公开(公告)号：US06433130B1

公开(公告)日：2002-08-13

申请号：US09780340

申请日：2001-02-12

申请人： Koichi Shibayama ,  Masao Ogasa

发明人： Koichi Shibayama ,  Masao Ogasa

IPC分类号： C08F608

CPC分类号： C08F10/02 ,  C08F110/02 ,  C08F4/54 ,  C08F2500/03

摘要： The present inventors has its objects to provide a polymerization catalyst component, a copper compound which can easily be synthesized and is stable. The present invention is related to a method of producing a polymer which comprises using a copper compound represented by the general formula CuXn, LCuXn or L(L′)CnXn (wherein L and L′ each represents a ligand, X represents a halogen atom or an alkoxy, thioxy, allyloxy, amino, secondary amino, tertiary amino, cyano, nitro, alkyl or allyl group, and n represents an integer of 0 to 2) as a catalyst and/or polymerization initiator in polymerizing a vinyl monomer whose polarity value e, when expressed in terms of absolute value, is not more than 1.5.

摘要翻译： 本发明人的目的是提供一种聚合催化剂组分，一种易于合成和稳定的铜化合物。本发明涉及一种制备聚合物的方法，该方法包括使用由通式CuXn表示的铜化合物， LCuXn或L（L'）CnXn（其中L和L'各自表示配体，X表示卤素原子或烷氧基，硫代羟基，烯丙氧基，氨基，仲氨基，叔氨基，氰基，硝基，烷基或烯丙基， n表示0〜2的整数）作为催化剂的聚合引发剂和/或聚合引发剂，其极性值e以绝对值表示时不超过1.5。

公开(公告)号：US06256644B1

公开(公告)日：2001-07-03

申请号：US09085109

申请日：1998-05-28

申请人： Koichi Shibayama

发明人： Koichi Shibayama

IPC分类号： G06F1202

CPC分类号： G06F17/30952 ,  Y10S707/99931 ,  Y10S707/99956

摘要： A system is provided for controlling storing databases in nonvolatile storages by a program. The database is composed as a set of records. In the system, a record storing reference table and data storing areas are provided. There is provided in the reference table, record identification data for identifying records and storage area designation data for designating a storage area in the nonvolatile storages. The data storing area is provided in one of the nonvolatile storages for each record. In the area, a storing logic record is stored. A storing control means is provided for newly storing a record in a storage area designated by the storage area designation data in the record storing reference table. A storing address information of the record in the storage area is stored in one of the data storing areas. A record stored in a storage area is read in based on the address information.

摘要翻译： 提供了一种用于通过程序控制将数据库存储在非易失性存储器中的系统。 数据库由一组记录组成。 在该系统中，提供记录存储参考表和数据存储区。 在参考表中提供了用于识别记录的记录识别数据和用于指定非易失性存储器中的存储区域的存储区域指定数据。 数据存储区域设置在每个记录的非易失性存储器之一中。 在该区域中存储存储逻辑记录。 提供一种存储控制装置，用于将记录新存储在由存储区域指定数据指定的存储区域中的记录存储参考表中。 存储区域中的记录的存储地址信息存储在数据存储区域之一中。 基于地址信息读入存储在存储区域中的记录。

公开(公告)号：US07754803B2

公开(公告)日：2010-07-13

申请号：US10503491

申请日：2003-02-04

申请人： Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

发明人： Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

IPC分类号： C08K3/34 ,  C08K5/98 ,  C08L67/02 ,  C08J5/18 ,  C08K5/50 ,  H05K1/03

CPC分类号： H05K1/0373 ,  C08K3/01 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068

摘要： A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of 1.0×10−3 [° C.−1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

摘要翻译： 提供了具有改进的物理性能，尺寸稳定性，耐热性和阻燃性的树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷电路板，预浸料和粘合片 ，特别是高温物理性能。 含有100重量份热塑性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线膨胀系数（α2）为1.0×10-3 [℃-1]或 在比树脂组合物的玻璃化转变温度高10℃的温度范围内，比在树脂组合物的玻璃化转变温度高50℃的温度范围内。

公开(公告)号：US20080268257A1

公开(公告)日：2008-10-30

申请号：US12164906

申请日：2008-06-30

申请人： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

发明人： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

IPC分类号： B32B17/10

CPC分类号： H01B3/30 ,  B32B15/08 ,  C08K3/34 ,  C08K7/00 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0154 ,  Y10T428/265 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

摘要： It is an object of the invention to provide a material for -insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustionThe invention provides a material for insulating substrate, comprising 100 parts by weight of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin and 0.1 to 100 parts by weight of a layered silicate.

