公开(公告)号：US20170287626A1

公开(公告)日：2017-10-05

申请号：US15209889

申请日：2016-07-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Jason Larson ,  Mudhafar Hassan-Ali ,  James Toth ,  Ting Gao ,  Jialing Wang

IPC: H01F27/28 ,  H02J7/02 ,  H01F38/14

CPC classification number: H02J7/025 ,  H01F27/2804 ,  H01F27/306 ,  H01F27/365 ,  H01F38/14 ,  H01F2027/2809 ,  H02J50/10

Abstract: Coil assembly including a flux-control body having a magnetic material and a body side. The flux-control body includes a shield wall that defines a coil channel of the flux-control body that opens along the body side to an exterior of the flux-control body. The coil assembly also includes an electrical conductor positioned within the coil channel. The electrical conductor forms a power-transfer coil having co-planar windings that are configured to generate a magnetic flux within a spatial region that is adjacent to the body side. Adjacent windings are separated by the shield wall of the flux-control body. The shield wall controls a distribution of the magnetic flux experienced within the spatial region.

公开(公告)号：US20160300638A1

公开(公告)日：2016-10-13

申请号：US14684266

申请日：2015-04-10

Applicant: Tyco Electronics Corporation ,  Tyco Electronics UK Ltd.

Inventor： Jialing Wang ,  Erling Hansen ,  Mark F. Wartenberg ,  Jennifer L. Robison ,  Sreeni Kurup ,  Richard B. Lloyd ,  Ting Gao

IPC: H01B1/24 ,  H01B1/22 ,  H05K9/00 ,  B29C47/00 ,  B29C47/06

CPC classification number: H01B1/24 ,  B29C48/022 ,  B29C48/10 ,  B29C48/21 ,  B29K2105/0023 ,  B29K2995/0005 ,  B29L2031/3462 ,  H01B1/22 ,  H05K9/0098

Abstract: An article and process are described. The article includes a conductive heat-recoverable composite shield or a conductive heat-recovered composite shield formed from a conductive heat-recoverable composite shield. The conductive composite shield and/or the conductive heat-recovered composite shield formed from a conductive heat-recoverable composite shield comprises a non-conductive matrix and conductive particles within the non-conductive matrix. The article has a resistivity of less than 0.05 ohm·cm. A process of producing the conductive heat-recovered composite shield includes extruding the conductive heat-recoverable composite shield and heating the conductive heat-recoverable composite shield thereby forming the conductive heat-recovered composite shield.

Abstract translation: 描述了一个文章和过程。 该物品包括由导热性可回收复合护罩形成的导热性可回收复合屏蔽层或导电性热回收复合屏蔽层。 导电复合屏蔽层和/或由导电热恢复复合屏蔽层形成的导电热回收复合屏蔽包括非导电基体和非导电基体内的导电颗粒。 该物品的电阻率小于0.05欧姆·厘米。 导电性热回收复合屏蔽体的制造方法包括：挤出导电性可热成膜复合屏蔽体，对导热性复合屏蔽层进行加热，形成导电性热回收复合屏蔽体。

公开(公告)号：US20160300636A1

公开(公告)日：2016-10-13

申请号：US14684270

申请日：2015-04-10

Applicant: Tyco Electronics Corporation

Inventor： Jialing Wang ,  Ting Gao ,  James Toth

IPC: H01B1/22

Abstract: A conductive composite formulation and an article at least partially formed from a conductive composite formulation are disclosed. The conductive composite formulation includes a polymer matrix and a colorant blended with the polymer matrix. The conductive composite formulation and the article each have a compound resistivity of between 0.0005 ohm·cm and 0.2 ohm·cm.

Abstract translation: 公开了导电复合材料制剂和至少部分由导电复合材料制成的制品。 导电复合材料配方包括聚合物基质和与聚合物基体共混的着色剂。 导电复合配方和制品各自具有0.0005欧姆·厘米-2.2欧姆·厘米的复合电阻率。

公开(公告)号：US20160012932A1

公开(公告)日：2016-01-14

申请号：US14329616

申请日：2014-07-11

Applicant: Tyco Electronics Corporation

Inventor： Aaron Holm ,  Dominique Freckmann ,  Jennifer L. Robison ,  Mark F. Wartenberg ,  Jialing Wang ,  Josh H. Golden ,  Ting Gao

IPC: H01B1/22

CPC classification number: H01B1/22 ,  C08K3/08 ,  C08K7/00 ,  C08K7/06 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/014 ,  C08K2201/016

Abstract: A composite formulation and electrical component are disclosed. The composite formulation includes a polymer matrix having at least 15% crystallinity and process-aid-treated copper-containing particles blended with the polymer matrix including higher aspect ratio particles and lower aspect ratio particles. The higher ratio particles and the lower ratio particles produce a decreased percolation threshold for the composite formulation when processed by extrusion or molding, the decreased percolation threshold being compared to a similar composition that fails to include the first particle and the second particles. The electrical component includes a composite product produced from the composite formulation and is selected from the group consisting of an antenna, electromagnetic interference shielding device, a connector housing, and combinations thereof.

