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公开(公告)号:US11244727B2
公开(公告)日:2022-02-08
申请号:US14940084
申请日:2015-11-12
Applicant: Rambus Inc.
Inventor: Gary B. Bronner , Brent S. Haukness , Mark A. Horowitz , Mark D. Kellam , Fariborz Assaderaghi
IPC: G11C16/06 , G11C13/00 , G11C16/26 , G11C7/04 , H01L21/324
Abstract: Control logic within a memory control component outputs first and second memory read commands to a memory module at respective times, the memory module having memory components disposed thereon. Interface circuitry within the memory control component receives first read data concurrently from a first plurality of the memory components via a first plurality of data paths, respectively, in response to the first memory read command, and receives second read data concurrently from a second plurality of the memory components via a second plurality of data paths, respectively, in response to the second memory read command, the first plurality of the memory components including at least one memory component not included in the second plurality of the memory components and vice-versa.
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公开(公告)号:US20210174875A1
公开(公告)日:2021-06-10
申请号:US16953182
申请日:2020-11-19
Applicant: Rambus Inc.
Inventor: Brent S. Haukness , Ian Shaeffer , Gary Bela Bronner
Abstract: A memory system includes an array of non-volatile memory cells and a memory controller having a first port to receive a program command that addresses a number of the memory cells for a programming operation, having a second port coupled to the memory array via a command pipeline, and configured to create a plurality of fractional program commands in response to the program command. Execution of each fractional program command applies a single program pulse to the addressed memory cells to incrementally program the addressed memory cells with program data, where the duration of the program pulse associated with each fractional program command is a selected fraction of the total programming time typically required to program the memory cells.
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公开(公告)号:US10224100B2
公开(公告)日:2019-03-05
申请号:US15100167
申请日:2014-12-03
Applicant: RAMBUS INC.
Inventor: Deepak Chandra Sekar , Brent S. Haukness , Bruce L. Bateman
Abstract: A memory device includes a local bit line coupled to a plurality of memory cells and a global bit line through first and second selectable parallel paths having first and second impedances, respectively. The first path is active in at least one of a set operation or a forming operation and the second path is active in a reset operation. A select device to select a memory element includes a drain having a first doping level and a source having a second doping level lower than the first doping level, wherein the device is configured to provide a first on impedance or a second on impedance to the resistive memory element in response to a control signal.
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公开(公告)号:US20180107542A1
公开(公告)日:2018-04-19
申请号:US15794164
申请日:2017-10-26
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , Lawrence Lai
IPC: G06F11/10
CPC classification number: G06F11/1076 , G06F11/1048
Abstract: A memory component internally generates and stores the check bits of error detect and correct code (EDC). In a first mode, during a read transaction, the check bits are sent to the memory controller along with the data on the data mask (DM) signal lines. In a second mode, an unmasked write transaction is defined where the check bits are sent to the memory component on the data mask signal lines. In a third mode, a masked write transaction is defined where at least a portion of the check bits are sent from the memory controller on the data signal lines coincident with an asserted data mask signal line. By sending the check bits along with the data, the EDC code can be used to detect and correct errors that occur between the memory component and the memory controller.
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公开(公告)号:US20160027498A1
公开(公告)日:2016-01-28
申请号:US14801558
申请日:2015-07-16
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , Scott C. Best , Gary B. Bronner
IPC: G11C11/406
CPC classification number: G11C11/40611 , G11C2211/4061
Abstract: N out of every M number of refresh commands are ignored (filtered out) by a buffer chip on a memory module. N and M are programmable. The buffer receives refresh commands (e.g., auto-refresh commands) from the command-address channel, but does not issue a proportion of these commands to the DRAMs on the module. This reduces the power consumed by refresh operations. The buffer may replace some auto-refresh (REF) commands with activate (ACT) and precharge (PRE) commands directed to specific rows. These rows may have known ‘weak’ cells that require refreshing more often than a majority of the other rows on the module (or component). By ignoring some auto-refresh commands, and directing some others to specific rows that have ‘weak’ cells, the power consumed by refresh operations can be reduced.
Abstract translation: 每个M个刷新命令中的N个被存储器模块上的缓冲器芯片忽略(滤除掉)。 N和M是可编程的。 缓冲器从命令地址信道接收刷新命令(例如,自动刷新命令),但不向模块上的DRAM发出这些命令的一部分。 这减少了刷新操作所消耗的功耗。 缓冲区可以用针对特定行的激活(ACT)和预充电(PRE)命令替换一些自动刷新(REF)命令。 这些行可能具有比模块(或组件)上的大多数其他行更频繁刷新的已知“弱”单元格。 通过忽略一些自动刷新命令,并将一些其他命令指向具有“弱”单元格的特定行,可以减少刷新操作消耗的功率。
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公开(公告)号:US09202572B2
公开(公告)日:2015-12-01
申请号:US14097503
申请日:2013-12-05
Applicant: Rambus Inc.
Inventor: Gary B. Bronner , Brent S. Haukness , Mark A. Horowitz , Mark D. Kellam , Fariborz Assaderaghi
IPC: G11C16/00 , G11C16/06 , G11C13/00 , G11C7/04 , H01L21/324
CPC classification number: G11C16/26 , G11C7/04 , G11C13/0002 , G11C13/0033 , G11C13/0035 , G11C16/06 , H01L21/324
Abstract: In response to detecting an event during operation of an integrated-circuit memory device containing charge-storing memory cells, an electric current is enabled to flow through a word line coupled to the charge-storing memory cells for a brief interval to heat the charge-storing memory cells to an annealing temperature range.
Abstract translation: 响应于在包含电荷存储存储单元的集成电路存储器件的操作期间检测到事件,电流能够短暂地流过耦合到电荷存储存储单元的字线,以加热电荷存储单元, 将存储单元存储到退火温度范围。
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公开(公告)号:US08873329B1
公开(公告)日:2014-10-28
申请号:US13741308
申请日:2013-01-14
Applicant: Rambus Inc.
Inventor: Hongzhong Zheng , Brent S. Haukness
Abstract: Row activation operations within a memory component are carried out with respect to patterns of storage cells that constitute a fraction of a row and that have been predicted or predetermined to yield a succession of page hits, thus reducing activation power consumption without significantly increasing memory latency. The patterns of activated storage cells may be predicted or predetermined statically, for example, in response to user input or configuration settings that specify activation patterns to be applied in response to memory request traffic meeting various criteria, or dynamically through run-time evaluation of sequences of memory access requests.
Abstract translation: 存储器组件内的行激活操作相对于构成行的一小部分并且已被预测或预定以产生一连串页面命中的存储单元的模式来执行,从而在不显着增加存储器等待时间的情况下降低激活功率消耗。 激活的存储单元的模式可以静态地预测或预定,例如,响应于用户输入或配置设置,其指定响应于满足各种标准的存储器请求流量而应用的激活模式,或动态地通过序列的运行时评估 的内存访问请求。
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公开(公告)号:US12130703B2
公开(公告)日:2024-10-29
申请号:US18230403
申请日:2023-08-04
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , Lawrence Lai
CPC classification number: G06F11/1076 , G06F11/1048
Abstract: A memory component internally generates and stores the check bits of error detect and correct code (EDC). In a first mode, during a read transaction, the check bits are sent to the memory controller along with the data on the data mask (DM) signal lines. In a second mode, an unmasked write transaction is defined where the check bits are sent to the memory component on the data mask signal lines. In a third mode, a masked write transaction is defined where at least a portion of the check bits are sent from the memory controller on the data signal lines coincident with an asserted data mask signal line. By sending the check bits along with the data, the EDC code can be used to detect and correct errors that occur between the memory component and the memory controller.
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公开(公告)号:US20240152470A1
公开(公告)日:2024-05-09
申请号:US18388994
申请日:2023-11-13
Applicant: Rambus Inc.
Inventor: Liji Gopalakrishnan , Frederick A. Ware , Brent S. Haukness
CPC classification number: G06F13/1668 , G06F3/0604 , G06F3/0647 , G06F3/0659 , G06F3/0673
Abstract: Memory controllers, devices, modules, systems and associated methods are disclosed. In one embodiment, an integrated circuit (IC) memory device is disclosed. The memory device includes an array of storage cells and command interface circuitry to receive an internal transfer command. In response to the internal transfer command, transfer logic reads data from a first portion of the array of storage cells, transfers the data as on-chip transfer data, and writes the on-chip transfer data to a second portion of the array of storage cells. In response to the command interface circuitry receiving an interrupt command, the transfer logic pauses the internal transfer operation, and carries out an unrelated memory access operation involving at least the first portion of the array of storage cells or the second portion of the array of storage cells.
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公开(公告)号:US20240095134A1
公开(公告)日:2024-03-21
申请号:US18373219
申请日:2023-09-26
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , John Eric Linstadt , Scott C. Best
IPC: G06F11/20 , G11C11/4093 , G11C29/52
CPC classification number: G06F11/2094 , G11C11/4093 , G11C29/52 , G06F2201/82
Abstract: A memory module is disclosed. The memory module includes a substrate, and respective first, second and third memory devices. The first memory device is of a first type disposed on the substrate and has addressable storage locations. The second memory device is also of the first type, and includes storage cells dedicated to store failure address information associated with defective storage locations in the first memory device. The third memory device is of the first type and includes storage cells dedicated to substitute as storage locations for the defective storage locations.
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