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公开(公告)号：US20170054110A1
公开(公告)日：2017-02-23
申请号：US15306966
申请日：2015-04-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： David Racz , Guenter Spath , Markus Richter
CPC classification number: H01L51/5268 , H01L25/0753 , H01L27/0248 , H01L27/322 , H01L33/44 , H01L33/505 , H01L51/5237 , H01L51/5275 , H01L51/56 , H01L2924/0002 , H01L2924/00
Abstract: A lighting device and a method for producing a lighting device are disclosed. In an embodiment, the lighting device includes a carrier, at least one optoelectronic illuminant arranged on the carrier, the illuminant configured to emit light into an emission area and a color scattering layer located in the emission area, the color scattering layer configured to generate a color by scattering of light at a surface of the color scattering layer facing away from the illuminant.
Abstract translation: 公开了一种照明装置和照明装置的制造方法。 在一个实施例中，照明装置包括载体，布置在载体上的至少一个光电发光体，配置成将光发射到发射区域中的光源和位于发射区域中的彩色散射层，该彩色散射层被配置为产生 在彩色散射层的背离光源的表面散射光的颜色。
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公开(公告)号：US10374196B2
公开(公告)日：2019-08-06
申请号：US15306966
申请日：2015-04-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： David Racz , Guenter Spath , Markus Richter
Abstract: A lighting device and a method for producing a lighting device are disclosed. In an embodiment, the lighting device includes a carrier, at least one optoelectronic illuminant arranged on the carrier, the illuminant configured to emit light into an emission area and a color scattering layer located in the emission area, the color scattering layer configured to generate a color by scattering of light at a surface of the color scattering layer facing away from the illuminant.
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公开(公告)号：US10026880B2
公开(公告)日：2018-07-17
申请号：US15509505
申请日：2015-09-08
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： David Racz , Michael Zitzlsperger , Georg Bogner
IPC: H01L33/58 , H01L33/48 , H01L33/50 , H01L33/62 , H01L25/075
Abstract: An optoelectronic component includes a carrier, a light source formed on the carrier, the light source having at least one luminous face formed by one or more light emitting diodes, wherein an at least partly transparent lamina is arranged on the luminous face, the lamina having a surface facing the luminous face and a surface facing away from the luminous face, wherein at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.
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公开(公告)号：US09978916B2
公开(公告)日：2018-05-22
申请号：US15509507
申请日：2015-09-08
Applicant: OSRAM OPTO Semiconductors GmbH
Inventor： David Racz , Michael Zitzlsperger , Günter Spath
IPC: H01L33/58 , H01L33/48 , H01L33/50 , H01L33/62 , H01L33/44 , H01L33/54 , H01L25/075 , H01L25/16 , H01L33/56
Abstract: An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed between the luminous surface and a spacer surface of the spacer facing away from the luminous surface, and wherein the light source is potted by a potting compound such that the spacer surface is formed extending flush with a potting compound surface facing away from the surface of the carrier and a surface formed by a spacer surface and the potting compound surface is plane.
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公开(公告)号：US20170324012A1
公开(公告)日：2017-11-09
申请号：US15524644
申请日：2015-11-05
Applicant: OSRAM Opto Semiconductors Gmbh
Inventor： Michael Wittmann , Tobias Gebuhr , David Racz
CPC classification number: H01L33/62 , H01L33/486 , H01L33/50 , H01L2933/0041 , H01L2933/0066
Abstract: An optoelectronic component includes a first lead frame section and a second lead frame section spaced apart from one another, and having an optoelectronic semiconductor chip arranged on the first lead frame section and the second lead frame section, wherein the first lead frame section and the second lead frame section respectively have an upper side, a lower side and a first side flank extending between the upper side and the lower side, a first lateral solder contact surface of the optoelectronic component is formed on the first side flank of the first lead frame section, and the first lateral solder contact surface is formed by a recess arranged on the first side flank of the first lead frame section and extends from the upper side to the lower side of the first lead frame section.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20170301835A1
公开(公告)日：2017-10-19
申请号：US15515766
申请日：2015-10-01
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Britta Goeoetz , David Racz , Matthias Sperl
CPC classification number: H01L33/54 , H01L33/0095 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/505 , H01L33/56 , H01L33/62 , H01L2933/0033 , H01L2933/0041 , H01L2933/005
Abstract: A method for producing optoelectronic semiconductor devices and an optoelectronic semiconductor device are disclosed. In an embodiment, the method includes providing a plurality of semiconductor chips for producing electromagnetic radiation, arranging the plurality of semiconductor chips in a plane, forming a housing body composite, at least some regions of which are arranged between the semiconductor chips, forming a plurality of conversion elements, wherein each conversion element comprises a wavelength-converting conversion material and is arranged on one of the semiconductor chips, encapsulating the plurality of conversion elements at least on their lateral edges by an encapsulation material, and separating the housing body composite into a plurality of optoelectronic semiconductor components.
