公开(公告)号：US09802397B2

公开(公告)日：2017-10-31

申请号：US14925048

申请日：2015-10-28

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takatoshi Abe ,  Tomoaki Sawada ,  Shingo Yoshioka

IPC: B32B27/36 ,  C08L71/02 ,  B32B3/08 ,  C08G59/24 ,  C08G59/56 ,  B32B27/38 ,  C08L3/02 ,  C08L63/00 ,  B32B7/04 ,  B32B27/08 ,  B32B27/20 ,  B32B3/30

CPC classification number: B32B27/36 ,  B32B3/08 ,  B32B3/30 ,  B32B7/045 ,  B32B27/08 ,  B32B27/20 ,  B32B27/38 ,  B32B2305/77 ,  B32B2307/202 ,  B32B2307/21 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/546 ,  B32B2307/552 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2571/00 ,  C08G59/245 ,  C08G59/56 ,  C08L63/00 ,  C08L71/02 ,  C08L87/00

Abstract: Provided is a structural member for electronic devices which uses a material that is flexible and has excellent restoration properties after extension and stress relaxation properties. The structural member for electronic devices has the following properties A and B: (Property A) In a case where predetermined deformation is applied, stress that applies the deformation is relaxed (reduced) with time: and (Property B) In a case where the stress that applies deformation is 0, the deformation rarely remains while a resin composition is recovered. That is, when stress is 0, residual strain substantially becomes 0 (specifically 3% or lower).

公开(公告)号：US11345784B2

公开(公告)日：2022-05-31

申请号：US17291533

申请日：2019-11-06

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kyosuke Michigami ,  Tomoaki Sawada ,  Tomohiro Fukao ,  Takatoshi Abe ,  Andy Behr

IPC: C08G83/00 ,  C08G59/40 ,  C08G59/42 ,  H05K1/02 ,  H05K1/03 ,  H05K3/02 ,  H05K3/46 ,  H05K3/30

Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

公开(公告)号：US10791624B2

公开(公告)日：2020-09-29

申请号：US15980245

申请日：2018-05-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomoaki Sawada ,  Takatoshi Abe ,  Shingo Yoshioka

IPC: H05K1/02 ,  C08J5/18 ,  C08K7/02 ,  C08L101/00 ,  C09D105/16 ,  C08J7/04 ,  G06F3/041 ,  H01B1/02 ,  H01L31/0224 ,  H05K1/03 ,  B32B5/02 ,  H01B1/24 ,  C09D163/00 ,  B32B15/092 ,  B32B15/08 ,  B32B3/12 ,  B32B3/26

Abstract: The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate (α), as measured in a prescribed extension-restoration test, are as follows: 20%≤R≤95% and 0%≤α≤3%.

公开(公告)号：US10299379B2

公开(公告)日：2019-05-21

申请号：US14944338

申请日：2015-11-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takatoshi Abe ,  Tomoaki Sawada ,  Shingo Yoshioka

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/00 ,  C09J171/00

Abstract: A sheet-shaped stretchable structure used as an electronics element has a stretch of not less than 10% and includes a plurality of laminated stretchable resin sheet, and at least one hollow is provided between at least one of pairs of two adjacent ones of the laminated stretchable resin sheets.

公开(公告)号：US10109390B2

公开(公告)日：2018-10-23

申请号：US15447039

申请日：2017-03-01

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tomoaki Sawada ,  Takatoshi Abe ,  Shingo Yoshioka

IPC: H01B5/14 ,  H01B1/24 ,  B32B27/12 ,  B32B27/36 ,  B32B27/06 ,  H01L31/0392 ,  H01L31/0224 ,  H03K17/96

Abstract: A conductive film includes a film substrate and a conductive layer formed on at least one surface of the film substrate. The film substrate and the conductive film have elongation of 10% or more. Ten-point average roughness Rz of the surface of the film substrate on at least a conductive layer side is 0.05 to 0.5 μm, and an average interval Sm of unevenness is 0.1 to 1 μm.

公开(公告)号：US12094622B2

公开(公告)日：2024-09-17

申请号：US17556119

申请日：2021-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tomohiro Fukao ,  Tomoaki Sawada ,  Takatoshi Abe ,  Kyosuke Michigami

IPC: H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K3/12

CPC classification number: H01B1/22 ,  H01B1/24 ,  H05K1/092 ,  H05K3/1283

Abstract: An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.

公开(公告)号：US11603469B2

公开(公告)日：2023-03-14

申请号：US16625316

申请日：2018-06-29

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takatoshi Abe ,  Tomoaki Sawada

IPC: C08L87/00 ,  H05K1/03

Abstract: The present invention relates, in one aspect, to a thermosetting resin composition including an epoxy resin, an isocyanate resin, a polyrotaxane resin, and a curing agent, wherein the isocyanate resin includes a hexamethylene skeleton and at least one selected from a biuret skeleton, an isocyanurate skeleton, an allophanate skeleton, a neopentyl skeleton, a butylene skeleton, and a dicarboxyl skeleton in a structure thereof.

公开(公告)号：US09468092B2

公开(公告)日：2016-10-11

申请号：US14405572

申请日：2014-10-08

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomoaki Sawada ,  Shingo Yoshioka ,  Takatoshi Abe

IPC: B32B3/12 ,  B32B3/24 ,  B32B15/08 ,  B32B15/092 ,  G06F3/041 ,  H01B1/02 ,  H01L31/0224 ,  H05K1/03 ,  H05K1/02 ,  C08J5/18 ,  C08K7/02 ,  C08L101/00 ,  C08J7/04 ,  C09D105/16 ,  B32B3/26

CPC classification number: H05K1/0271 ,  B32B3/12 ,  B32B3/266 ,  B32B5/02 ,  B32B15/08 ,  B32B15/092 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/103 ,  B32B2262/106 ,  B32B2262/14 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2363/00 ,  C08J5/18 ,  C08J7/047 ,  C08J2300/21 ,  C08J2367/02 ,  C08J2400/21 ,  C08J2463/00 ,  C08K7/02 ,  C08L101/00 ,  C09D105/16 ,  C09D163/00 ,  G06F3/041 ,  H01B1/02 ,  H01B1/24 ,  H01L31/022466 ,  H01L31/022491 ,  H05K1/0213 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/0366 ,  H05K2201/0108 ,  H05K2201/012 ,  H05K2201/0323 ,  H05K2201/0326 ,  Y10T428/24331 ,  Y10T428/24917 ,  C08L63/00

Abstract: The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate α, as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.

Abstract translation: 本发明涉及一种导电膜，其特征在于能够进行弹性变形，几乎没有残余应变率和显示应力松弛性能。 更具体地说，本发明涉及一种导电膜，其中在规定的延伸恢复试验中测量的应力松弛率（R）和残余应变速率α如下：20％≤R≤95％和0 ％≤α≤3％。