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公开(公告)号：US09638839B2
公开(公告)日：2017-05-02
申请号：US14550192
申请日：2014-11-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eun-sung Lee , Woon-bae Kim , Seung-wan Lee , Jong-hyeon Chang , Min-seog Choi
CPC classification number: G02B3/14 , G02B7/04 , G02B7/102 , G02B23/2438 , Y10T29/49002
Abstract: An optical zoom probe is disclosed. The optical zoom probe includes: at least one liquid lens having a focus which is configured to be adjusted according to a flow of a fluid through a flow path; and a barrel provided to form the flow path and including a narrowed first end part including a first opening through which an image is captured, the at least one liquid lens being provided inside the barrel.
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公开(公告)号：US11121127B2
公开(公告)日：2021-09-14
申请号：US16589773
申请日：2019-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jun-gu Kang , Young-mok Kim , Woon-bae Kim , Dae-cheol Seong , Yune-seok Chung
IPC: H01L27/06 , H01L23/528 , H01L23/48
Abstract: An integrated circuit chip includes a circuit structure, a grounding structure, a bonding layer between the circuit structure and the grounding structure. The circuit structure includes a first substrate, an FEOL structure, and a BEOL structure. The grounding structure includes a second substrate and a grounding conductive layer. The integrated circuit chip includes a first penetrating electrode portion connected to the grounding conductive layer based on extending through the first substrate, the FEOL structure, the BEOL structure, and the bonding layer such that the first penetrating electrode portion is isolated from direct contact with the integrated circuit portion in a horizontal direction extending parallel to an active surface of the first substrate. An integrated circuit package and a display device each include the integrated circuit chip.
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公开(公告)号：US10354967B2
公开(公告)日：2019-07-16
申请号：US15456882
申请日：2017-03-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-woo Kim , Woon-bae Kim , Bo-in Noh , Go-woon Seong , Ji-yong Park
Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.
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公开(公告)号：US10134667B2
公开(公告)日：2018-11-20
申请号：US15964342
申请日：2018-04-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-woo Kim , Jae-min Jung , Ji-yong Park , Jeong-kyu Ha , Woon-bae Kim
IPC: H01L33/48 , H01L23/498 , H01L23/29 , H01L23/00 , H01L23/488 , H01L33/62 , H01L23/492 , H01L25/16
Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
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公开(公告)号：US10078160B2
公开(公告)日：2018-09-18
申请号：US14503559
申请日：2014-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Eun-sung Lee , Woon-bae Kim , Seung-wan Lee , Jong-hyeon Chang , Min-seog Choi
CPC classification number: G02B3/14 , G02B26/005
Abstract: A variable liquid lens system is provided. The variable liquid lens system includes a lens barrel comprising a wall and first and second ends, wherein the first and second ends are substantially transparent, at least one liquid lens disposed in the lens barrel and contacting the wall, the at least one liquid lens comprising a droplet, and a plurality of spaces containing fluid positioned on opposite sides of the at least one liquid lens inside the lens barrel. A plurality of first holes are provided in the wall at a position corresponding to the plurality of spaces. The at least one liquid lens is configured so that a position of the at least one liquid lens within the lens barrel is adjustable by adjusting amounts of the fluid contained in the plurality of spaces via the plurality of first holes.
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Patent Agency Ranking
公开(公告)号：US20180247882A1
公开(公告)日：2018-08-30
申请号：US15964342
申请日：2018-04-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-woo Kim , Jae-min Jung , Ji-yong Park , Jeong-kyu Ha , Woon-bae Kim
IPC: H01L23/498 , H01L23/29 , H01L23/00 , H01L33/62 , H01L23/488 , H01L33/48
CPC classification number: H01L23/4985 , H01L23/29 , H01L23/488 , H01L23/4922 , H01L24/29 , H01L24/32 , H01L25/167 , H01L33/48 , H01L33/62 , H01L2924/143 , H01L2924/186
Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
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公开(公告)号：US09880381B2
公开(公告)日：2018-01-30
申请号：US14446849
申请日：2014-07-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Woon-bae Kim , Seung-wan Lee , Eun-sung Lee , Min-seog Choi
CPC classification number: G02B26/103 , A61B5/0066 , A61B5/0095 , G02B3/14 , G02B15/00
Abstract: A varifocal-type optical scanning probe including an optical fiber scanner and a varifocal lens is provided. The varifocal lens includes: a first membrane lens comprising a first lens surface with a variable curvature and a first pressure surface configured to induce a curvature variation of the first lens surface; a second membrane lens including a second lens surface with a variable curvature and a second pressure surface configured to induce a curvature variation of the second lens surface; a first pressure member disposed to apply a pressure to the first pressure surface; a second pressure member disposed to apply a pressure to the second pressure surface; and a motor configured to transmit a driving force to at least one of the first pressure member and the second pressure member.
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公开(公告)号：US10251559B2
公开(公告)日：2019-04-09
申请号：US13886792
申请日：2013-05-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sung-chan Kang , Woon-bae Kim , Jong-seok Kim , Yong-seop Yoon
Abstract: Laser-induced ultrasonic wave apparatuses and methods of generating images using the same. The laser-induced ultrasonic wave apparatus includes a laser source which irradiates a laser beam to a target object and a thermoelastic material; a thermoelastic material which converts the laser beam to a first ultrasonic wave and irradiates the first ultrasonic wave to the target object; and a receiving unit which receives an echo acoustic wave of the first ultrasonic wave and receives a second ultrasonic wave generated by the target object due to the laser beam.
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公开(公告)号：US09837361B2
公开(公告)日：2017-12-05
申请号：US14874609
申请日：2015-10-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byoung-rim Seo , Woon-bae Kim , Young-doo Jung
IPC: H01L23/52 , H01L21/70 , H01L23/552 , H01L23/00 , H01L23/31 , H01L23/522 , H01L23/60 , H05K1/02
CPC classification number: H01L23/552 , H01L23/3114 , H01L23/3128 , H01L23/5225 , H01L23/60 , H01L24/02 , H01L24/05 , H01L24/13 , H01L2224/02372 , H01L2224/04105 , H01L2224/05025 , H01L2224/12105 , H01L2224/13024 , H01L2224/131 , H01L2224/13147 , H01L2224/80345 , H01L2224/96 , H01L2225/06537 , H01L2924/3025 , H05K1/0218 , H01L2224/03 , H01L2224/11 , H01L2924/014 , H01L2924/00014
Abstract: A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.
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公开(公告)号：US09717476B2
公开(公告)日：2017-08-01
申请号：US14536152
申请日：2014-11-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Woon-bae Kim , Woo-young Jang , Min-seog Choi
CPC classification number: A61B8/4444 , A61B5/0066 , A61B5/0084 , A61B5/0095 , A61B2560/04
Abstract: The probe includes a probe body that includes an internal empty space and is configured to be inserted into a coelom; an energy source module that is disposed in the probe body, and configured to emit an energy beam; first and second view windows that are provided at an end portion of the probe body, have different fields of view, and are configured to transmit the emitted energy beam; and a path changing unit that is disposed in the probe body, and configured to change a traveling path of the emitted energy beam to travel to one of the first view window and the second view window.
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