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公开(公告)号：US20230171900A1
公开(公告)日：2023-06-01
申请号：US17704303
申请日：2022-03-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Woong CHOI , Yun Je JI , Seung Eun LEE , Yong Hoon KIM
IPC: H05K3/46 , H05K1/11 , H05K3/34 , H01L23/498
CPC classification number: H05K3/4697 , H01L23/49822 , H01L23/49838 , H05K1/115 , H05K3/34 , H05K3/4644 , H05K2201/096 , H05K2201/10015 , H05K2201/10734
Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers and having a cavity penetrating through a portion of the plurality of insulating layers, a passive component disposed in the cavity and including an external electrode electrically connected to at least one of the plurality of wiring layers, and a bridge disposed on the passive component in the cavity and including one or more circuit layers electrically connected to the external electrode.
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公开(公告)号：US20150351231A1
公开(公告)日：2015-12-03
申请号：US14722066
申请日：2015-05-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Kwan LEE , Myung Sam KANG , Seung Yeop KOOK , Kwang Hee KWON , Seung Eun LEE , Ki Jung SUNG
CPC classification number: H05K1/0271 , H01L24/13 , H01L24/16 , H01L24/48 , H01L2224/04042 , H01L2224/131 , H01L2224/16111 , H01L2224/16237 , H01L2224/48237 , H05K1/0209 , H05K3/0097 , H05K2201/068 , H05K2201/09472 , H05K2201/10553 , H05K2203/0369 , H05K2203/1536 , Y10T29/49131 , Y10T29/49149 , H01L2924/014
Abstract: Disclosed herein is a circuit board in which a metal plate is provided on a surface coupled to a device, and a connection pad is exposed through an opening part of the metal plate to be electrically connected to the device. The circuit board may have the device mounted thereon and a connection terminal of the device and a connection pad of the circuit board may be connected to each other by a wire, or the like.
Abstract translation: 这里公开了一种电路板，其中金属板设置在耦合到器件的表面上，并且连接焊盘通过金属板的开口部分暴露以与该器件电连接。 电路板可以具有安装在其上的装置，并且该装置的连接端子和电路板的连接焊盘可以通过导线等相互连接。
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公开(公告)号：US20250071902A1
公开(公告)日：2025-02-27
申请号：US18625488
申请日：2024-04-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Eun LEE , Ki Hwan KIM
Abstract: The present disclosure relates to a printed circuit board including: a glass layer; a plurality of blind cavities respectively penetrating through a portion of the glass layer from an upper surface or a lower surface of the glass layer; a plurality of passive elements respectively disposed in the plurality of blind cavities; and an insulating layer covering at least a portion of each of the glass layer and the plurality of passive elements and disposed in at least a portion of each of the plurality of blind cavities. At least two of the plurality of blind cavities have different depths.
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公开(公告)号：US20210410285A1
公开(公告)日：2021-12-30
申请号：US17215916
申请日：2021-03-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Eun LEE , Jae Woong CHOI , Joo Hwan JUNG , Yong Hoon KIM , Jin Won LEE
Abstract: A printed circuit board includes a first insulating layer, a second insulating layer disposed on a lower surface of the first insulating layer, an electronic component embedded in the second insulating layer and at least partially in contact with the first insulating layer, a first wiring layer disposed on an upper surface of the first insulating layer, a second wiring layer disposed on a lower surface of the second insulating layer, and a first wiring via penetrating through the first and second insulating layers and connecting at least portions of the first and second wiring layers to each other.
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公开(公告)号：US20160050755A1
公开(公告)日：2016-02-18
申请号：US14824598
申请日：2015-08-12
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Myung Sam KANG , Young Kwan LEE , Seung Eun LEE , Seung Yeop KOOK
Abstract: There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board.
Abstract translation: 提供了一种印刷电路板，包括：形成通孔的绝缘层; 通孔中形成的通孔; 形成在绝缘层之下并电连接到通孔的第一电路图案; 以及形成在所述绝缘层上以与所述通孔接合的第二电路图案; 其中所述通孔的直径小于所述通孔的直径，以及制造印刷电路板的方法。
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Patent Agency Ranking
公开(公告)号：US20160029488A1
公开(公告)日：2016-01-28
申请号：US14724496
申请日：2015-05-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myung Sam KANG , Seung Eun LEE , Ki Jung SUNG , Yul Kyo CHUNG
CPC classification number: H05K1/056 , H05K3/4038 , H05K3/4608 , H05K2201/0154 , H05K2201/096 , H05K2201/09827
Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes a metal core; a through via penetrating through the metal core; and an insulating film formed between the metal core and the through via.
