公开(公告)号：US20210183754A1

公开(公告)日：2021-06-17

申请号：US16800201

申请日：2020-02-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Hoon KIM ,  Seung Eun LEE ,  Young Kwan LEE ,  Hak Chun KIM

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/16

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.

公开(公告)号：US20180279478A1

公开(公告)日：2018-09-27

申请号：US15993107

申请日：2018-05-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Eun LEE ,  Yee Na SHIN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

IPC: H05K1/18 ,  H05K3/46 ,  H01L21/56

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/8203 ,  H01L2924/3512 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10015 ,  H05K2203/1469 ,  Y10T29/4913

Abstract: Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers.

公开(公告)号：US20180130750A1

公开(公告)日：2018-05-10

申请号：US15681839

申请日：2017-08-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Kwon JUNG ,  Bang Chul KO ,  Chul CHOI ,  Jung Hyun CHO ,  Joo Hwan JUNG ,  Yong Ho BAEK ,  Seung Eun LEE

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L27/146 ,  H04N5/335 ,  H04N5/225

CPC classification number: H01L23/5389 ,  H01L23/3114 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/20 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/214 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/146 ,  H01L2924/3511 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/335

Abstract: The present disclosure relates to an image sensor device including: a fan-out semiconductor package including a first semiconductor chip having an active surface on which a connection pad is disposed, a first connection member disposed on the active surface and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, and a sealing material disposed on the first connection member and sealing at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the first connection member and electrically connected to the first connection member; and a third semiconductor chip disposed on the second semiconductor chip and electrically connected to the second semiconductor chip, in which at least one of the second semiconductor chip or the third semiconductor chip may be an image sensor. The present disclosure also relates to an image sensor module including the image sensor device.

公开(公告)号：US20160050752A1

公开(公告)日：2016-02-18

申请号：US14691115

申请日：2015-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD

Inventor： Myung Sam KANG ,  Seung Eun LEE ,  Young Kwan LEE ,  Seung Yeop KOOK ,  Ki Jung SUNG

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/09

CPC classification number: H05K1/111 ,  H05K1/092 ,  H05K3/007 ,  H05K3/243 ,  H05K3/244 ,  H05K3/30 ,  H05K3/4007 ,  H05K3/4682

Abstract: There are provided a printed circuit board including: an insulation layer; circuit patterns buried in the insulation layer; and a bump pad having a lower part buried in the insulation layer and an upper part protruding upwardly from the insulation layer, and a method of manufacturing the printed circuit board.

Abstract translation: 提供了一种印刷电路板，包括：绝缘层; 埋在绝缘层中的电路图案; 以及具有埋在绝缘层中的下部的凸块和从绝缘层向上突出的上部，以及制造印刷电路板的方法。

公开(公告)号：US20240172368A1

公开(公告)日：2024-05-23

申请号：US18202808

申请日：2023-05-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yun Je JI ,  Yong Hoon KIM ,  Seung Eun LEE ,  Joo Hwan JUNG

IPC: H05K1/18 ,  H01L23/00 ,  H01L25/065 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01L24/16 ,  H01L25/0657 ,  H05K1/112 ,  H05K3/4697 ,  H01L2224/16227 ,  H01L2225/06503 ,  H01L2924/12 ,  H05K2201/096

Abstract: A printed circuit board includes: a first board unit including a plurality of first insulating layers and a plurality of first wiring layers respectively disposed on or in the plurality of first insulating layers; a second board unit including one or more second insulating layers and one or more second wiring layers respectively disposed on or in the one or more second insulating layers; and a first passive device embedded in at least one of the first and second board units. The second board unit is disposed on the first board unit, and the first board unit has a second cavity passing through at least a portion of the plurality of first insulating layers on the first passive device based on a stacking direction of the plurality of first wiring layers.

公开(公告)号：US20240147622A1

公开(公告)日：2024-05-02

申请号：US18118217

申请日：2023-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Yoon LEE ,  Seung Eun LEE

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/14 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/185 ,  H05K2201/041 ,  H05K2201/10015 ,  H05K2201/10984 ,  H05K2201/2081

Abstract: A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.

公开(公告)号：US20230178902A1

公开(公告)日：2023-06-08

申请号：US17718708

申请日：2022-04-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee YI ,  Hae Kyo SEO ,  Yong Hoon KIM ,  Seung Eun LEE

IPC: H01Q21/08 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q1/48

CPC classification number: H01Q21/08 ,  H01Q1/243 ,  H01Q9/0407 ,  H01Q1/48

Abstract: An antenna substrate includes a skin layer containing an insulating material, a ground layer containing a conductive material, an insulating layer disposed between the skin layer and the ground layer and including an insulating material different from the insulating material of the skin layer, a plurality of patch antennas disposed between the ground layer and the skin layer, a shielding member disposed between the ground layer and the skin layer, spaced apart from the plurality of patch antennas, and connected to the ground layer, and a shielding post connected to the shielding member, and protruding further than an outer surface of the skin layer, from the shielding member in a direction facing the skin layer, at least a portion of the shielding post being disposed between the plurality of patch antennas.

公开(公告)号：US20210289629A1

公开(公告)日：2021-09-16

申请号：US16902738

申请日：2020-06-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Eun LEE ,  Yong Hoon KIM ,  Jin Won LEE

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H01L23/498

Abstract: A substrate structure includes a first printed circuit board having a first side and a second side opposing each other, and a plurality of passive components connected to the first side of the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components of the plurality of first passive components and a smallest distance between adjacent second passive components of the plurality of second passive components. An electronic device includes a first printed circuit board disposed on a mainboard and having, on opposite sides thereof, a semiconductor chip and a plurality of passive components.

公开(公告)号：US20200328160A1

公开(公告)日：2020-10-15

申请号：US16521271

申请日：2019-07-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Rok KIM ,  Young Sik HUR ,  Young Kwan LEE ,  Jung Hyun CHO ,  Seung Eun LEE

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/495 ,  H01L23/522 ,  H01L23/498 ,  H01L23/50 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor package includes: a core structure having first and second surfaces and having first and second through-holes; a first semiconductor chip embedded in the core structure and having first and second contacts disposed on two opposing surfaces thereof, respectively; a first wiring layer on the surface of the core structure and connected to the first contact; a second wiring layer on the second surface of the core structure and connected to the second contact; a chip antenna disposed in the first through-hole; a second semiconductor chip in the second through-hole and having a connection pad; a first redistribution layer on the first surface of the core structure and connected to the connection terminal, the connection pad, and the first wiring layer; an encapsulant encapsulating the chip antenna and the second semiconductor chip; and a second redistribution layer on the encapsulant connecting to the second wiring layer.

公开(公告)号：US20170294469A1

公开(公告)日：2017-10-12

申请号：US15370604

申请日：2016-12-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Eun LEE ,  Jin Seon PARK ,  Yul Kyo CHUNG ,  Chul CHOI ,  Dae Young JUNG ,  Seung Yeop KOOK

IPC: H01L27/146 ,  H04N5/225 ,  H01L25/18

CPC classification number: H04N5/2253 ,  H01L24/20 ,  H01L25/18 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/04105

Abstract: A substrate for a camera module includes: a first substrate; an image sensor installed on the first substrate and a memory chip installed to be embedded in the first substrate. The first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion, and at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion.