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11.发明申请SUSPENSION BOARD WITH CIRCUIT AND SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUIT, AND METHOD OF MANUFACTURING THE SAME 有权具有电路的悬挂板和具有电路的悬架板组件片及其制造方法公开(公告)号：US20140313619A1
公开(公告)日：2014-10-23
申请号：US14230772
申请日：2014-03-31
Applicant: Nitto Denko Corporation
Inventor： Yuu SUGIMOTO , Takatoshi SAKAKURA
CPC classification number: G11B5/484 , G11B5/4846 , G11B5/84 , Y10T29/49071 , Y10T156/10
Abstract: First and second laminated structures are respectively formed at one surface and the other surface of an insulating layer. A laminate is formed of the first laminated structure, the insulating layer and the second laminated structure. A heat-assisted wiring trace is included in the first laminated structure, and a support substrate and a connection terminal are included in the second laminated structure. The surface of the connection terminal is exposed at the other surface of the insulating layer. A first portion of the laminate including the connection terminal has a thickness smaller than the thickness of second and third portions of the laminate including portions on both sides of the connection terminal.
Abstract translation: 第一和第二层压结构分别形成在绝缘层的一个表面和另一个表面上。 由第一层叠结构，绝缘层和第二层叠结构形成层压体。 在第一层压结构中包括热辅助布线，并且在第二层叠结构中包括支撑基板和连接端子。 连接端子的表面在绝缘层的另一个表面露出。 包括连接端子的层压体的第一部分的厚度小于包括连接端子两侧部分的层压体的第二和第三部分的厚度。
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公开(公告)号：US20130284498A1
公开(公告)日：2013-10-31
申请号：US13828616
申请日：2013-03-14
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Youhei SHIRAFUJI
CPC classification number: H05K1/0296 , H05K1/0278 , H05K1/056 , H05K1/111 , H05K13/00 , H05K2201/09063 , Y02P70/611 , Y10T29/49165
Abstract: Read wiring traces and write wiring traces are formed on an insulating layer that is formed on a support substrate. Connection terminals that are electrically connectable to external circuits are formed at parts of the read wiring traces and write wiring traces on the insulating layer, respectively. Openings are formed in the support substrate so as to partially or entirely surround overlap regions that overlap with the connection terminals and have the same plane shape as the connection terminals. Parts of the insulating layer are exposed in the openings.
Abstract translation: 读取布线迹线和写入布线迹线形成在形成在支撑基板上的绝缘层上。 可以连接到外部电路的连接端子分别形成在绝缘层上的读取布线迹线和写入布线迹线的部分。 开口形成在支撑基板上，以便部分地或全部地围绕与连接端子重叠的重叠区域，并且具有与连接端子相同的平面形状。 绝缘层的一部分露出在开口中。
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公开(公告)号：US20200260588A1
公开(公告)日：2020-08-13
申请号：US16860383
申请日：2020-04-28
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE , Yoshito FUJIMURA
Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.
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公开(公告)号：US20180075871A1
公开(公告)日：2018-03-15
申请号：US15689695
申请日：2017-08-29
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE
CPC classification number: G11B5/4853 , G11B5/3163 , G11B2005/0021 , H05K1/056 , H05K1/119 , H05K1/184 , H05K3/0023 , H05K3/0041 , H05K3/06 , H05K3/3405 , H05K3/4015 , H05K2201/09063 , H05K2201/09154 , H05K2201/09827 , H05K2201/10106
Abstract: A suspension board with circuit having an opening with an electronic element inserted therein includes an insulating layer disposed at the edge of the opening, a first terminal disposed at one surface of the insulating layer and connected to a magnetic head, and a second terminal disposed at the other surface thereof and connected to the electronic element. The insulating layer includes a first portion in which the first terminal is disposed and a second portion that extends from the first portion toward the opening and is overlapped with a slider. The second portion is thinner than the first portion and is overlapped with the second terminal. The slider has a first surface facing the second portion. The first surface is disposed between the first terminal and the second terminal.
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公开(公告)号：US20180014401A1
公开(公告)日：2018-01-11
申请号：US15712613
申请日：2017-09-22
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Yoshito FUJIMURA , Hiroyuki TANABE
CPC classification number: H05K1/0284 , H05K1/0274 , H05K1/05 , H05K3/0008 , H05K3/06 , H05K3/064 , H05K3/108 , H05K3/4644 , H05K3/4679 , H05K2201/09227 , H05K2201/09272 , H05K2203/0557 , H05K2203/056 , H05K2203/0562
Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
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Patent Agency Ranking
公开(公告)号：US20170351181A1
公开(公告)日：2017-12-07
申请号：US15605259
申请日：2017-05-25
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE , Yoshito FUJIMURA
Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.
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公开(公告)号：US20170339786A1
公开(公告)日：2017-11-23
申请号：US15671549
申请日：2017-08-08
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki TANABE , Naohiro TERADA , Yuu SUGIMOTO , Daisuke YAMAUCHI
CPC classification number: H05K1/05 , G11B5/4826 , G11B5/484 , G11B5/4853 , H05K1/0278 , H05K1/0393 , H05K1/11 , H05K1/18 , H05K1/181 , H05K3/4007 , H05K3/44 , H05K2201/10151 , H05K2201/10227
Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.
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公开(公告)号：US20170188453A1
公开(公告)日：2017-06-29
申请号：US15386755
申请日：2016-12-21
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE
IPC: H05K1/02
CPC classification number: H05K1/0296 , G11B5/4853 , G11B5/486 , H05K1/0277 , H05K1/0393 , H05K1/056 , H05K3/108 , H05K2201/0191
Abstract: The wired circuit board includes an insulating layer and a conductive pattern provided on the insulating layer. The insulating layer has an inclined face and a flat face, and a supplementary angle y to an angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or less.
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公开(公告)号：US20190394882A1
公开(公告)日：2019-12-26
申请号：US16479071
申请日：2018-01-22
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE
Abstract: The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.
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公开(公告)号：US20180209058A1
公开(公告)日：2018-07-26
申请号：US15876603
申请日：2018-01-22
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE
CPC classification number: C25D5/02 , C25D3/48 , C25D5/022 , C25D5/10 , C25D5/36 , C25D5/50 , C25D7/00 , H05K1/05 , H05K1/053 , H05K1/056 , H05K3/188 , H05K3/243 , H05K3/4644 , H05K2203/1476
Abstract: A method for producing a wired circuit board including a stainless steel supporting layer having a stainless steel terminal includes a first step of preparing the stainless steel supporting layer having a passive film formed on the surface thereof and a second step of forming a first gold plating layer on the surface of the stainless steel terminal. In the second step, the stainless steel supporting layer is immersed in a first gold plating solution containing a weak acid and a gold compound without containing a strong acid, and electricity is supplied to the stainless steel supporting layer so that the passive film is removed and the first gold plating layer is formed on the surface of the stainless steel terminal.
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