公开(公告)号：US10586816B2

公开(公告)日：2020-03-10

申请号：US15335854

申请日：2016-10-27

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Toru Takayama ,  Junya Maruyama ,  Mayumi Mizukami ,  Shunpei Yamazaki

IPC: H01L27/12 ,  H01L21/20 ,  H01L21/762 ,  H01L33/44 ,  G02F1/1362 ,  H01L29/24 ,  H01L29/786 ,  G02F1/136 ,  G02F1/1339 ,  G02F1/1341 ,  H01L27/32

Abstract: The present invention provides a peeling off method without giving damage to the peeled off layer, and aims at being capable of peeling off not only a peeled off layer having a small area but also a peeled off layer having a large area over the entire surface at excellent yield ratio. The metal layer or nitride layer 11 is provided on the substrate, and further, the oxide layer 12 being contact with the foregoing metal layer or nitride layer 11 is provided, and furthermore, if the lamination film formation or the heat processing of 500° C. or more in temperature is carried out, it can be easily and clearly separated in the layer or on the interface with the oxide layer 12 by the physical means.

公开(公告)号：US20180108838A1

公开(公告)日：2018-04-19

申请号：US15834163

申请日：2017-12-07

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Toru Takayama ,  Junya Maruyama ,  Shunpei Yamazaki

IPC: H01L51/00

CPC classification number: H01L27/1266 ,  B32B7/06 ,  B32B43/006 ,  B32B2310/0843 ,  B32B2457/08 ,  B32B2457/14 ,  G02F1/1368 ,  G02F2001/13613 ,  H01L21/3221 ,  H01L21/76251 ,  H01L27/1214 ,  H01L27/3244 ,  H01L27/3246 ,  H01L27/3248 ,  H01L27/3258 ,  H01L29/6675 ,  H01L29/66757 ,  H01L29/78663 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/529 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  Y10S438/977 ,  Y10T156/1137 ,  Y10T156/1939

Abstract: There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact property between a first material layer (11) and a second material layer (12) (laser light irradiation, pressure application, or the like) is performed before peeling, and then peeling is conducted by physical means. Therefore, sufficient separation can be easily conducted in an inner portion of the second material layer (12) or an interface thereof.

公开(公告)号：US09929190B2

公开(公告)日：2018-03-27

申请号：US15340387

申请日：2016-11-01

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yumiko Ohno

IPC: H01L29/66 ,  H01L27/12 ,  H01L29/786 ,  H01L51/00 ,  H01L23/29 ,  H01L27/32

CPC classification number: H01L27/1218 ,  H01L23/291 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/3244 ,  H01L29/66757 ,  H01L29/78603 ,  H01L51/0002 ,  H01L51/0021 ,  H01L51/0024 ,  H01L51/003 ,  H01L2221/68368 ,  H01L2924/0002 ,  Y10S438/928 ,  Y10S438/982 ,  H01L2924/00

Abstract: It is an object of the present invention to provide a peeling method that causes no damage to a layer to be peeled and to allow not only a layer to be peeled with a small surface area but also a layer to be peeled with a large surface area to be peeled entirely. Further, it is also an object of the present invention to bond a layer to be peeled to various base materials to provide a lighter semiconductor device and a manufacturing method thereof. Particularly, it is an object to bond various elements typified by a TFT, (a thin film diode, a photoelectric conversion element comprising a PIN junction of silicon, or a silicon resistance element) to a flexible film to provide a lighter semiconductor device and a manufacturing method thereof.

公开(公告)号：US20160372672A1

公开(公告)日：2016-12-22

申请号：US15249543

申请日：2016-08-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Yasuyuki Arai ,  Noriko Shibata

IPC: H01L51/00 ,  H01L29/786 ,  H01L25/00 ,  H01L51/56 ,  H01L21/67 ,  H01L27/32 ,  H01L51/52 ,  H01L51/50 ,  H01L27/12 ,  H01L25/065

CPC classification number: H01L51/0024 ,  G02F1/13306 ,  G02F1/1339 ,  G02F1/1341 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/13452 ,  G02F1/13454 ,  G02F1/1368 ,  G02F2001/13456 ,  G02F2202/28 ,  H01L21/2007 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67236 ,  H01L21/6835 ,  H01L21/76251 ,  H01L25/0657 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1222 ,  H01L27/124 ,  H01L27/1266 ,  H01L27/1274 ,  H01L27/15 ,  H01L27/3248 ,  H01L27/3272 ,  H01L27/3276 ,  H01L29/78675 ,  H01L51/003 ,  H01L51/5012 ,  H01L51/5056 ,  H01L51/5072 ,  H01L51/5088 ,  H01L51/5092 ,  H01L51/5096 ,  H01L51/5206 ,  H01L51/5221 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/308 ,  H01L2251/5323 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: The present invention intends to realize a narrow frame of a system on panel. In addition to this, a system mounted on a panel is intended to make higher and more versatile in the functionality. In the invention, on a panel on which a pixel portion (including a liquid crystal element, a light-emitting element) and a driving circuit are formed, integrated circuits that have so far constituted an external circuit are laminated and formed. Specifically, of the pixel portion and the driving circuit on the panel, on a position that overlaps with the driving circuit, any one kind or a plurality of kinds of the integrated circuits is formed by laminating according to a transcription technique.

