个基座中的连续部分重叠。

    SUSPENSION BOARD WITH CIRCUIT
    16.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT 有权
    悬挂板与电路

    公开(公告)号：US20160111115A1

    公开(公告)日：2016-04-21

    申请号：US14878319

    申请日：2015-10-08

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yoshito FUJIMURA ,  Hiroyuki TANABE ,  Saori KANEZAKI ,  Naohiro TERADA ,  Yuu SUGIMOTO

    IPC: G11B5/48

    CPC classification number: G11B5/4853 ,  G11B5/4826 ,  G11B5/484

    Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.

    Abstract translation: 具有电路的悬挂板包括金属支撑层，在其一个厚度方向上的绝缘基底层，设置在绝缘基底层上的导电图案，设置在绝缘基底层上以覆盖导电性的绝缘覆盖层 图案，以及用于支撑包括薄基座部分的滑块的基座。 薄基座部分包括基底绝缘层中包括的基座基层，包括在基座基层上的导电图案中的基座导电层，以及包括在绝缘覆盖层中并设置在基座导电 层。 导电图案包括放置成在具有较窄部分的绝缘基底层上延伸的第一线，并且基座导电层的尺寸为较窄部分的尺寸的0.5至3倍。

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