-
公开(公告)号:US20250119149A1
公开(公告)日:2025-04-10
申请号:US18897676
申请日:2024-09-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tongsung Kim , Hyeseong Shin , Hyunwoo Ahn , Seonkyoo Lee , Hyunsung Lee , Daechul Jeong
Abstract: A memory chip performs phase calibration and duty cycle correction operations using first and second loop circuits. The first loop circuit includes a phase detector, a first counter, and a delay cell. The second loop circuit includes a phase generator, the phase detector, a second counter, and a duty correction circuit (DCC).
-
公开(公告)号:US20250078888A1
公开(公告)日:2025-03-06
申请号:US18791722
申请日:2024-08-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Tongsung Kim , Woojung Kim , Seonkyoo Lee
Abstract: A memory device correcting a data strobe signal when performing a write operation includes a correction circuit configured to receive the data strobe signal and to generate a reference delay for the received data strobe signal, and a main circuit configured to correct the data strobe signal based on the reference delay generated by the correction circuit. The correction circuit includes a delay cell configured to generate a reference delay for the data strobe signal received by the main circuit and to store the generated reference delay, when a data signal is input to the main circuit, a first counter configured to adjust the reference delay, and a second counter configured to determine a delay of the data strobe signal received by the main circuit, when a write operation is performed.
-
公开(公告)号:US12210773B2
公开(公告)日:2025-01-28
申请号:US17528285
申请日:2021-11-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngmin Jo , Tongsung Kim , Chiweon Yoon , Seonkyoo Lee , Byunghoon Jeong
Abstract: A method of operating a storage device including first and second memory devices and a memory controller, which are connected to a single channel, the method including: transmitting first data output from the first memory device to the memory controller through a data signal line in the single channel; and transmitting a command to the second memory device through the data signal line while the memory controller receives the first data, wherein a voltage level of the data signal line is based on the command and the first data of the first memory device is loaded on the data signal line, and the first data and the command are transmitted in both directions of the data signal line.
-
公开(公告)号:US12073917B2
公开(公告)日:2024-08-27
申请号:US17404510
申请日:2021-08-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Tongsung Kim , Youngmin Jo , Manjae Yang , Chiweon Yoon , Junha Lee , Byunghoon Jeong
CPC classification number: G11C7/222 , G06F1/04 , G06F3/0604 , G06F3/0659 , G06F3/0673 , G11C29/023 , G11C29/028 , G11C5/145
Abstract: A storage device includes a plurality of memory chips and a chip. The plurality of memory chips includes a first memory chip configured to generate a first signal based on a first clock signal, and a second memory chip configured to generate a second signal based on a second clock signal. The chip is configured to receive the first and second signals and generate and output a first and second comparison signal based on a duty cycle of the first and second signals. The first memory chip is further configured to generate a first corrected signal by adjusting a duty cycle of the first clock signal based on the first comparison signal, and the second memory chip is further configured to generate a second corrected signal by adjusting a duty cycle of the second clock signal based on the second comparison signal.
-
公开(公告)号:US11756592B2
公开(公告)日:2023-09-12
申请号:US17477931
申请日:2021-09-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngmin Jo , Byunghoon Jeong , Tongsung Kim , Chiweon Yoon , Seonkyoo Lee
IPC: G11C7/10
CPC classification number: G11C7/1048 , G11C7/109 , G11C7/1039 , G11C7/1057 , G11C7/1063 , G11C7/1084
Abstract: A memory device includes a memory cell array, a page buffer, a control logic circuit, a plurality of input/output pins, a data bus inversion (DBI) pin, and an interface circuit. The page buffer is connected to the memory cell array. The control logic circuit is configured to control an operation of the memory cell array. The plurality of input/output pins receive a plurality of data signals from the controller. The DBI pin receives a DBI signal from the controller. The interface circuit count a first number of bits having a logic value of 1 and a second number of bits having a logic value of 0 from the data signals and the DBI signal and provide the data signals to the page buffer or the control logic circuit based on the first number and the second number.