Abstract translation: 本发明旨在实现面板上系统的窄帧。 除此之外，安装在面板上的系统旨在使功能更高更通用。 在本发明中，在形成有像素部（包括液晶元件，发光元件）和驱动电路的面板上，层叠形成了构成外部电路的集成电路。 具体地，在面板上的像素部分和驱动电路中，在与驱动电路重叠的位置上，根据转录技术层叠形成任何一种或多种集成电路。

公开(公告)号：US09429800B2

公开(公告)日：2016-08-30

申请号：US13775526

申请日：2013-02-25

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Yasuyuki Arai ,  Noriko Shibata

IPC: H01L27/15 ,  G02F1/1345 ,  H01L21/20 ,  H01L21/683 ,  H01L21/762 ,  H01L27/12

CPC classification number: H01L51/0024 ,  G02F1/13306 ,  G02F1/1339 ,  G02F1/1341 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/13452 ,  G02F1/13454 ,  G02F1/1368 ,  G02F2001/13456 ,  G02F2202/28 ,  H01L21/2007 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67236 ,  H01L21/6835 ,  H01L21/76251 ,  H01L25/0657 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1222 ,  H01L27/124 ,  H01L27/1266 ,  H01L27/1274 ,  H01L27/15 ,  H01L27/3248 ,  H01L27/3272 ,  H01L27/3276 ,  H01L29/78675 ,  H01L51/003 ,  H01L51/5012 ,  H01L51/5056 ,  H01L51/5072 ,  H01L51/5088 ,  H01L51/5092 ,  H01L51/5096 ,  H01L51/5206 ,  H01L51/5221 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/308 ,  H01L2251/5323 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: The present invention intends to realize a narrow flame of a system on panel. In addition to this, a system mounted on a panel is intended to make higher and more versatile in the functionality. In the invention, on a panel on which a pixel portion (including a liquid crystal element, a light-emitting element) and a driving circuit are formed, integrated circuits that have so far constituted an external circuit are laminated and formed. Specifically, of the pixel portion and the driving circuit on the panel, on a position that overlaps with the driving circuit, any one kind or a plurality of kinds of the integrated circuits is formed by laminating according to a transcription technique.

Abstract translation: 本发明意图实现面板上系统的窄火焰。 除此之外，安装在面板上的系统旨在使功能更高更通用。 在本发明中，在形成有像素部（包括液晶元件，发光元件）和驱动电路的面板上，层叠形成了构成外部电路的集成电路。 具体地，在面板上的像素部分和驱动电路中，在与驱动电路重叠的位置上，根据转录技术层叠形成任何一种或多种集成电路。

公开(公告)号：US20160204173A1

公开(公告)日：2016-07-14

申请号：US15075436

申请日：2016-03-21

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Toshimitsu Konuma ,  Junya Maruyama

IPC: H01L27/32

CPC classification number: H01L27/3258 ,  H01L27/12 ,  H01L27/1248 ,  H01L27/3246 ,  H01L27/3248 ,  H01L27/3281 ,  H01L29/78621 ,  H01L29/78627 ,  H01L29/78645 ,  H01L51/0001 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/0038 ,  H01L51/0042 ,  H01L51/005 ,  H01L51/0062 ,  H01L51/0084 ,  H01L51/0085 ,  H01L51/5237 ,  H01L51/524 ,  H01L51/5246 ,  H01L2251/5392 ,  H01L2251/558

Abstract: Failure light emission of an EL element due to failure film formation of an organic EL material in an electrode hole 46 is improved. By forming the organic EL material after embedding an insulator in an electrode hole 46 on a pixel electrode and forming a protective portion 41b, failure film formation in the electrode hole 46 can be prevented. This can prevent concentration of electric current due to a short circuit between a cathode and an anode of the EL element, and can prevent failure light emission of an EL layer.

Abstract translation: 由于电极孔46中的有机EL材料的成膜失败导致的EL元件的发光不良。 通过在像素电极上的电极孔46中嵌入绝缘体并形成保护部分41b之后形成有机EL材料，可以防止在电极孔46中形成失效。 这可以防止由于EL元件的阴极和阳极之间的短路导致的电流集中，并且可以防止EL层的发光不良。

公开(公告)号：US20160070314A1

公开(公告)日：2016-03-10

申请号：US14842327

申请日：2015-09-01

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kei Takahashi ,  Hideaki Shishido ,  Junya Maruyama

IPC: G06F1/18 ,  G06F1/16 ,  G09G5/00

CPC classification number: G06F1/1601 ,  G02F1/133308 ,  G02F1/1345 ,  G02F1/13452 ,  G02F2001/133325 ,  G06F1/1643 ,  G06F1/1652 ,  G09G3/20 ,  G09G3/2096 ,  G09G5/003 ,  G09G2300/0426

Abstract: A novel display panel that is highly convenient or reliable, a novel input/output device that is highly convenient or reliable, or a novel data processor that is highly convenient or reliable is provided. The display panel includes a selection signal line, a first signal line and a second signal line that cross the selection signal line, a first pixel electrically connected to the selection signal line and the first signal line, a second pixel electrically connected to the selection signal line and the second signal line, a first terminal electrically connected to the first signal line, and a second terminal electrically connected to the second signal line.

