公开(公告)号：US5079070A

公开(公告)日：1992-01-07

申请号：US595902

申请日：1990-10-11

申请人： Pedro A. Chalco ,  Carlos J. Sambucetti

发明人： Pedro A. Chalco ,  Carlos J. Sambucetti

IPC分类号： B23K20/10 ,  B23K26/32 ,  G02F1/13 ,  H05K3/20 ,  H05K3/22 ,  H05K3/24 ,  H05K3/32 ,  H05K3/46

CPC分类号： H05K3/225 ,  B23K20/10 ,  G02F1/1309 ,  H05K2201/0317 ,  H05K2201/1028 ,  H05K2203/0278 ,  H05K2203/0285 ,  H05K2203/107 ,  H05K2203/173 ,  H05K3/20 ,  H05K3/244 ,  H05K3/328 ,  Y10S428/901 ,  Y10S428/913 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31721

摘要： Open defects in thin film conductor lines on a substrate are repaired by diffusion bonding a selected conductive repair line from a support sheet positioned over the open defect. The diffusion bonding is performed by the application of ultrasonic energy and laser energy.

摘要翻译： 通过将所选择的导电修复线从位于开放缺陷上的支撑片扩散接合来修复衬底上的薄膜导体线中的开放缺陷。 通过施加超声能量和激光能量来进行扩散接合。

公开(公告)号：US5321886A

公开(公告)日：1994-06-21

申请号：US68037

申请日：1993-05-28

申请人： Pedro A. Chalco ,  Matthew F. Cali ,  Laertis Economikos ,  James L. Speidell

发明人： Pedro A. Chalco ,  Matthew F. Cali ,  Laertis Economikos ,  James L. Speidell

IPC分类号： H01L23/12 ,  G02F1/13 ,  H01L21/768 ,  H05K3/00 ,  H05K3/02 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H05K3/46

CPC分类号： H05K3/225 ,  H01L21/76886 ,  G02F1/1309 ,  H05K2201/0394 ,  H05K2201/1028 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/173 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/20 ,  H05K3/28 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49742

摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.

公开(公告)号：US5154022A

公开(公告)日：1992-10-13

申请号：US718733

申请日：1991-06-21

申请人： Pedro A. Chalco ,  Harry D. Euler ,  Robert L. Rohr

发明人： Pedro A. Chalco ,  Harry D. Euler ,  Robert L. Rohr

IPC分类号： B23D59/00 ,  B24B1/00 ,  B24B19/02 ,  B24B27/06 ,  B28D5/04

CPC分类号： B24B1/00 ,  B23D59/002 ,  B23D59/008 ,  B24B19/028 ,  B24B27/0633 ,  B28D5/042 ,  Y10S451/904

摘要： A method and apparatus is disclosed for machining very fine, smooth cuts and grooves on minute surfaces such as single point bonding tips. The invention accurately aligns the axis of a reciprocating cutting wire in the direction of reciprocating motion and permits precise positioning and repositioning of the cutting wire on a work surface. The apparatus allows an unobstructed view of the wire in proximity to the workpiece during the alignment, positioning, repositioning, and cutting operations.

摘要翻译： 公开了一种用于在诸如单点接合尖端的微小表面上加工非常精细，平滑的切割和凹槽的方法和装置。 本发明使往复切割线的轴线在往复运动的方向上精确对准，并允许切割线在工作表面上精确定位和重新定位。 该装置允许在对准，定位，重新定位和切割操作期间在工件附近的导线的无障碍视图。

公开(公告)号：US4970365A

公开(公告)日：1990-11-13

申请号：US489838

申请日：1990-03-02

申请人： Pedro A. Chalco

发明人： Pedro A. Chalco

IPC分类号： B23K1/005 ,  B23K20/10 ,  B23K26/06 ,  H05K3/32

CPC分类号： H01L24/85 ,  B23K1/0056 ,  B23K20/10 ,  B23K26/0093 ,  B23K26/06 ,  H01L24/50 ,  H01L24/78 ,  H01L24/80 ,  H05K3/328 ,  H01L2224/05647 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/48847 ,  H01L2224/78301 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H05K2201/10628 ,  H05K2201/10681 ,  H05K2203/0285 ,  H05K2203/107

摘要： Component leads are bonded to pads disposed on a non-rigid substrate by the application of a combination of laser energy and ultrasonic energy. The pads preferably are bare copper pads, without a noble metal coating or a chemical pretreatment, and the non-rigid substrate is preferably an epoxy printed circuit board.

摘要翻译： 通过应用激光能量和超声波能量的组合，将元件引线结合到设置在非刚性基板上的焊盘。 焊盘优选是裸铜焊盘，没有贵金属涂层或化学预处理，非刚性基板优选为环氧印刷电路板。

公开(公告)号：US4894509A

公开(公告)日：1990-01-16

申请号：US283668

申请日：1988-12-13

申请人： Pedro A. Chalco ,  Joseph C. Andreshak

发明人： Pedro A. Chalco ,  Joseph C. Andreshak

IPC分类号： B23K3/02 ,  B23K1/005 ,  B23K3/04 ,  B23K26/06 ,  B23K101/40 ,  B29C35/08 ,  B29C65/24 ,  H05K3/34

CPC分类号： B23K26/0643 ,  B23K1/0056 ,  B23K26/06 ,  B23K26/064 ,  H05K3/3421 ,  H05K3/3494

摘要： A laser assisted miniature heater 10 includes an elongated hollow bar 12 having a high thermal conductivity and a supporting member 14 for conveying an optical fiber 16 which transmits laser radiation to an interiorly disposed hollow cavity 18. The interior surfaces 20 of the cavity 18 are reflective to the laser radiation such that the radiation undergoes repetitive internal reflections along a longitudinal axis of the bar 12. While repetitively reflecting within the cavity 18 the laser radiation is gradually absorbed into the walls of the cavity 18. The absorption of the laser radiation induces a uniform heating of the bar 12 to a temperature which exceeds the melting temperature of eutectic solder. The outer surface 22 of the bar 12, when placed in contact with a plurality of component leads which are each adjacent to a respective solder-bearing bonding pad, induces a melting of the solder and the physical and electrical coupling of the leads to their associated bonding pads.