摘要翻译： 本发明的目的是提供一种用于绝缘衬底，印刷电路板，层压体，具有树脂的铜箔，覆铜层压板，聚酰亚胺膜，用于TAB的膜和预浸料的材料。 物理性质，尺寸稳定性，耐热性，阻燃性等，特别是通过燃烧时的形状保持效果而显示优异的阻燃效果本发明提供一种绝缘基材的材料，其包含100重量份的热塑性树脂或 热塑性树脂和热固性树脂的混合物和0.1至100重量份的层状硅酸盐。

公开(公告)号：US20080268237A1

公开(公告)日：2008-10-30

申请号：US12164952

申请日：2008-06-30

申请人： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

发明人： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

IPC分类号： H01B3/00 ,  H01B3/40

CPC分类号： H01B3/30 ,  B32B15/08 ,  C08K3/34 ,  C08K7/00 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0154 ,  Y10T428/265 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

摘要： It is an object of the invention to provide a material for insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustionThe invention provides a material for insulating substrate, comprising 100 parts by weight of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin and 0.1 to 100 parts by weight of a layered silicate.

摘要翻译： 本发明的目的是提供一种用于绝缘基板，印刷电路板，层压板，具有树脂的铜箔，覆铜层压板，聚酰亚胺膜，用于TAB的膜和预浸料的材料，其物理性质优异 特性，尺寸稳定性，耐热性，阻燃性等，特别是通过燃烧时的形状保持效果而显示优异的阻燃效果本发明提供一种绝缘基材的材料，其包含100重量份的热塑性树脂或 热塑性树脂和热固性树脂的混合物和0.1至100重量份层状硅酸盐。

公开(公告)号：US20070148442A1

公开(公告)日：2007-06-28

申请号：US10582881

申请日：2004-12-14

申请人： Koichi Shibayama ,  Koji Yonezawa

发明人： Koichi Shibayama ,  Koji Yonezawa

IPC分类号： G11B5/64

CPC分类号： H05K1/0373 ,  C08K3/34 ,  C08K7/10 ,  C08L21/00 ,  C08L63/00 ,  H05K2201/0209 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/269

摘要： Disclosed is a thermosetting resin composition which enables to obtain a molded article that is excellent in mechanical properties, dimensional stability and heat resistance and is further capable of maintaining the shape of the article molded before curing even after the resin composition is cured. The thermosetting resin composition contains 100 parts by weight of a thermosetting resin and 1-100 parts by weight of an inorganic compound dispersed in the thermosetting resin, and the dispersion particle diameter of the inorganic compound is not more than 2 μm. Not less than 75% of the shape of an article molded before curing is maintained after the resin composition is cured. Also disclosed are a material for substrates and a film for substrates respectively composed by using such a thermosetting resin composition.

摘要翻译： 公开了一种热固性树脂组合物，其能够获得机械性能，尺寸稳定性和耐热性优异的成型体，并且即使在树脂组合物固化后，还能够保持固化前的制品的形状。 热固性树脂组合物含有100重量份热固性树脂和1-100重量份分散在热固性树脂中的无机化合物，并且无机化合物的分散体粒径不大于2μm。 在树脂组合物固化后，保持固化前模制的制品形状的75％以上。 还公开了通过使用这种热固性树脂组合物分别构成的基板材料和基板用薄膜。

公开(公告)号：US20050260404A1

公开(公告)日：2005-11-24

申请号：US10362282

申请日：2001-08-27

申请人： Tetsunari Iwade ,  Koichi Shibayama ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Hiroshi Murayama ,  Tetsuya Kusano ,  Akihiko Bandou

发明人： Tetsunari Iwade ,  Koichi Shibayama ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Hiroshi Murayama ,  Tetsuya Kusano ,  Akihiko Bandou

