公开(公告)号：US07214563B2

公开(公告)日：2007-05-08

申请号：US11319652

申请日：2005-12-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

IPC分类号： H01L21/44

CPC分类号： G06K19/07749 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81

摘要： An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.

摘要翻译： 一种将两个或更多个IC芯片安装在基座上的IC芯片安装方法，包括：通过在其表面上安装带子，准备晶片，该晶片具有安装在基座上的安装表面，并且通过 在离开胶带的同时通过切割将晶片分成IC芯片; 将晶片定位成使得与基座相对的安装表面面向基座的方向面对基座; 在晶片沿着晶片沿指定的一维方向进给的同时沿着基座二维移动的同时，将晶片上的IC芯片依次按压在基板上并临时固定IC芯片; 并且通过间歇加热和加压将临时固定在基座上的IC芯片固定在基座上。

公开(公告)号：US20060131427A1

公开(公告)日：2006-06-22

申请号：US11091935

申请日：2005-03-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G06K19/06 ,  G08B13/14 ,  H01Q17/00

CPC分类号： H01L23/13 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01Q1/2208 ,  H01Q1/36 ,  H01Q7/00 ,  Y10T29/49018 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to avoid the problem due to swelling of the paste caused by a pressing force from bumps of an IC chip. A paste escape recess is provided in which part of the paste provided to form the antenna is caused to flow therein by the pressure received from the bumps when the IC chip with the bumps is connected to the antenna.

摘要翻译： 本发明提供了一种射频识别（RFID）标签，其以非接触方式与外部设备交换信息，其中使用糊料作为天线的材料，并且被设计为避免由于 由IC芯片的凸块的压力引起的糊状物。 提供了一种糊状逃逸凹部，其中当具有凸起的IC芯片连接到天线时，通过从凸起接收的压力使得设置成形成天线的浆料的一部分流入其中。

公开(公告)号：US20060106148A1

公开(公告)日：2006-05-18

申请号：US10994135

申请日：2004-11-19

申请人： Adam Gronowski ,  Yong Seow ,  Shunji Baba ,  Rui Resendes

发明人： Adam Gronowski ,  Yong Seow ,  Shunji Baba ,  Rui Resendes

IPC分类号： C08K3/34

CPC分类号： C08J3/243 ,  C08J2323/22 ,  C08K5/0025 ,  C08K5/14 ,  C08L23/22

摘要： The present invention is directed to a peroxide cured rubber composition containing a non-crosslinked or significantly non-crosslinked (

摘要翻译： 本发明涉及含有非交联或显着非交联（<10重量％凝胶）丁基橡胶聚合物，多烯烃交联剂，过氧化物固化剂和至少一种填料的过氧化物硫化橡胶组合物。 本发明还涉及一种制备过氧化物硫化橡胶组合物的方法，其包括将非交联或显着非交联的丁基橡胶与多烯烃交联剂，至少一种填料和过氧化物固化剂混合，其中该方法 不包括添加非过氧化物固化剂如硫，醌类，树脂和硫供体。

公开(公告)号：US20060043199A1

公开(公告)日：2006-03-02

申请号：US10998138

申请日：2004-11-29

申请人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

发明人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

IPC分类号： G06K19/06

CPC分类号： H01Q1/2208 ,  A63B43/00 ,  A63B2225/54 ,  G06K19/07749 ,  G06K19/07758 ,  G06K19/07786 ,  H01Q7/00

摘要： A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.

公开(公告)号：US06582993B1

公开(公告)日：2003-06-24

申请号：US09658996

申请日：2000-09-11

申请人： Shunji Baba ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma

发明人： Shunji Baba ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma

IPC分类号： H01L2148

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/27 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00

摘要： Prior to setting of a semiconductor device upon the surface of a wiring substrate, the fluid of a light curable reaction resin is supplied from a nozzle to the surface of the wiring substrate. When the predetermined amount of the fluid has been discharged from the nozzle, the fluid within the nozzle is irradiated through a transparent window defined in the nozzle. A hardening reaction is induced in the irradiated segment of the fluid. The reduction in the fluidity can be achieved in the irradiated segment of the fluid. The irradiated segment forms a partition mass in the fluid within the nozzle. A reliable split can thus be achieved between the partition mass and the fluid discharged from the tip end of the nozzle. The split can be utilized to control the supplied amount of the fluid at a higher accuracy.

