Method for manufacturing semiconductor device
    19.
    发明授权
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US09054134B2

    公开(公告)日:2015-06-09

    申请号:US14202670

    申请日:2014-03-10

    Abstract: A larger substrate can be used, and a transistor having a desirably high field-effect mobility can be manufactured through formation of an oxide semiconductor layer having a high degree of crystallinity, whereby a large-sized display device, a high-performance semiconductor device, or the like can be put into practical use. A first multi-component oxide semiconductor layer is formed over a substrate and a single-component oxide semiconductor layer is formed thereover; then, crystal growth is carried out from a surface to an inside by performing heat treatment at 500° C. to 1000° C. inclusive, preferably 550° C. to 750° C. inclusive so that a first multi-component oxide semiconductor layer including single crystal regions and a single-component oxide semiconductor layer including single crystal regions are formed; and a second multi-component oxide semiconductor layer including single crystal regions is stacked over the single-component oxide semiconductor layer including single crystal regions.

    Abstract translation: 可以使用较大的衬底,并且可以通过形成具有高结晶度的氧化物半导体层来制造具有期望的高场敏性迁移率的晶体管,由此大尺寸显示装置,高性能半导体器件, 等可以投入实际使用。 在衬底上形成第一多组分氧化物半导体层,并在其上形成单组分氧化物半导体层; 然后通过在500℃至1000℃(包括端值)进行热处理从表面向内部进行晶体生长,优选550℃至750℃,从而使第一多组分氧化物半导体层 包括单晶区域和形成包括单晶区域的单组分氧化物半导体层; 并且包括单晶区域的第二多分量氧化物半导体层堆叠在包括单晶区域的单组分氧化物半导体层上。

    SEMICONDUCTOR DEVICE
    20.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20140183527A1

    公开(公告)日:2014-07-03

    申请号:US14141538

    申请日:2013-12-27

    Abstract: A highly reliable semiconductor device including an oxide semiconductor is provided. Provided is a semiconductor device including an oxide semiconductor layer, an insulating layer in contact with the oxide semiconductor layer, a gate electrode layer overlapping with the oxide semiconductor layer, and a source electrode layer and a drain electrode layer electrically connected to the oxide semiconductor layer. The oxide semiconductor layer includes a first region having a crystal whose size is less than or equal to 10 nm and a second region which overlaps with the insulating layer with the first region provided therebetween and which includes a crystal part whose c-axis is aligned in a direction parallel to a normal vector of the surface of the oxide semiconductor layer.

    Abstract translation: 提供了包括氧化物半导体的高度可靠的半导体器件。 提供了一种半导体器件,包括氧化物半导体层,与氧化物半导体层接触的绝缘层,与氧化物半导体层重叠的栅极电极层,以及与氧化物半导体层电连接的源极电极层和漏极电极层 。 氧化物半导体层包括具有尺寸小于或等于10nm的晶体的第一区域和与其间设置有第一区域的绝缘层重叠的第二区域,并且其包括其c轴对准的晶体部分 与氧化物半导体层的表面的法线矢量平行的方向。

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