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公开(公告)号：US20200058824A1
公开(公告)日：2020-02-20
申请号：US16536627
申请日：2019-08-09
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Min JANG , Chang Yeon Kim , Myoung Hak Yang
Abstract: A light emitting device including a first light emitting part including a first n-type semiconductor layer, and a first mesa structure including a first active layer, a first p-type semiconductor layer, and a first transparent electrode vertically stacked one over another and exposing a portion of a first surface the first n-type semiconductor layer, a second light emitting part disposed on the exposed portion of the first n-type semiconductor layer and spaced apart from the first mesa structure, and including a second n-type semiconductor layer, a second active layer, a second p-type semiconductor layer, and a second transparent electrode, and a first bonding part bonding and electrically coupling the first n-type semiconductor layer and the second n-type semiconductor layer to each other.
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公开(公告)号：US20190165038A1
公开(公告)日：2019-05-30
申请号：US16198796
申请日：2018-11-22
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Hyeon CHAE , Chung Hoon Lee , Seong Gyu Jang , Chang Yeon Kim , Ho Joon Lee
Abstract: A light emitting diode (LED) stack for a display includes a first LED sub-unit having a first surface and a second surface, a second LED sub-unit disposed on the first surface of the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a reflective electrode disposed on the second side of the second LED sub-unit and forming ohmic contact with the first LED sub-unit, and an ohmic electrode interposed between the first LED sub-unit and the second LED sub-unit and forming ohmic contact with the first LED sub-unit, in which the second LED sub-unit and the third LED sub-unit are configured to transmit light generated from the first LED sub-unit, and the third LED sub-unit is configured to transmit light generated from the second LED sub-unit.
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公开(公告)号：US10283675B2
公开(公告)日：2019-05-07
申请号：US15623375
申请日：2017-06-14
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jong Kyun You , Byoung Kyu Park , Chang Yeon Kim , Chae Hon Kim
Abstract: A light emitting diode including a semiconductor stack including a lower semiconductor layer, an active layer, and an upper semiconductor layer; an upper electrode connected to the upper semiconductor layer and including an electrode pad and extensions extending from the electrode pad; and a lower electrode connected to the lower semiconductor layer. The electrode pad includes a first electrode pad having an elongated shape, disposed along a first side of the upper semiconductor layer, and covering the upper semiconductor layer near the first side of the upper semiconductor layer, and the extensions include an edge extension extending along an edge of the upper semiconductor layer in the electrode pad and surrounding a luminous region and middle extensions extending from the edge extension or the electrode pad and dividing the luminous region into a plurality of luminous regions.
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公开(公告)号：US10249798B2
公开(公告)日：2019-04-02
申请号：US15244744
申请日：2016-08-23
Applicant: Seoul Viosys Co., Ltd.
Inventor： Chang Yeon Kim , Sung Su Son , Joon Sup Lee , Jong Hyeon Chae
Abstract: A light emitting device includes a light emitting structure including a support structure including a first bulk electrode a second bulk electrode disposed on and electrically connected to the first electrode and the second electrode, respectively. A substrate is disposed adjacent to the support structure, wherein each of the first and second bulk electrodes includes an upper region and a lower region with the upper regions of the first and second bulk electrodes being separated from each other by a first distance. The substrate includes a first interconnection portion and a second interconnection portion electrically connected to the first bulk electrode and the second bulk electrode, respectively, and separated from each other by a second distance. The second distance is greater than the first distance.
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公开(公告)号：US10249797B2
公开(公告)日：2019-04-02
申请号：US14694651
申请日：2015-04-23
Applicant: Seoul Viosys Co., Ltd.
Inventor： Chang Yeon Kim , Da Hye Kim , Hong Chul Lim , Joon Hee Lee , Jong Kyun You
Abstract: Exemplary embodiments of the present invention relate to a high-efficiency light emitting diode (LED). The LED according to an exemplary embodiment includes a substrate, a semiconductor stack arranged on the substrate, wherein the semiconductor stack has a p-type semiconductor layer, an active layer and an n-type semiconductor layer, a first metal layer interposed between the substrate and the semiconductor stack, the first metal layer ohmic-contacted with the semiconductor stack, a first electrode pad arranged on the semiconductor stack, an electrode extension extending from the first electrode pad, wherein the electrode extension has a contact region contacting the n-type semiconductor layer, a first insulating layer interposed between the substrate and the semiconductor stack, wherein the first insulating layer covers a surface region of the p-type semiconductor layer under the contact region of the electrode extension, and a second insulating layer interposed between the first electrode pad and the semiconductor stack.
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Patent Agency Ranking
公开(公告)号：US20180226554A1
公开(公告)日：2018-08-09
申请号：US15944681
申请日：2018-04-03
Applicant: Seoul Viosys Co., Ltd.