摘要翻译： 在将布线基板的表面上设置半导体装置之前，将光固化反应树脂的流体从喷嘴供给到布线基板的表面。 当预定量的流体已经从喷嘴排出时，通过在喷嘴中限定的透明窗口照射喷嘴内的流体。 在被照射的流体段中诱发硬化反应。 可以在被照射的流体段中实现流动性的降低。 照射的片段在喷嘴内的流体中形成分隔物质。 因此可以在分隔物质和从喷嘴的尖端排出的流体之间实现可靠的分流。 分流可以用于以更高的精度控制流体的供应量。

公开(公告)号：US06291269B1

公开(公告)日：2001-09-18

申请号：US09409896

申请日：1999-10-01

申请人： Hidehiko Kira ,  Kiyoshi Fukui ,  Kazuhisa Tsunoi ,  Shunji Baba

发明人： Hidehiko Kira ,  Kiyoshi Fukui ,  Kazuhisa Tsunoi ,  Shunji Baba

IPC分类号： H01L2144

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/1184 ,  H01L2224/13 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor bare chip includes a plurality of stud bumps provided on the surface of the semiconductor bare chip body, each of the stud bumps including a seat and a head protruding from the seat. A height of the head is less than a thickness of electrodes on said board.

摘要翻译： 半导体裸芯片包括设置在半导体裸芯片主体的表面上的多个柱形凸块，每个凸起凸块包括座和从该座突出的头部。 头部的高度小于所述板上的电极的厚度。

公开(公告)号：US08763911B2

公开(公告)日：2014-07-01

申请号：US13423422

申请日：2012-03-19

申请人： Shunji Baba ,  Naoki Ishikawa ,  Shigeru Hashimoto ,  Tsuyoshi Niwata ,  Yoshiyasu Sugimura ,  Satoru Nogami ,  Mimpei Miura

发明人： Shunji Baba ,  Naoki Ishikawa ,  Shigeru Hashimoto ,  Tsuyoshi Niwata ,  Yoshiyasu Sugimura ,  Satoru Nogami ,  Mimpei Miura

IPC分类号： G06K19/02

CPC分类号： G06K19/07749 ,  G06K19/07728

摘要： An RFID tag is disclosed that includes a first sheet having flexibility and elasticity; an antenna having flexibility and elasticity and configured to be formed on a surface of the first sheet; an IC chip configured to be electrically connected to the antenna; a second sheet having flexibility and elasticity and configured to be attached to the first sheet and to cover the antenna and the IC chip with the first sheet; and a reinforcing member having flexibility and elasticity and configured to cover the IC chip and a connecting portion of the IC chip and the antenna.

摘要翻译： 公开了一种RFID标签，其包括具有柔性和弹性的第一片; 具有柔性和弹性的天线，并且被构造成形成在所述第一片的表面上; 被配置为电连接到所述天线的IC芯片; 具有柔性和弹性的第二片，并且被配置为附接到第一片并且用第一片覆盖天线和IC芯片; 以及具有柔性和弹性并被构造成覆盖IC芯片和IC芯片和天线的连接部分的加强构件。

公开(公告)号：US08528826B2

公开(公告)日：2013-09-10

申请号：US13047105

申请日：2011-03-14

申请人： Shunji Baba ,  Shigeru Hashimoto ,  Tsuyoshi Niwata ,  Yoshiyasu Sugimura ,  Satoru Nogami ,  Teruhisa Ninomiya ,  Manabu Kai

发明人： Shunji Baba ,  Shigeru Hashimoto ,  Tsuyoshi Niwata ,  Yoshiyasu Sugimura ,  Satoru Nogami ,  Teruhisa Ninomiya ,  Manabu Kai

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/0772 ,  G06K19/07758 ,  Y10T29/49117 ,  Y10T29/49128

摘要： A wireless tag includes a tag-inlet including an antenna pattern formed on a base and an IC chip connected to the antenna pattern on the base, and a flexible member configured to seal the tag-inlet inside the flexible member. In the wireless tag, the tag-inlet is sealed in the flexible member with folded, and the folded tag-inlet has a dielectric spacer formed of the flexible member between the folded tag-inlet.

