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    ELECTRONIC COMPONENT
    11.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200258687A1

    公开(公告)日：2020-08-13

    申请号：US16860628

    申请日：2020-04-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon KIM ,  Sang Soo PARK ,  Woo Chul SHIN

    IPC: H01G4/232 ,  H01G4/40

    Abstract: An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ΔL=|A-A′|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A′ is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ΔL is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ΔL/L≤0.100 in which L is a length of the multilayer ceramic capacitor.

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    12.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20200253057A1

    公开(公告)日：2020-08-06

    申请号：US16856444

    申请日：2020-04-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Man Su BYUN ,  Ho Yoon KIM ,  Kyung Hwa YU ,  Dae Heon JEONG ,  Min Kyoung CHEON ,  Soo Hwan SON

    IPC: H05K1/18 ,  H01G4/30 ,  H01G4/232 ,  H01G4/002 ,  H01G4/40 ,  H01G2/06 ,  H05K3/30

    Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

    ELECTRONIC COMPONENTS
    13.
    发明申请
    ELECTRONIC COMPONENTS 审中-公开

    公开(公告)号：US20190355525A1

    公开(公告)日：2019-11-21

    申请号：US16526082

    申请日：2019-07-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon KIM ,  Jae Yeol CHOI ,  Soo Hwan SON

    IPC: H01G4/38 ,  H05K1/11 ,  H01G4/232 ,  H05K1/18 ,  H01G4/30

    Abstract: An electronic component includes: a plurality of multilayer capacitors stacked in multiple rows and columns and each having external electrodes on both ends thereof in a first direction; and a board including a body and a connection portion. The connection portion includes: a plurality of positive electrode land patterns; a plurality of negative electrode land patterns; positive and negative electrode terminal patterns formed on a lower surface of the body to be spaced apart from each other in the first direction; a positive electrode connection portion connecting the plurality of positive electrode land patterns to the positive electrode terminal pattern; and a negative electrode connection portion connecting the plurality of negative electrode land patterns to the negative electrode terminal pattern.

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    14.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20190066919A1

    公开(公告)日：2019-02-28

    申请号：US16001338

    申请日：2018-06-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Jong Duck KIM ,  Dae Heon JEONG ,  Ho Yoon KIM

    IPC: H01G4/12 ,  H01G4/005 ,  H01G2/06 ,  H01G4/30

    Abstract: A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.

    MULTILAYER CAPACITOR AND BOARD HAVING THE SAME
    17.
    发明申请
    MULTILAYER CAPACITOR AND BOARD HAVING THE SAME 有权

    公开(公告)号：US20220181084A1

    公开(公告)日：2022-06-09

    申请号：US17533582

    申请日：2021-11-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Man Su BYUN ,  Ho Yoon KIM ,  Min Kyoung CHEON ,  Soo Hwan SON ,  Won Chul SIM

    IPC: H01G4/224 ,  H01G4/30 ,  H01G4/248

    Abstract: The present disclosure provides a multilayer capacitor and a board component having the same. The multilayer capacitor includes: a capacitor body including dielectric layers, and first and second internal electrodes that are alternately disposed with the dielectric layers interposed therebetween, and having first to sixth surfaces; first and second external electrodes disposed on opposite end portions of the capacitor body in a direction perpendicular to the third and fourth surfaces, and connected to the first and second internal electrodes, respectively; an insulator disposed on the first surface of the capacitor body; a first conductive resin layer covering the first external electrode and one end portion of the insulator in the direction; and a second conductive resin layer covering the second external electrode and the other end portion of the insulator in the direction.

    COMPLEX ELECTRONIC COMPONENT
    19.
    发明申请
    COMPLEX ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20170346279A1

    公开(公告)日：2017-11-30

    申请号：US15381532

    申请日：2016-12-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Ho Yoon KIM ,  Man Su BYUN

    IPC: H02H9/04 ,  H01F27/40

    Abstract: A complex electronic component includes a body including a first external electrode and a second external electrode, disposed on an external surface thereof and a laminate; a plurality of first electrodes and a plurality of second electrodes, disposed in the laminate and electrically connected to the first external electrode and the second external electrode, respectively; a third electrode and a fourth electrode, disposed on the laminate to be spaced apart from each other and electrically connected to the first external electrode and the second external electrode, respectively; and an ESD discharge layer disposed between the third electrode and the fourth electrode. In addition, a distance between the third electrode and the fourth electrode is within a range of 30 μm to 60 μm.

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