IPC分类号： B32B27/18 ,  C08K5/3492 ,  B32B5/00

CPC分类号： B32B27/18 ,  B32B7/12 ,  B32B27/32 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  B32B2307/3065 ,  B32B2398/20 ,  B32B2451/00 ,  C08K5/34922 ,  Y10T428/252 ,  Y10T428/28

摘要： There is provided a sheet-form molding which is outstanding in fire retardation and prevention of flame spread, exhibiting good fire retardant and flame spread-preventive effects based on its good form retention during combustion, and also outstanding in mechanical strength and stability, particularly with a reduced incidence of necking and shrinkage, thus insuring high dimensional accuracy in use and precision in application. Particularly, there is provided a sheet-form molding comprising a single layer or a plurality of layers, which has at least one layer consisting essentially of formulating 0.1 to 100 weight parts of a lamellar silicate, and 0.1 to 70 weight parts of a metal hydroxide and/or 0.1 to 50 weight parts of a melamine derivative in each 100 weight parts of a thermoplastic resin.

摘要翻译： 提供了一种片状成型体，其特征在于阻燃和防火焰扩散，基于其在燃烧期间的良好保持性而具有良好的阻燃性和阻燃扩散效果，并且还具有优异的机械强度和稳定性，特别是 收缩缩小的发生率降低，从而确保使用中的尺寸精度和使用精度。 特别地，提供了包括单层或多层的片状模制品，其具有至少一层，其基本上由配制0.1至100重量份的层状硅酸盐和0.1-70重量份的金属氢氧化物 和/或0.1至50重量份的每100重量份热塑性树脂中的三聚氰胺衍生物。

公开(公告)号：US5304580A

公开(公告)日：1994-04-19

申请号：US903585

申请日：1992-06-25

申请人： Koichi Shibayama ,  Masao Ogasa ,  Toshihiro Arai ,  Eiichi Takahashi

发明人： Koichi Shibayama ,  Masao Ogasa ,  Toshihiro Arai ,  Eiichi Takahashi

IPC分类号： C08F255/00 ,  C08F255/02 ,  C08F290/00 ,  C08F299/00 ,  C08J3/20 ,  C08J3/24 ,  C08J9/00 ,  C08J9/06 ,  C08K5/10 ,  C08L23/00 ,  C08L23/04 ,  C08L23/06 ,  C08L23/10 ,  C08L23/12 ,  C08F36/00

CPC分类号： C08J9/0061 ,  C08F255/02 ,  C08L23/06 ,  C08L23/12 ,  C08J2323/02 ,  C08J2423/00 ,  C08L2312/00

摘要： The invention provides an expandable polyolefin resin composition comprising (a) 40 to 100 wt. % of a polypropylene resin having a melt index of 0.5 to 12, (b) 0 to 60 wt. % of a polyethylene resin having a melt index of 2 to 50 (c) 0.5 to 10 parts by weight of the di(meth)acrylate of an aliphatic dihydric alcohol having a methylene group with 2 to 18 carbon atoms between the (meth)acryloyloxy groups at both ends per 100 parts by weight of the combination of the resins (a) and (b), and (d) 1 to 50 parts by weight of a thermally decomposable blowing agent. Preferably the composition further comprises (e) 0.5 to 5 parts by weight of a monofunctional monomer. When uniformly crosslinked, the composition affords an expandable polyolefin resin composition suited to production of a crosslinked polyolefin resin foam excellent in heat resistance, toughness and moldability of formability and appearing homogeneous.

摘要翻译： 本发明提供一种可发性聚烯烃树脂组合物，其包含（a）40至100wt。 熔体指数为0.5〜12的聚丙烯树脂的％，（b）0〜60重量％ 熔融指数为2〜50（c）的聚乙烯树脂的％（c）在（甲基）丙烯酰氧基（甲基）丙烯酰氧基中具有2〜18个碳原子的亚甲基的脂肪族二元醇的二（甲基）丙烯酸酯0.5〜10重量份 （a）和（b）的组合相对于100重量份的两端，和（d）1〜50重量份的热分解发泡剂。 优选地，组合物还包含（e）0.5至5重量份的单官能单体。 当均匀交联时，该组合物提供了适用于生产耐热性，韧性和成型性优异且呈均匀的交联聚烯烃树脂发泡体的可发性聚烯烃树脂组合物。