摘要翻译： 无线标签包括：标签入口，包括形成在基座上的天线图案和连接到基座上的天线图案的IC芯片;以及柔性构件，其构造成将柔性构件内的标签入口密封。 在无线标签中，标签入口被折叠地密封在柔性构件中，并且折叠的标签入口具有由折叠的标签入口之间的柔性构件形成的电介质间隔件。

公开(公告)号：US08471710B2

公开(公告)日：2013-06-25

申请号：US12834294

申请日：2010-07-12

申请人： Shunji Baba ,  Shigeru Hashimoto ,  Tsuyoshi Niwata ,  Satoru Nogami ,  Yoshiyasu Sugimura

发明人： Shunji Baba ,  Shigeru Hashimoto ,  Tsuyoshi Niwata ,  Satoru Nogami ,  Yoshiyasu Sugimura

IPC分类号： G08B21/00

CPC分类号： G06K19/07749 ,  G06K19/07728 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to an aspect of the invention, a wireless tag includes a base member that is flexible and on a surface of which a wiring pattern is formed, a wireless circuit chip that is mounted on the base member and connected to the wiring pattern; protective members that cover the base member and the wireless circuit chip and are lower in hardness than the base member, and a plurality of spherical projections that are arranged on the surfaces of the protective members, higher in hardness than the base member, and so arranged as to interfere with other adjacent spherical projections when at least the protective members are bent beyond a predetermined angle.

摘要翻译： 根据本发明的一个方面，一种无线标签包括：柔性的基底部件，其表面上形成有布线图形;无线电路芯片，其安装在基座部件上并连接到布线图案; 保护构件，其覆盖基部构件和无线电路芯片，并且硬度低于基底构件;以及多个球形突起，其布置在保护构件的表面上，硬度高于基底构件，并且被布置 当至少保护构件弯曲超过预定角度时干涉其它相邻的球形突起。

公开(公告)号：US08009049B2

公开(公告)日：2011-08-30

申请号：US12887826

申请日：2010-09-22

申请人： Shunji Baba ,  Shigeru Hashimoto ,  Yoshiyasu Sugimura ,  Tsuyoshi Niwata ,  Satoru Nogami

发明人： Shunji Baba ,  Shigeru Hashimoto ,  Yoshiyasu Sugimura ,  Tsuyoshi Niwata ,  Satoru Nogami

IPC分类号： G08B13/14

CPC分类号： B32B37/185 ,  B32B38/145 ,  B32B2305/342 ,  B32B2519/02 ,  Y10T156/10

摘要： An RFID tag includes: a tag main body having a communication antenna, a circuit chip electrically connected to the antenna to perform wireless communication via the antenna, and a tabular sealing member in which the antenna and the circuit chip are enclosed; a print layer formed on a first surface of the tag main body by printing; and a protective film that covers the print layer. The print layer is formed only in a central area of the first surface surrounded by a marginal area of the first surface extending along the outer edge of the first surface. The protective film includes a covering portion that covers the print layer and an adhering portion that lies off the print layer while surrounding the outer edge of the print layer and adheres to the first surface.

摘要翻译： RFID标签包括：具有通信天线的标签主体，与天线电连接以通过天线进行无线通信的电路芯片，以及封装有天线和电路芯片的平板状密封构件; 印刷层，其通过印刷形成在所述标签主体的第一表面上; 以及覆盖印刷层的保护膜。 打印层仅形成在第一表面的中心区域中，该第一表面的中心区域被沿着第一表面的外边缘延伸的第一表面的边缘区域包围。 保护膜包括覆盖印刷层的覆盖部分和位于印刷层上的粘附部分，同时围绕印刷层的外边缘并粘附到第一表面。