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17 条记录 (耗时 0.024 秒)

    Fingerprint sensor package and smart card including fingerprint sensor package
    11.
    发明授权
    Fingerprint sensor package and smart card including fingerprint sensor package 有权

    公开(公告)号：US11954938B2

    公开(公告)日：2024-04-09

    申请号：US18131133

    申请日：2023-04-05

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Gwangjin Lee ,  Jaehyun Lim ,  Heeyoub Kang ,  Hyunjong Moon ,  Yun Seok Choi ,  Inho Choi

    IPC分类号： G06V40/13 ,  G06K19/073 ,  G06K19/077

    CPC分类号： G06V40/1306 ,  G06K19/07354 ,  G06K19/07747

    摘要： A fingerprint sensor package includes a first substrate having a core insulating layer with a first surface and a second surface, and a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer, and an external connection pad, a second substrate disposed in the through-hole of the core insulating layer and including a plurality of first sensing patterns, a plurality of second sensing patterns, and a second bonding pad, a conductive wire connecting the first bonding pad and the second bonding pad to each other, a controller chip disposed on the second substrate, and a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.

    Image encoder, an image sensing device, and an operating method of the image encoder
    12.
    发明授权
    Image encoder, an image sensing device, and an operating method of the image encoder 有权

    公开(公告)号：US11856320B2

    公开(公告)日：2023-12-26

    申请号：US18158501

    申请日：2023-01-24

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Won Seok Lee ,  Seong Wook Song ,  Yun Seok Choi

    IPC分类号： H04N5/917 ,  H04N19/14 ,  H04N23/80

    CPC分类号： H04N5/917 ,  H04N19/14 ,  H04N23/80

    摘要： The present disclosure provides an image encoder. The image encoder is configured to encode an original image and reduce compression loss. The image encoder comprises an image signal processor and a compressor. The image signal processor is configured to receive a first frame image and a second frame image and generates a compressed image of the second frame image using a boundary pixel image of the first frame image. The image signal processor may include memory configured to store first reference pixel data which is the first frame image. The compressor is configured to receive the first reference pixel data from the memory and generate a bitstream obtained by encoding the second frame image based on a difference value between the first reference pixel data and the second frame image. The image signal processor generates a compressed image of the second frame image using the bitstream generated by the compressor.

    Semiconductor package including a thermal pillar and heat transfer film
    14.
    发明授权
    Semiconductor package including a thermal pillar and heat transfer film 有权

    公开(公告)号：US11502059B2

    公开(公告)日：2022-11-15

    申请号：US16724592

    申请日：2019-12-23

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Heejung Hwang ,  Jae Choon Kim ,  Yun Seok Choi

    IPC分类号： H01L25/065 ,  H01L23/367

    摘要： A semiconductor package includes: a first thermal pillar disposed on a package substrate, and having an opening; a first chip stack disposed on the package substrate and in the opening of the first thermal pillar, and including a first lateral surface; a semiconductor chip disposed on the package substrate and in the opening, wherein the semiconductor chip is spaced apart from the first chip stack; and a first heat transfer film disposed between the first thermal pillar and the first lateral surface of the first chip stack.

    Semiconductor package
    15.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11495574B2

    公开(公告)日：2022-11-08

    申请号：US16840772

    申请日：2020-04-06

    申请人： Samsung Electronics Co., Ltd.

    发明人： Yun Seok Choi

    IPC分类号： H01L23/02 ,  H01L25/065 ,  H01L23/498 ,  H01L25/10 ,  H01L23/00 ,  H01L23/538

    摘要： Disclosed is a semiconductor package comprising a first semiconductor chip, a second semiconductor chip on a first surface of the first semiconductor chip, and a plurality of conductive pillars on the first surface of the first semiconductor chip and adjacent to at least one side of the second semiconductor chip. The first semiconductor chip includes a first circuit layer adjacent to the first surface of the first semiconductor chip. The second semiconductor chip and the plurality of conductive pillars are connected to the first surface of the first semiconductor chip.