Inventor： So Ra Lee , Chang Yeon Kim , Ju Yong Park , Sung Su Son
CPC classification number: H01L33/642 , H01L27/15 , H01L27/156 , H01L33/06 , H01L33/08 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/387 , H01L33/44 , H01L33/62
Abstract: Disclosed herein is a light emitting device. The light emitting device is provided to include a light emitting structure, a first electrode pad, a second electrode pad and a heat dissipation pad, and a substrate on which the light emitting diode is mounted. The substrate includes a base; an insulation pattern formed on the base; and a conductive pattern disposed on the insulation pattern. The base includes a post and a groove separating the post from the conductive pattern. An upper surface of the post is placed lower than an upper surface of the conductive pattern, the heat dissipation pad contacts the upper surface of the post, and the first electrode pad and the second electrode pad contact the conductive pattern. With this structure, the light emitting device has excellent properties in terms of electrical stability and heat dissipation efficiency.
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17.发明申请公开(公告)号：US20180190871A1
公开(公告)日：2018-07-05
申请号：US15847735
申请日：2017-12-19
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Chang Yeon Kim , Jong Hyeon Chae
CPC classification number: H01L33/387 , H01L21/02274 , H01L33/0079 , H01L33/10 , H01L33/20 , H01L33/36 , H01L33/38 , H01L33/405 , H01L33/42 , H01L33/486 , H01L33/50 , H01L33/504 , H01L2933/0041 , H01L2933/0091
Abstract: Disclosed are a light-emitting element and a production method therefor. In one aspect, a light-emitting element is provided to comprise a light-emitting structure comprising a first and second semiconductor layers and an active layer; a first and second contact electrodes respectively making ohmic contact with the first and second semiconductor layers; an insulating layer for insulating the first contact electrode and second contact electrode; a first and second bulk electrodes respectively electrically linked to the first and second contact electrodes; an insulating support covering the side surfaces of the first and second bulk electrodes; a first wavelength converter covering the light-emitting structure; a light-transmitting layer positioned on the first wavelength converter; and a second wavelength converter positioned on the light-transmitting layer, and, in the present invention, white light emitted from the light-emitting element has a CIEx value of at least 0.390 on the CIE colour coordinate chart.
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公开(公告)号：US09947849B2
公开(公告)日：2018-04-17
申请号：US15380982
申请日：2016-12-15
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jong Hyeon Chae , Chang Yeon Kim , Sung Su Son , Dae Woong Suh
CPC classification number: H01L33/62 , H01L33/38 , H01L33/44 , H01L33/46 , H01L2224/48091 , H01L2224/73104 , H01L2924/00014
Abstract: Disclosed herein is a light emitting device manufactured by separating a growth substrate in a wafer level. The light emitting device includes: a base; a light emitting structure disposed on the base; and a plurality of second contact electrodes disposed between the base and the light emitting structure, wherein the base includes at least two bulk electrodes electrically connected to the light emitting structure and an insulation support disposed between the bulk electrodes and enclosing the bulk electrodes, the insulation support and the bulk electrodes each including concave parts and convex parts engaged with each other on surfaces facing each other, and the convex parts including a section in which a width thereof is changed in a protrusion direction.
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公开(公告)号：US09941455B2
公开(公告)日：2018-04-10
申请号：US15427802
申请日：2017-02-08
Applicant: Seoul Viosys Co., Ltd.
Inventor： So Ra Lee , Chang Yeon Kim , Ju Yong Park , Sung Su Son
CPC classification number: H01L33/642 , H01L27/15 , H01L27/156 , H01L33/06 , H01L33/08 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/387 , H01L33/44 , H01L33/62
Abstract: Disclosed herein is a light emitting device. The light emitting device is provided to include a light emitting structure, a first electrode pad, a second electrode pad and a heat dissipation pad, and a substrate on which the light emitting diode is mounted. The substrate includes a base; an insulation pattern formed on the base; and a conductive pattern disposed on the insulation pattern. The base includes a post and a groove separating the post from the conductive pattern. An upper surface of the post is placed lower than an upper surface of the conductive pattern, the heat dissipation pad contacts the upper surface of the post, and the first electrode pad and the second electrode pad contact the conductive pattern. With this structure, the light emitting device has excellent properties in terms of electrical stability and heat dissipation efficiency.
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公开(公告)号：US20180076360A1
公开(公告)日：2018-03-15
申请号：US15558143
申请日：2016-03-08
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Hyeon Chae , Chang Yeon Kim , Joon Sup Lee , Dae Woong Suh , Won Young Roh , Ju Yong Park , Seung Hyun Kim
CPC classification number: H01L33/382 , H01L27/15 , H01L33/20 , H01L33/387 , H01L33/405 , H01L33/62
Abstract: A light emitting element according to an embodiment of the present invention comprises a first conductive-type semiconductor layer including a contact region on the lower surface thereof, a light emitting structure which includes a mesa including a second conductive-type semiconductor layer and an active layer, a second electrode, a first insulation layer, an electrode cover layer, a first electrode, a second insulation layer, and a support structure. In addition, the mesa may include a body part and a plurality of protrusion parts protruding from the body part, the contact region may be disposed between the protrusion parts, and a part of the contact region may overlap with a second metal bulk in the vertical direction. Accordingly, current spreading efficiency can be improved, and thus luminance efficiency can be more improved.
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