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公开(公告)号:US08797148B2
公开(公告)日:2014-08-05
申请号:US12859340
申请日:2010-08-19
申请人: Noboru Kato , Nobuo Ikemoto
发明人: Noboru Kato , Nobuo Ikemoto
IPC分类号: G08C17/02 , G06K19/077
CPC分类号: G06K19/07749 , G06K19/07767 , G06K19/07777 , G06K19/07786 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01Q1/2208 , H01Q1/2216 , H01Q1/2225 , H01Q1/38 , H01Q9/16 , H01Q9/24 , H01Q23/00 , H01L2224/0401
摘要: A radio frequency IC device achieves impedance matching between a radio IC chip and a radiation plate in a wide frequency band, and achieves desired radiation characteristics over a wide range of frequencies. A radio frequency IC device and a radio communication system allow both long-distance and short-distance communication and, in particular, allow short-distance communication using a small amount of energy. The radio frequency IC device includes an electromagnetic coupling module including a radio IC chip and a feed circuit board, and a radiation plate. An annular electrode is arranged to be coupled to both a feed circuit of the electromagnetic coupling module and the radiation plate. The radiation plate defines an electric-field radiation plate for long-distance communication, while the annular electrode defines a magnetic-field radiation plate for short-distance communication. The feed circuit board may be removed, so that the radio IC chip is coupled to the annular electrode directly or with an interposer disposed therebetween.
摘要翻译: 射频IC器件在宽频带中实现无线IC芯片与辐射板之间的阻抗匹配,并且在宽的频率范围内实现期望的辐射特性。 无线电频率IC设备和无线电通信系统允许远程和短距离通信,并且特别地允许使用少量能量的短距离通信。 射频IC器件包括具有无线IC芯片和馈电电路基板的电磁耦合模块和辐射板。 环形电极被布置成耦合到电磁耦合模块的馈电电路和辐射板。 辐射板限定了用于长距离通信的电场辐射板,而环形电极限定了用于短距离通信的磁场辐射板。 馈电电路板可以被去除,使得无线电IC芯片直接耦合到环形电极或者设置在它们之间的插入器。
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公开(公告)号:US08692718B2
公开(公告)日:2014-04-08
申请号:US13083626
申请日:2011-04-11
申请人: Noboru Kato , Yuya Dokai
发明人: Noboru Kato , Yuya Dokai
IPC分类号: H01Q1/38
CPC分类号: H01Q9/045 , G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01Q1/2283 , H01Q1/36 , H01Q1/40 , H01Q7/00
摘要: An antenna and a wireless IC device that includes the antenna are provided for which the manufacturing process is simple and for which there is a low probability of a poor connection occurring between a feeder portion and a radiation electrode. An antenna includes a radiation electrode that is provided on a main surface of an insulator board, a ground electrode and/or a counter electrode that is arranged so as to oppose the radiation electrode, and a magnetic field electrode that is connected to the radiation electrode through a connection portion. The magnetic field electrode is defined by line-shaped electrodes and feeds a signal to the radiation electrode from a feeder portion defined by ends of the line-shaped electrodes through the magnetic field electrode.