公开(公告)号：US20130108861A1

公开(公告)日：2013-05-02

申请号：US13582214

申请日：2011-03-31

申请人： Reona Yokota ,  Koichi Shibayama ,  Akihiro Uenishi ,  Hidenobu Deguchi ,  Tomoki Kunikawa ,  Tatsushi Hayashi

发明人： Reona Yokota ,  Koichi Shibayama ,  Akihiro Uenishi ,  Hidenobu Deguchi ,  Tomoki Kunikawa ,  Tatsushi Hayashi

IPC分类号： B32B15/092 ,  C08K3/36

CPC分类号： B32B15/092 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/38 ,  B32B2264/102 ,  B32B2307/538 ,  C08G59/4014 ,  C08G59/42 ,  C08G59/621 ,  C08G59/686 ,  C08J7/00 ,  C08K3/36 ,  C08L63/00 ,  Y10T428/259 ,  Y10T428/268 ,  C08L71/12

摘要： A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 μm but smaller than 0.5 μm, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 μm but not larger than 20 μm. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.

摘要翻译： 预固化材料允许粗糙化处理的表面的表面粗糙度降低，并且增加固化物体和金属层之间的粘合强度。 预固化材料是通过使包含环氧树脂，固化剂和二氧化硅的环氧树脂材料进行固化而得到的。 预固化材料包括待粗化处理的第一主表面和第二主表面。 二氧化硅包括粒径不小于0.01μm但小于0.5μm的第一小粒径二氧化硅和粒径不小于0.5μm但不大于20μm的第二大粒径二氧化硅。 第一小粒径二氧化硅被定位成大量存在于第一主表面的一侧，第二大颗粒直径二氧化硅在第二主表面的一侧大量存在。

公开(公告)号：US20110003914A1

公开(公告)日：2011-01-06

申请号：US12676943

申请日：2009-01-30

申请人： Reona Yokota ,  Koichi Shibayama ,  Kazuyoshi Shiomi ,  Hiroshi Kouyanagi

发明人： Reona Yokota ,  Koichi Shibayama ,  Kazuyoshi Shiomi ,  Hiroshi Kouyanagi

IPC分类号： C08K5/07 ,  C08K5/101

CPC分类号： H05K1/0373 ,  C08K3/36 ,  C08K5/132 ,  C08K5/315 ,  C08L63/00 ,  H05K3/0032 ,  H05K3/4676 ,  H05K2201/0112 ,  H05K2201/0209

摘要： A resin composition is provided which allows improvement of the ultraviolet laser processability of the resin and can be not only used as an electronic material for an insulating film of a build-up board and the like but also used to form a circuit board whose electrical insulating property does not deteriorate. A multilayer resin film employing the resin composition is provided. A resin composition is provided which contains a thermosetting resin (A), a curing agent (B), a silica (C), an ultraviolet absorber (D), and a solvent (E) and in which: the content of the ultraviolet absorber (D) is from 0.5 to 50 parts by weight per the total amount of the thermosetting resin (A), the curing agent (B), and the ultraviolet absorber (D); and the blending amount of the solvent (E) is from 20 to 500 parts by weight per 100 parts by weight of the total amount of the thermosetting resin (A) and the curing agent (B). A multilayer resin film is provided in which the resin composition is laminated on a base material so as to be in a sheet shape and in which: the sheet-shaped resin composition on the base material is dried; and the content of the solvent is from 0.01 to 5 parts by weight with respect to the entire resin composition.

摘要翻译： 提供了树脂组合物，其可以提高树脂的紫外线激光加工性，并且不仅可以用作积层板等的绝缘膜的电子材料，而且还可以用于形成电绝缘的电路板 财产不会恶化。 提供了使用该树脂组合物的多层树脂膜。 提供了含有热固性树脂（A），固化剂（B），二氧化硅（C），紫外线吸收剂（D）和溶剂（E））的树脂组合物，其中：紫外线吸收剂 （D）相对于热固性树脂（A），固化剂（B）和紫外线吸收剂（D）的总量为0.5〜50重量份。 溶剂（E）的配合量相对于100重量份热固性树脂（A）和固化剂（B）的总量为20〜500重量份。 提供一种多层树脂膜，其中树脂组合物层压在基材上以成为片状，并且其中基材上的片状树脂组合物被干燥; 相对于整个树脂组合物，溶剂的含量为0.01〜5重量份。