Abstract translation: 公开了一种复合制剂和电子组件。 复合制剂包括具有至少15％结晶度的聚合物基质和与聚合物基质混合的加工助剂处理的含铜颗粒，包括较高纵横比的颗粒和较低纵横比的颗粒。 当通过挤出或模塑处理时，较高比例的颗粒和较低比例的颗粒对复合制剂产生降低的渗透阈值，将减少的渗透阈值与不包括第一颗粒和第二颗粒的​​类似组合物进行比较。 电气部件包括由复合制剂制成的复合材料，并选自天线，电磁干扰屏蔽装置，连接器壳体及其组合。

公开(公告)号：US20160012931A1

公开(公告)日：2016-01-14

申请号：US14329684

申请日：2014-07-11

Applicant: Tyco Electronics Corporation ,  Tyco Electronics AMP GmbH

Inventor： Jaydip Das ,  Ting Gao ,  Kavitha Bharadwaj ,  Nicola Pugliano ,  Dominique Freckmann ,  Helge Schmidt

IPC: H01B1/02 ,  H01B1/22

CPC classification number: H01B1/02 ,  B22F1/004 ,  B22F1/0055 ,  B22F1/0088 ,  B22F1/025 ,  B22F3/225 ,  B22F3/227 ,  B22F2998/00 ,  B22F2999/00 ,  C22C1/0491 ,  C22C9/00 ,  H01B1/023 ,  H01B1/026 ,  H01B1/22

Abstract: A conductive particle is disclosed. The conductive particle includes an inner material including a first metal and an outer material surrounding the inner material. The outer material includes a second metal. An intermetallic compound is formed between the inner material and the outer material, the intermetallic compound having features from the inner material and the outer material. The conductive particle has a maximum dimension of less than 200 micrometers and the outer material has an outer material thickness of between 0.2 micrometers and 10 micrometers. The conductive particle is substantially devoid of silver.

Abstract translation: 公开了一种导电颗粒。 导电颗粒包括内部材料，其包括第一金属和围绕内部材料的外部材料。 外部材料包括第二金属。 在内部材料和外部材料之间形成金属间化合物，金属间化合物具有内部材料和外部材料的特征。 导电颗粒的最大尺寸小于200微米，外部材料的外部材料厚度介于0.2微米至10微米之间。 导电颗粒基本上不含银。

公开(公告)号：US10201194B2

公开(公告)日：2019-02-12

申请号：US14709169

申请日：2015-05-11

Applicant: Tyco Electronics Corporation

Inventor： Ting Gao ,  James Toth ,  Jialing Wang ,  Megan L. Hoarfrost ,  Vishrut Vipul Mehta

IPC: A41D13/00 ,  A41D1/00 ,  D06P5/24 ,  D06M11/83 ,  D06M23/16 ,  A41B1/08 ,  D06M23/00 ,  D21H25/04 ,  H01B1/22

Abstract: Processes of applying conductive composites on flexible materials, transfer assemblies, and garments including conductive composites are disclosed. The processes include positioning the conductive composite relative to the flexible material, the conductive composite having a resin matrix and conductive filler, and heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material. Additionally or alternatively, the processes include positioning the conductive composite relative to the clothing, and heating the conductive composite thereby applying the conductive composite on the clothing. The garments include the flexible material and the conductive composite positioned directly on the flexible material. The transfer assembly has the conductive composite on a transfer substrate. The transfer substrate is capable of permitting heating of the conductive composite through the transfer substrate, the heating being at a temperature that permits applying the conductive composite to the flexible material.

公开(公告)号：US20180092258A1

公开(公告)日：2018-03-29

申请号：US15275100

申请日：2016-09-23

Applicant: Tyco Electronics Corporation

Inventor： Megan Hoarfrost Beers ,  Jialing Wang ,  Jaydip Das ,  Richard B. Lloyd ,  James Toth ,  Ting Gao

IPC: H05K9/00 ,  B32B27/20 ,  B32B27/08 ,  B32B27/34 ,  B32B27/30 ,  C08K9/10 ,  C08K3/08

CPC classification number: H05K9/0081 ,  B32B27/08 ,  B32B27/20 ,  B32B27/304 ,  B32B27/34 ,  B32B2264/105 ,  B32B2307/212 ,  C08K3/08 ,  C08K7/00 ,  C08K9/10 ,  C08K2003/085 ,  C08K2201/001 ,  H01B1/22 ,  H05K9/0083 ,  H05K9/009 ,  C08L77/00

Abstract: A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.