摘要翻译: 提供了包括天线的天线和无线IC器件,其制造过程简单,并且在馈电部分和辐射电极之间出现差的连接的可能性很低。 天线包括设置在绝缘体板的主表面上的辐射电极,与辐射电极相对配置的接地电极和/或对电极,以及连接到辐射电极的磁场电极 通过连接部分。 磁场电极由线状电极限定,并且通过磁场电极从由线状电极的端部限定的馈电部分向辐射电极馈送信号。
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公开(公告)号:US08676117B2
公开(公告)日:2014-03-18
申请号:US13567108
申请日:2012-08-06
申请人: Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人: Yuya Dokai , Noboru Kato , Satoshi Ishino
IPC分类号: H04B5/00
CPC分类号: H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
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公开(公告)号:US08668151B2
公开(公告)日:2014-03-11
申请号:US12859880
申请日:2010-08-20
申请人: Noboru Kato , Satoshi Ishino
发明人: Noboru Kato , Satoshi Ishino
IPC分类号: G06K19/06
CPC分类号: H01Q1/2225 , H01F17/0013 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/181 , H01Q1/2283 , H01Q1/50 , H01Q7/00 , H01Q21/29 , H05K1/0239 , H05K1/0243 , H05K3/305 , H05K2201/10098 , H05K2201/10727 , H01L2924/00012 , H01L2224/0401
摘要: A wireless IC device improves radiation characteristics or directivity of signals and reliably communicates with a reader/writer. The wireless IC device includes an electromagnetically coupled module includes a wireless IC device and a feed circuit substrate, a protective layer, a first radiation plate, and a second radiation plate. The feed circuit substrate includes a feed circuit including inductance elements. The feed circuit is electrically connected to the wireless IC chip and coupled to the radiation plates. Signals received by the radiation plates are provided to the wireless IC chip via the feed circuit. Signals from the wireless IC chip are provided to the radiation plates via the feed circuit and then radiated to the outside.
摘要翻译: 无线IC器件提高信号的辐射特性或方向性,并可靠地与读/写器通信。 无线IC器件包括电磁耦合模块,其包括无线IC器件和馈电电路衬底,保护层,第一辐射板和第二辐射板。 馈电电路基板包括包括电感元件的馈电电路。 馈电电路电连接到无线IC芯片并耦合到辐射板。 由辐射板接收的信号通过馈电电路提供给无线IC芯片。 来自无线IC芯片的信号通过馈电电路提供给辐射板,然后辐射到外部。
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公开(公告)号:US08592687B2
公开(公告)日:2013-11-26
申请号:US13343740
申请日:2012-01-05
申请人: Noboru Kato , Jun Sasaki , Satoshi Ishino
发明人: Noboru Kato , Jun Sasaki , Satoshi Ishino
IPC分类号: H05K1/02
CPC分类号: H05K1/0298 , H01P3/081 , H01P3/088 , H05K1/0219 , H05K1/0225 , H05K1/028 , H05K2201/0715 , H05K2201/09618
摘要: A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.
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公开(公告)号:US08590797B2
公开(公告)日:2013-11-26
申请号:US13585866
申请日:2012-08-15
申请人: Noboru Kato , Nobuo Ikemoto
发明人: Noboru Kato , Nobuo Ikemoto
IPC分类号: G06K19/06
CPC分类号: G06K19/0775 , G06K19/0709 , G06K19/0723 , G06K19/07749 , G06K19/07779 , G06K19/07781 , G06K19/07783 , G06K19/07784 , H01Q1/2225 , H01Q1/48 , H01Q7/00 , H05K1/0243 , H05K2201/10098
摘要: A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.
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公开(公告)号:US08531346B2
公开(公告)日:2013-09-10
申请号:US12510338
申请日:2009-07-28
申请人: Mikiko Kimura , Noboru Kato
发明人: Mikiko Kimura , Noboru Kato
CPC分类号: G06K19/07749 , G06K19/07756 , H01Q1/2208 , H05K1/0269 , H05K3/303 , H05K2201/09918 , H05K2201/09954 , H05K2201/10636 , H05K2201/10727 , H05K2203/166 , Y02P70/611 , Y02P70/613
摘要: A wireless IC device includes a wireless IC chip; a feeder circuit board which has the wireless IC chip located thereon, is magnetically coupled to a radiation plate, supplies electric power to the wireless IC chip, and relays signals between the wireless IC chip and the radiation plate; and a substrate on which the feeder circuit board is placed. On the substrate, there are formed a plurality of positioning markers indicating the boundaries of a plurality of positioning areas in which the feeder circuit board is selectively placed.