-
公开(公告)号:US11736098B2
公开(公告)日:2023-08-22
申请号:US17866517
申请日:2022-07-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tongsung Kim , Youngmin Jo , Chiweon Yoon , Byungkwan Chun , Byunghoon Jeong
CPC classification number: H03K5/14 , H03K5/135 , H03L7/0816 , H03K2005/00247
Abstract: A memory package includes a plurality of memory chips, and an interface chip relaying communications between a controller and the plurality of memory chips and receiving a plurality of signals from the plurality of memory chips. The interface chip includes receivers outputting a data signal and a raw clock signal based on the plurality of signals, a delay circuit outputting a delay clock signal by applying an offset delay corresponding to ½ of one unit interval of the data signal and an additional delay to the raw clock signal, and a sampler sampling the data signal in synchronization with a clock signal. The delay circuit outputs the clock signal generated by removing the offset delay from the delay clock signal when the delay clock signal and the data signal have a phase difference corresponding to one unit interval of the data signal.
-
公开(公告)号:US10998888B2
公开(公告)日:2021-05-04
申请号:US16861903
申请日:2020-04-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongho Shin , Kyungtae Kang , Junha Lee , Tongsung Kim , Jangwoo Lee , Jeongdon Ihm , Byunghoon Jeong
Abstract: A parameter monitoring circuit includes a code generation circuit configured to generate a first code, to which a first offset is applied, and a second code, to which a second offset is applied; a parameter adjustment circuit configured to generate a first parameter and a second parameter by respectively applying the first code and the second code to a current parameter; a comparator circuit configured to generate a first comparison result and a second comparison result, the first comparison result indicating a comparison result between the first parameter and a reference parameter value, and the second comparison result indicating a comparison result between the second parameter and the reference parameter value; and a parameter error detection circuit configured to detect an error in the current parameter, based on the first comparison result and the second comparison result.
-
公开(公告)号:US20250096825A1
公开(公告)日:2025-03-20
申请号:US18772352
申请日:2024-07-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Daechul Jeong , Seonkyoo Lee , Taesung Lee , Tongsung Kim
IPC: H04B1/04 , H03K19/0185
Abstract: A data signal transmitter includes a standby voltage generator, which is configured to selectively output: (i) a data signal during an active operation mode, and (ii) first and second different standby voltages during a standby operation mode, and a repeater block. The repeater block includes: a first CMOS inverter configured to receive the first standby voltage during the standby operation mode, and a second CMOS inverter configured to receive the second standby voltage during the standby operation mode.
-
公开(公告)号:US20250095755A1
公开(公告)日:2025-03-20
申请号:US18932736
申请日:2024-10-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tongsung Kim , Seonkyoo Lee , Younggyu Lee , Taesung Lee
Abstract: Provided is a memory device including a first pad configured to receive a read enable signal from a memory controller, a second pad configured to receive a read duty cycle correct command signal from the memory controller, a first duty correction circuit configured to perform a read duty cycle correct operation, based on the read duty cycle correct command signal received from the memory controller, when the read enable signal is received, and output a data strobe signal generated based on the read duty cycle correct operation, and a second duty correction circuit configured to receive the data strobe signal from the first duty correction circuit, generate first to fourth clock signals having different phases from each other based on the data strobe signal, and perform a write duty cycle correct operation to correct a duty cycle for the first clock signal and the third clock signal which have a phase difference of 180° and to correct a duty cycle for the second clock signal and the fourth clock signal which have a phase difference of 180°, wherein the read duty cycle correct operation and the write duty cycle correct operation are performed simultaneously.
-
公开(公告)号:US20250095754A1
公开(公告)日:2025-03-20
申请号:US18804617
申请日:2024-08-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tongsung Kim , Seonkyoo Lee , Younggyu Lee , Taesung Lee
Abstract: Provided is a memory device including a first pad configured to receive a read enable signal from a memory controller, a second pad configured to receive a read duty cycle correct command signal, a first duty correction circuit configured to perform a read duty cycle correct operation, based on the read duty cycle correct command received from the memory controller, when the read enable signal is received, and output a data strobe signal generated based on the read duty cycle correct operation, and a second duty correction circuit configured to receive the data strobe signal from the first duty correction circuit, generate a divided data strobe signal by dividing the received data strobe signal, and compare the received data strobe signal with the divided data strobe signal to perform a write duty cycle correct operation.
-
-
-
-
-
-
-
-
-