Abstract translation: 提供非常方便或可靠的新型显示面板，提供非常方便或可靠的新型输入/输出设备或者非常方便或可靠的新型数据处理器。 显示面板包括与选择信号线交叉的选择信号线，第一信号线和第二信号线，电连接到选择信号线和第一信号线的第一像素，电连接到选择信号的第二像素 线路和第二信号线，电连接到第一信号线的第一端子和电连接到第二信号线的第二端子。

公开(公告)号：US09257562B2

公开(公告)日：2016-02-09

申请号：US14636589

申请日：2015-03-03

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Akihisa Shimomura ,  Hidekazu Miyairi ,  Fumito Isaka ,  Yasuhiro Jinbo ,  Junya Maruyama

IPC: H01L21/00 ,  H01L29/786 ,  H01L21/20 ,  H01L27/12 ,  H01L21/02 ,  H01L29/66

CPC classification number: H01L21/02683 ,  H01L21/02422 ,  H01L21/02532 ,  H01L21/02592 ,  H01L21/02686 ,  H01L21/2026 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/1285 ,  H01L29/66757 ,  H01L29/78603 ,  H01L29/78675

Abstract: It is an object to provide a method of manufacturing a crystalline silicon device and a semiconductor device in which formation of cracks in a substrate, a base protective film, and a crystalline silicon film can be suppressed. First, a layer including a semiconductor film is formed over a substrate, and is heated. A thermal expansion coefficient of the substrate is 6×10−7/° C. to 38×10−7/° C., preferably 6×10−7/° C. to 31.8×10−7/° C. Next, the layer including the semiconductor film is irradiated with a laser beam to crystallize the semiconductor film so as to form a crystalline semiconductor film. Total stress of the layer including the semiconductor film is −500 N/m to +50 N/m, preferably −150 N/m to 0 N/m after the heating step.

公开(公告)号：US09202987B2

公开(公告)日：2015-12-01

申请号：US13848168

申请日：2013-03-21

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Toru Takayama ,  Junya Maruyama ,  Mayumi Mizukami ,  Shunpei Yamazaki

IPC: H01L21/00 ,  H01L33/44 ,  H01L21/20 ,  H01L21/762 ,  H01L27/12 ,  G02F1/136

CPC classification number: H01L27/1266 ,  G02F1/1339 ,  G02F1/1341 ,  G02F1/1362 ,  G02F2001/13613 ,  H01L21/2007 ,  H01L21/76251 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1248 ,  H01L27/3262 ,  H01L29/24 ,  H01L29/7869 ,  H01L33/44 ,  H01L2227/326 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention provides a peeling off method without giving damage to the peeled off layer, and aims at being capable of peeling off not only a peeled off layer having a small area but also a peeled off layer having a large area over the entire surface at excellent yield ratio. The metal layer or nitride layer 11 is provided on the substrate, and further, the oxide layer 12 being contact with the foregoing metal layer or nitride layer 11 is provided, and furthermore, if the lamination film formation or the heat processing of 500° C. or more in temperature is carried out, it can be easily and clearly separated in the layer or on the interface with the oxide layer 12 by the physical means.

公开(公告)号：US20150255615A1

公开(公告)日：2015-09-10

申请号：US14656959

申请日：2015-03-13

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shunpei Yamazaki ,  Masakazu Murakami ,  Toru Takayama ,  Junya Maruyama

IPC: H01L29/786 ,  G02F1/1333 ,  H01L51/00 ,  G02F1/1368 ,  H01L27/12 ,  H01L27/32

CPC classification number: H01L27/1218 ,  G02F1/133305 ,  G02F1/1339 ,  G02F1/13394 ,  G02F1/1341 ,  G02F1/1368 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/76251 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1259 ,  H01L27/1262 ,  H01L27/1266 ,  H01L27/156 ,  H01L27/3244 ,  H01L27/3248 ,  H01L27/3262 ,  H01L27/3276 ,  H01L29/66757 ,  H01L29/78603 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/56 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2924/30105 ,  H01L2924/3025 ,  Y02E10/549

Abstract: The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.

Abstract translation: 本发明的目的是提供一种用于制造半导体器件的方法，该半导体器件具有以曲率结合到基底材料上的剥离层。 特别地，本发明的目的是提供一种用于制造具有曲率的显示器的方法，更具体地说，提供一种发光器件，该发光器件具有键合到具有曲率的基底材料的OLED。 对原来具有曲率和弹性的支撑件施加外力，并且将支撑件结合到形成在基板上的剥离层。 然后，当基板被剥离时，支撑件通过恢复力返回到原始形状，并且剥离层也沿着支撑件的形状弯曲。 最后，原来具有曲率的转印体被粘合到剥离层上，然后完成具有所需曲率的装置。