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公开(公告)号：US20170054054A1
公开(公告)日：2017-02-23
申请号：US15307815
申请日：2015-05-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Adam Bauer , Wolfgang Mönch , David Racz , Michael Wittmann , Dominik Schulten , Andreas Löffler
CPC classification number: H01L33/06 , G02F1/133524 , G02F1/133603 , H01L25/0753 , H01L25/0756 , H01L33/08 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/502 , H01L33/504 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/181 , H01L2933/0091 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor component and an illumination device is disclosed. In an embodiment the semiconductor component includes a semiconductor chip configured to generate a primary radiation having a first peak wavelength and a radiation conversion element arranged on the semiconductor chip. The radiation conversion element includes a quantum structure that converts the primary radiation at least partly into secondary radiation having a second peak wavelength and a substrate that is transmissive to the primary radiation.
Abstract translation: 公开了半导体部件和照明装置。 在一个实施例中，半导体部件包括被配置为产生具有第一峰值波长的主辐射和布置在半导体芯片上的辐射转换元件的半导体芯片。 辐射转换元件包括量子结构，其将初级辐射至少部分地转换成具有第二峰值波长的次级辐射和对初级辐射透射的衬底。
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公开(公告)号：US20210336101A1
公开(公告)日：2021-10-28
申请号：US17284167
申请日：2019-10-09
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Albert Schneider , Kathy Schmidtke , David Racz
Abstract: In an embodiment an optoelectronic device includes an optoelectronic component with a first main surface, a second main surface and a plurality of side surfaces interconnecting the first and second main surfaces and a conversion element arranged at the first main surface of the optoelectronic component, wherein the conversion element includes a frame of a reflective material and a conversion material located within the frame, wherein an interface between the frame and the conversion material runs slanted having an angle of smaller than 180° and larger than 90° between the interface and an adjacent side surface of the plurality of side surfaces, and wherein the frame protrudes laterally beyond a light emitting area of the first main surface of the optoelectronic component.
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公开(公告)号：US10290782B2
公开(公告)日：2019-05-14
申请号：US15573466
申请日：2016-05-06
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Siegfried Herrmann , David O'Brien , David Racz
Abstract: A method for mirror-coating lateral surfaces of optical components, a mirror-coated optical component and an optoelectronic semiconductor body mountable on surface are disclosed. In an embodiment, an optoelectronic semiconductor body includes a semiconductor chip having a radiation side and a contact side different from the radiation side, wherein contact elements for electrically contacting the semiconductor body are attached to the contact side, and wherein the contact elements are freely accessible. The body further includes a metal mirror layer disposed on the semiconductor chip, wherein the metal mirror layer has a reflectivity of at least 80% to radiation emitted by the semiconductor chip during operation, wherein the mirror layer is a continuous and contiguous mirror layer, which covers all sides of the semiconductor chip that are not the contact side and the radiation side by at least 95%, and wherein the mirror layer is arranged at the semiconductor chip in a form-fit manner.
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公开(公告)号：US10177293B2
公开(公告)日：2019-01-08
申请号：US15524644
申请日：2015-11-05
Applicant: OSRAM Opto Semiconductors Gmbh
Inventor： Michael Wittmann , Tobias Gebuhr , David Racz
Abstract: An optoelectronic component includes a first lead frame section and a second lead frame section spaced apart from one another, and having an optoelectronic semiconductor chip arranged on the first lead frame section and the second lead frame section, wherein the first lead frame section and the second lead frame section respectively have an upper side, a lower side and a first side flank extending between the upper side and the lower side, a first lateral solder contact surface of the optoelectronic component is formed on the first side flank of the first lead frame section, and the first lateral solder contact surface is formed by a recess arranged on the first side flank of the first lead frame section and extends from the upper side to the lower side of the first lead frame section.
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