摘要翻译: 无线IC器件包括无线IC芯片; 具有位于其上的无线IC芯片的馈电电路板磁耦合到辐射板,向无线IC芯片供电,并在无线IC芯片和辐射板之间中继信号; 以及放置有供电电路基板的基板。 在基板上,形成有多个定位标记,其指示多个定位区域的边界,馈电电路板选择放置在该定位区域中。
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公开(公告)号:US08450614B2
公开(公告)日:2013-05-28
申请号:US13286298
申请日:2011-11-01
申请人: Noboru Kato , Jun Sasaki
发明人: Noboru Kato , Jun Sasaki
IPC分类号: H05K1/00
CPC分类号: H01P3/082 , H05K1/0219 , H05K1/028 , H05K1/0298 , H05K1/0393 , H05K2201/09672 , H05K2201/09727
摘要: A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.
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公开(公告)号:US08400231B2
公开(公告)日:2013-03-19
申请号:US13462841
申请日:2012-05-03
申请人: Noboru Kato , Jun Sasaki , Teppei Miura
发明人: Noboru Kato , Jun Sasaki , Teppei Miura
摘要: A high-frequency coupler and a communication device are compact, capable of efficiently communicating a large volume of data over a short distance and can be used in combination with a non-contact IC card. The high-frequency coupler includes magnetic-field-generating patterns and a surrounding pattern disposed around a periphery thereof, and is used to communicate a large volume of data over a short distance in a communication system that uses broadband frequencies. Out of the magnetic fields radiated in directions perpendicular or substantially perpendicular to the plane of the patterns from the magnetic-field-generating patterns, portions extending laterally in the plane of the patterns are blocked by the surrounding pattern, the magnetic fields are lengthened in a direction perpendicular or substantially perpendicular to the plane of the patterns and the communication distance is increased.
摘要翻译: 高频耦合器和通信设备紧凑,能够在短距离内有效地传送大量数据,并且可以与非接触式IC卡组合使用。 高频耦合器包括磁场产生模式和围绕其周围设置的周围模式,并且用于在使用宽带频率的通信系统中在短距离内传送大量数据。 在与来自磁场产生图案的图案的平面垂直或基本垂直的方向上辐射的磁场中,在图案的平面中横向延伸的部分被周围图案阻挡,磁场被延长 与图案的平面垂直或基本垂直的方向和通信距离增加。
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公开(公告)号:US08390459B2
公开(公告)日:2013-03-05
申请号:US12510344
申请日:2009-07-28
申请人: Noboru Kato
发明人: Noboru Kato
IPC分类号: G08B13/14
CPC分类号: G06K19/07749 , G06K19/07756 , G06K19/07786 , H01Q1/2225 , H01Q1/38 , H01Q1/40 , H01Q9/24 , H01Q9/26
摘要: A wireless IC device includes an electromagnetic coupling module, which includes a feeder circuit board having a wireless IC chip arranged to process transmission and reception signals mounted thereon, and a radiation plate. Linear loop electrodes provided in the radiation plate are electromagnetically coupled to planar electrodes located on a surface of the feeder circuit board. A signal received by the radiation plate drives the wireless IC chip. A response signal from the wireless IC chip is transmitted to the outside from the radiation plate. A frequency of the transmission and reception signals is substantially determined by inductance of the loop electrodes, capacitance between the loop electrodes and the planar electrodes, and stray capacitance generated between lines of the loop electrodes.
摘要翻译: 无线IC器件包括电磁耦合模块,该电磁耦合模块包括具有布置成处理安装在其上的发射和接收信号的无线IC芯片的馈电电路板和辐射板。 设置在辐射板中的线性环形电极电磁耦合到位于馈电电路板表面上的平面电极。 由辐射板接收的信号驱动无线IC芯片。 来自无线IC芯片的响应信号从辐射板传输到外部。 发送和接收信号的频率基本上由环形电极的电感,环形电极和平面电极之间的电容以及环形电极线之间产生的杂散电容决定。
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