公开(公告)号：US20130194557A1

公开(公告)日：2013-08-01

申请号：US13760399

申请日：2013-02-06

Applicant: Tokyo Electron Limited

Inventor： Taro YAMAMOTO ,  Kousuke YOSHIHARA ,  Yuichi YOSHIDA

IPC: H01L21/027

CPC classification number: H01L21/027 ,  G03F7/3021 ,  H01L21/67051 ,  H01L21/6715

Abstract: A method of developing a substrate including rotating the substrate and supplying a developing liquid from a discharge port of a developer nozzle onto the surface of the substrate, while moving the developer nozzle, disposed above the substrate, from a central portion towards a peripheral portion of the substrate, and supplying a first rinse liquid from a discharge port of a first rinse nozzle onto the surface of the substrate, while moving the first rinse nozzle, disposed above the substrate, from the central portion towards the peripheral portion of the substrate. The supplying of the developing liquid and the first rinse liquid are performed concurrently, with the first rinse nozzle being maintained nearer to a center of the substrate than the developer nozzle.

Abstract translation: 一种显影衬底的方法，包括使衬底旋转并将显影液从显影剂喷嘴的排出口供应到衬底的表面上，同时将位于衬底上方的显影剂喷嘴从中心部分朝向衬底的周边部分移动 并且将第一冲洗液从第一冲洗喷嘴的排出口提供到基板的表面上，同时将设置在基板上方的第一冲洗喷嘴从中心部分朝向基板的周边部分移动。 同时进行显影液和第一漂洗液的供给，第一冲洗喷嘴比显影剂喷嘴更靠近基板的中心。

公开(公告)号：US20220165597A1

公开(公告)日：2022-05-26

申请号：US17533672

申请日：2021-11-23

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

IPC: H01L21/677 ,  G03F7/16

Abstract: A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US20220165596A1

公开(公告)日：2022-05-26

申请号：US17530581

申请日：2021-11-19

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  G03F7/16

Abstract: A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

公开(公告)号：US20180308719A1

公开(公告)日：2018-10-25

申请号：US16014308

申请日：2018-06-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Koki YOSHIMURA ,  Taro YAMAMOTO ,  Hideharu KYOUDA ,  Koshi MUTA

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/6715

Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

公开(公告)号：US20170225289A1

公开(公告)日：2017-08-10

申请号：US15499402

申请日：2017-04-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akihiro KUBO ,  Masahiro FUKUDA ,  Taro YAMAMOTO ,  Kenzi YADA ,  Masashi ENOMOTO ,  Noboru NAKASHIMA

IPC: B24B37/005 ,  H01L21/67 ,  H01L21/306 ,  B24B37/34 ,  H01L21/02

CPC classification number: B24B37/005 ,  B24B25/00 ,  B24B27/0061 ,  B24B37/34 ,  B24B47/16 ,  B24B49/16 ,  B24D7/18 ,  H01L21/0209 ,  H01L21/30625 ,  H01L21/67046 ,  H01L21/67253

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

公开(公告)号：US20160202609A1

公开(公告)日：2016-07-14

申请号：US15051780

申请日：2016-02-24

Applicant: Tokyo Electron Limited

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshinori IKEDA ,  Koki YOSHIMURA ,  Yoshiki OKAMOTO ,  Masahiro FUKUDA

IPC: G03F7/16

CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

Abstract translation: 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。

公开(公告)号：US20150027503A1

公开(公告)日：2015-01-29

申请号：US14339539

申请日：2014-07-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Koki YOSHIMURA ,  Taro YAMAMOTO ,  Hideharu KYOUDA ,  Koshi MUTA

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/6715

Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

Abstract translation: 一种用于使用处理流体对基板进行液体处理的液体处理装置，包括：沿左右方向并排布置的多个基板保持单元; 喷嘴，被构造成将处理流体供应到保持在每个基板保持单元中的基板; 以及喷嘴移动机构，其构造成使喷嘴在与将基板保持单元的排列方向相交的前后方向向前后方向移动，所述喷嘴移动机构在供给位置和供给位置之间，所述供给位置将所述处理流体供给至包含所述基板的中央部的区域， 限定在与衬底保持单元的行的前侧相对的衬底保持单元的行的后侧处的基准装载和卸载的等待位置。

公开(公告)号：US20140102474A1

公开(公告)日：2014-04-17

申请号：US14049815

申请日：2013-10-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Akihiro FUJIMOTO ,  Shuuichi NISHIKIDO ,  Dai KUMAGAI ,  Naoto YOSHITAKA ,  Takahiro KITANO ,  Yoichi TOKUNAGA

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/0209 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B5/02 ,  B08B7/0057 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68742 ,  H01L21/68764

Abstract: A substrate cleaning apparatus for cleaning a substrate back surface includes a first substrate supporting portion supporting the substrate at a first area of the substrate back surface, the back surface facing down; a second substrate supporting portion supporting the substrate at a second area of the substrate back surface, the second area being separated from the first area; a cleaning liquid supplying portion supplying cleaning liquid to the substrate back surface; a drying portion drying the second area of the substrate back surface; and a cleaning portion cleaning a third area of the substrate back surface when the substrate is supported by the first substrate supporting portion, the third area including the second area, and cleaning a fourth area of the substrate back surface when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area.

Abstract translation: 用于清洗衬底背面的衬底清洁装置包括在衬底背面的第一区域处支撑衬底的第一衬底支撑部分，其背面朝下; 第二基板支撑部，在所述基板背面的第二区域支撑所述基板，所述第二区域与所述第一区域分离; 清洗液供给部，其向所述基板背面供给清洗液; 干燥部，干燥所述基板背面的第二区域; 以及当所述基板被所述第一基板支撑部支撑时，所述清洁部分清洁所述基板背面的第三区域，所述第三区域包括所述第二区域，以及当所述基板被所述第二区域支撑时，清洁所述基板背面的第四区域 第二基板支撑部分，除第二区域之外的第四区域。

公开(公告)号：US20250079215A1

公开(公告)日：2025-03-06

申请号：US18949607

申请日：2024-11-15

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

IPC: H01L21/677 ,  G03F7/16

Abstract: A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US20240036482A1

公开(公告)日：2024-02-01

申请号：US18355918

申请日：2023-07-20

Applicant: Tokyo Electron Limited

Inventor： Masashi TSUCHIYAMA ,  Taro YAMAMOTO

IPC: G03F7/00

CPC classification number: G03F7/7075

Abstract: A substrate treatment system includes: a wet system having a wet treatment apparatus which performs in a wet mode one of substrate treatments from a formation treatment of a resist film to a developing treatment of the resist film after exposure, and coupled to an exposure apparatus; a dry system having a dry treatment apparatus which performs in a dry mode a same kind of substrate treatment by the wet treatment apparatus; and a relay transfer system which transfers the substrate between the wet system and the dry system, wherein: when viewed from a coupling direction, the wet system is arranged such that the exposure apparatus projects from one side in a depth direction perpendicular to the coupling direction in top view; and the dry system is arranged to be adjacent to the one side of the wet system in the depth direction.