公开(公告)号：US20240234388A9

公开(公告)日：2024-07-11

申请号：US18215212

申请日：2023-06-28

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Mina Choi ,  Heejung Hwang

IPC分类号： H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/29186 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204

摘要： A first package structure including a first redistribution structure, at least one first semiconductor chip disposed on the first redistribution structure, a first encapsulant covering the at least one first semiconductor chip, and a first through-via passing through the first encapsulant; a second package structure including a second redistribution structure, at least one second semiconductor chip disposed on the second redistribution structure, a second encapsulant covering the at least one second semiconductor chip, and a second through-via passing through the second encapsulant. The second package structure is disposed on the first package structure. At least one of a first upper end of the first through-via or a second upper end of the second through-via is between a first non-active surface and a second non-active surface.

公开(公告)号：US20240014166A1

公开(公告)日：2024-01-11

申请号：US18218886

申请日：2023-07-06

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Youngdeuk KIM ,  Jaechoon KIM ,  Taehwan KIM ,  Kyungsuk OH ,  Heejung Hwang

IPC分类号： H01L23/00 ,  H01L25/18 ,  H10B80/00 ,  H01L25/00

CPC分类号： H01L24/73 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/33 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/18 ,  H10B80/00 ,  H01L25/50 ,  H01L2224/05025 ,  H01L2224/05155 ,  H01L2224/05073 ,  H01L2224/05564 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2224/05647 ,  H01L2224/80359 ,  H01L2924/0544 ,  H01L2924/059 ,  H01L2224/06505 ,  H01L2224/08145 ,  H01L2224/13111 ,  H01L2224/13109 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13147 ,  H01L2224/13139 ,  H01L2224/13118 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2924/014 ,  H01L2224/16145 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32013 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/80357 ,  H01L2224/81203 ,  H01L2224/83203 ,  H01L2224/9211 ,  H01L2224/92222 ,  H01L2224/92242 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/9222

摘要： A semiconductor package including: a lower chip; a chip structure including stacked semiconductor chips; and an adhesive film, the semiconductor chips include first bonding chips bonded to each other by bumps and second bonding chips directly bonded to each other, the first bonding chips include: a first bonding lower chip including a first bonding upper pad; and a first bonding upper chip on the first bonding lower chip and including a first bonding lower pad, the second bonding chips include: a second bonding lower chip including a second bonding upper insulating layer and a second bonding upper pad; and a second bonding upper chip on the second bonding lower chip and including a second bonding lower insulating layer, and a second bonding lower pad, and the adhesive film surrounds side surfaces of the bumps, fills a region between the first bonding lower and upper chips, and protrudes from the region.

公开(公告)号：US20240136340A1

公开(公告)日：2024-04-25

申请号：US18215212

申请日：2023-06-27

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Mina Choi ,  Heejung Hwang

IPC分类号： H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/29186 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204

摘要： A first package structure including a first redistribution structure, at least one first semiconductor chip disposed on the first redistribution structure, a first encapsulant covering the at least one first semiconductor chip, and a first through-via passing through the first encapsulant; a second package structure including a second redistribution structure, at least one second semiconductor chip disposed on the second redistribution structure, a second encapsulant covering the at least one second semiconductor chip, and a second through-via passing through the second encapsulant. The second package structure is disposed on the first package structure. At least one of a first upper end of the first through-via or a second upper end of the second through-via is between a first non-active surface and a second non-active surface.

公开(公告)号：US11502059B2

公开(公告)日：2022-11-15

申请号：US16724592

申请日：2019-12-23

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Heejung Hwang ,  Jae Choon Kim ,  Yun Seok Choi

IPC分类号： H01L25/065 ,  H01L23/367

摘要： A semiconductor package includes: a first thermal pillar disposed on a package substrate, and having an opening; a first chip stack disposed on the package substrate and in the opening of the first thermal pillar, and including a first lateral surface; a semiconductor chip disposed on the package substrate and in the opening, wherein the semiconductor chip is spaced apart from the first chip stack; and a first heat transfer film disposed between the first thermal pillar and the first lateral surface of the first chip stack.

公开(公告)号：US09653373B2

公开(公告)日：2017-05-16

申请号：US14976218

申请日：2015-12-21

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jae Choon Kim ,  Heejung Hwang ,  Eon Soo Jang

IPC分类号： H01L23/34 ,  H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/367 ,  H01L21/4871 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49816 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor package includes a semiconductor chip on a package substrate, a heat spreader on the semiconductor chip, a molding layer, an adhesive film between the semiconductor chip and the heat spreader, and a through-hole passing through the heat spreader. The heat spreader includes a first surface and a second surface. The molding layer covers sidewalls of the semiconductor chip and the heat spreader and exposes the first surface of the heat spreader. The adhesive film is on the second surface of the heat spreader.