Abstract translation: 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例的印刷电路板包括金属芯; 通孔穿过金属芯; 以及形成在金属芯和通孔之间的绝缘膜。
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7.发明申请公开(公告)号：US20150342047A1
公开(公告)日：2015-11-26
申请号：US14722084
申请日：2015-05-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myung Sam KANG , Ki Jung SUNG , Seung Yeop KOOK , Seung Eun LEE
CPC classification number: H05K3/40 , H01L2224/48471 , H05K1/09 , H05K1/114 , H05K1/181 , H05K3/10 , H05K3/188 , H05K3/244 , H05K2203/049 , Y02P70/611 , Y10T29/49156
Abstract: Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc.
Abstract translation: 公开了一种电路板，其具有用于与外部装置连接的接触焊盘，其从最外层绝缘层的上表面突出。 设备可以安装在电路板上，并且设备的连接端子可以通过电线等连接到电路板的接触焊盘。
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8.发明申请公开(公告)号：US20140182896A1
公开(公告)日：2014-07-03
申请号：US14143616
申请日：2013-12-30
Applicant: SAMSUNG, ELECTRO-MECHANICS CO., LTD.
Inventor： Doo Hwan LEE , Yul Kyo CHUNG , Dae Hyun PARK , Yee Na SHIN , Seung Eun LEE
CPC classification number: H05K1/185 , H01L2224/16227 , H01L2924/15313 , H05K1/0231 , H05K3/4602 , H05K3/4644 , H05K2201/10015 , Y10T29/49139
Abstract: A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up insulating layers stacked on or beneath the first insulating layer; upper and lower circuit patterns formed on the build-up insulating layers, respectively; and a plurality of vias connecting the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern.
Abstract translation: 嵌入其中的电子部件的基板包括：第一绝缘层，包括空腔，并且分别包括设置在其上表面和下表面上的第一和第二电路图案; 所述电子部件至少部分地插入所述腔并包括外部电极; 堆叠在所述第一绝缘层上或下的多个积层绝缘层; 分别形成在积层绝缘层上的上下电路图案; 以及连接外部电极，上部电路图案，第一电路图案，第二电路图案和下部电路图案的多个通孔。
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公开(公告)号：US20140144676A1
公开(公告)日：2014-05-29
申请号：US14092331
申请日：2013-11-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yul Kyo CHUNG , Doo Hwan LEE , Seung Eun LEE , Yee Na SHIN
CPC classification number: H05K1/186 , H01L2924/15311 , H05K3/4644 , H05K3/4697 , H05K2201/10015 , H05K2201/10636 , Y02P70/611 , Y10T29/4913
Abstract: The present invention relates to an electronic component embedded substrate including: a first insulating layer including a cavity; an electronic component inserted in the cavity; a first metal pattern formed on a lower surface of the first insulating layer to mount the electronic component thereon and including at least one guide hole for exposing a portion of the external electrode; a second insulating layer formed on the lower surface of the first insulating layer to cover the first metal pattern; a first circuit pattern formed on a lower surface of the second insulating layer; and a first via for electrically connecting the first external electrode exposed through the guide hole and the first circuit pattern, and can improve electrical connectivity between the external electrode and the via even when the size of the external electrode of the electronic component is reduced than before.
Abstract translation: 电子部件嵌入式基板技术领域本发明涉及电子部件嵌入式基板，具备：包括空腔的第一绝缘层; 插入腔内的电子部件; 形成在所述第一绝缘层的下表面上以将所述电子部件安装在其上并且包括用于暴露所述外部电极的一部分的至少一个引导孔的第一金属图案; 形成在所述第一绝缘层的下表面上以覆盖所述第一金属图案的第二绝缘层; 形成在所述第二绝缘层的下表面上的第一电路图案; 以及用于电连接通过引导孔暴露的第一外部电极和第一电路图案的第一通孔，并且即使当电子部件的外部电极的尺寸比以前更小时，也可以改善外部电极和通孔之间的电连接性 。
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10.发明公开公开(公告)号：US20240032202A1
公开(公告)日：2024-01-25
申请号：US18108846
申请日：2023-02-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Yun KIM , Kyung Sang LIM , Seung Eun LEE , Yong Hoon KIM
CPC classification number: H05K1/185 , G02B6/12004 , H05K1/0274 , H05K1/115 , H05K1/183 , H05K2201/10378 , H05K2201/096 , H05K2201/09827 , H05K2201/10121
Abstract: A photonic integrated circuit embedded substrate may include: an embedded insulating layer on which a photonic integrated circuit is disposed, and at least one first insulating layer stacked on one surface of the embedded insulating layer. The at least one first insulating layer may have an optical path extending in a stacking direction of the at least one first insulating layer.
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