公开(公告)号：US20170004946A1

公开(公告)日：2017-01-05

申请号：US14788530

申请日：2015-06-30

Applicant: Tyco Electronics Corporation

Inventor： Edward W. Rutter, JR. ,  Ann O. Banich ,  Jaydip Das ,  Chun-Kwan Tsang ,  Kavitha Bharadwaj ,  Ting Gao ,  Jianhua Chen ,  James Toth

IPC: H01H85/055

CPC classification number: H01B1/22

Abstract: Conductive composite compositions and circuit protection devices including a conductive composite composition are disclosed. The conductive composite composition includes a polymer material, a plurality of conductive particles, and a high melting point additive. The high melting point additive comprises at least 1% of the conductive composite, by volume of the total composition. The circuit protection device includes a body portion comprising a conductive composite composition, the conductive composite composition comprising a polymer material, a plurality of conductive particles, and at least 1%, by volume, of a high melting point additive loaded in the polymer material, and leads extending from the body portion, the leads arranged and disposed to electrically couple the circuit protection device to an electrical system. Also provided is a method of forming a conductive composite.

Abstract translation: 公开了导电复合组合物和包括导电复合材料组合物的电路保护装置。 导电性复合组合物包括聚合物材料，多个导电颗粒和高熔点添加剂。 高熔点添加剂包含至少1％的导电复合材料，按总组合物的体积计。 电路保护装置包括主体部分，其包括导电复合材料组合物，所述导电复合材料组合物包含聚合物材料，多个导电颗粒和至少1体积％的装载在聚合物材料中的高熔点添加剂， 以及从主体部分延伸的引线，布置和布置的引线以将电路保护装置电耦合到电气系统。 还提供了形成导电复合材料的方法。

公开(公告)号：US20160302334A1

公开(公告)日：2016-10-13

申请号：US14684276

申请日：2015-04-10

Applicant: Tyco Electronics Corporation

Inventor： Jialing Wang ,  Richard B. Lloyd ,  Ting Gao ,  Jaydip Das

IPC: H05K9/00 ,  H01B13/22 ,  H01B3/00 ,  H01B7/02 ,  H01B3/30

CPC classification number: H05K9/0098 ,  H01B1/22 ,  H01B1/24 ,  H01B3/004 ,  H01B3/30 ,  H01B7/0216 ,  H01B11/1066 ,  H01B11/1808 ,  H01B13/22 ,  H01P3/06

Abstract: Cable shielding assemblies and processes of producing cable shielding assemblies are described. The cable shielding assemblies include a conductor and a conductive composite shield extending around at least a portion of the conductor, the conductive composite shield having a non-conductive matrix and conductive particles within the non-conductive matrix. The conductive composite shield has a resistivity of less than 0.05 ohm·cm. The processes of producing cable shielding assembles include positioning the conductive composite shield. The positioning is at least partially around a conductor, at least partially around a dielectric material, at least partially surrounded by a jacket material, or a combination thereof.

Abstract translation: 描述了制造电缆屏蔽组件的电缆屏蔽组件和工艺。 电缆屏蔽组件包括导体和围绕导体的至少一部分延伸的导电复合屏蔽件，导电复合屏蔽件具有非导电矩阵和非导电矩阵内的导电颗粒。 导电复合屏蔽层的电阻率小于0.05欧姆·厘米。 制造电缆屏蔽组件的过程包括定位导电复合屏蔽。 该定位至少部分地围绕导体，至少部分地围绕电介质材料，至少部分地被护套材料包围，或其组合。

公开(公告)号：US20160012934A1

公开(公告)日：2016-01-14

申请号：US14329666

申请日：2014-07-11

Applicant: Tyco Electronics Corporation

Inventor： Jaydip Das ,  Ting Gao ,  Mark F. Wartenberg ,  Kavitha Bharadwaj ,  Richard B. Lloyd ,  Rodney Ivan Martens

IPC: H01B1/22

CPC classification number: C08J3/201 ,  B29B7/48 ,  B29B7/82 ,  B29B7/90 ,  B29C48/022 ,  B29C67/24 ,  B29K2027/16 ,  B29K2105/16 ,  B29K2505/06 ,  B29K2505/10 ,  B29L2031/34 ,  C08J2327/16 ,  C08K3/08 ,  C08K3/36 ,  C08K7/00 ,  C08K7/18 ,  C08K9/04 ,  C08K2003/085 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/014 ,  H01B1/22 ,  H01B13/0036 ,  H01Q1/364 ,  H01R13/50 ,  H05K9/0083 ,  C08L27/16

Abstract: A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix having metal particles, the metal particles including dendritic particles and tin-containing particles. The metal particles are blended within the polymer matrix at a temperature greater than the melt temperature of the polymer matrix. The tin containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36%, and the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%. The temperature at which the metal particles are blended generates metal-metal diffusion of the metal particles, producing intermetallic phases, the temperature being at least the intermetallic annealing temperature of the metal particles.

Abstract translation: 公开了复合制剂和复合产品。 复合制剂包括具有金属颗粒的聚合物基质，金属颗粒包括树枝状颗粒和含锡颗粒。 金属颗粒在高于聚合物基体的熔融温度的温度下在聚合物基体内共混。 含锡颗粒在复合制剂中的体积浓度在10％至36％之间，树枝状颗粒的浓度在复合制剂中的体积含量在16％至40％之间。 金属颗粒的混合温度会导致金属颗粒的金属 - 金属扩散，产生金属间相，温度至少为金属颗粒的金属间退火温度。