利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

17 条记录 (耗时 0.032 秒)

    Apparatus for laminating and circuitizing substrates having openings therein
    11.
    发明授权
    Apparatus for laminating and circuitizing substrates having openings therein 失效
    用于层压和电路化具有开口的基板的装置

    公开(公告)号：US5578796A

    公开(公告)日：1996-11-26

    申请号：US466081

    申请日：1995-06-06

    申请人： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  Gerry A. Hackett ,  Jeffrey McKeveny

    发明人： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  Gerry A. Hackett ,  Jeffrey McKeveny

    IPC分类号： H01L21/48 ,  H05K1/18 ,  H05K3/46 ,  H05K1/02

    CPC分类号： H05K3/184 ,  H01L21/4807 ,  H05K3/4697 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/09845 ,  H05K2203/063 ,  H05K2203/308 ,  H05K3/0061 ,  H05K3/4611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： According to the present invention, a method of laminating at least two substrates together and circuitizing at least one surface of the laminate is provided. Pressure is exerted against opposite surfaces of each of said two substrates. An opening extends from a circuit-receiving surface of at least one of said substrates. A plug is provided which is configured to removably fit into said opening and has a support surface thereon which is substantially coplanar with the circuit-receiving surface when said plug is positioned in the opening. The plug is inserted in the opening with the support surface substantially coplanar with the circuit-receiving surface. The substrates are laminated by application of pressure on the opposite surfaces of the substrates. The circuit-receiving surface and the support surface are covered with a sheet of dry film photoresist to seal around the opening with said plug member supporting said sheet of photoresist in the region of the opening. The dry film resist material is patterned and developed in a predetermined pattern, and the surface is circuitized with electrical circuitry. Any remaining photoresist is stripped, and said plug member is removed.

    摘要翻译： 根据本发明，提供了将至少两个基板层合在一起并使层压体的至少一个表面电路化的方法。 对所述两个基板的每一个的相对表面施加压力。 开口从至少一个所述基板的电路接收表面延伸。 提供插头，其构造成可移除地装配到所述开口中并且具有其上的支撑表面，当所述插头位于开口中时，该支撑表面基本上与电路接收表面共面。 插头插入开口中，支撑表面基本上与电路接收表面共面。 通过在衬底的相对表面上施加压力来层压衬底。 电路接收表面和支撑表面被一片干膜光致抗蚀剂覆盖，以在开口的区域中用支撑所述光致抗蚀剂片的插塞构件围绕开口密封。 干膜抗蚀剂材料以预定图案被图案化和显影，并且表面被电路电路化。 剥离任何剩余的光致抗蚀剂，并且去除所述插塞构件。

    Method of laminating and circuitizing substrates having openings therein
    12.
    发明授权
    Method of laminating and circuitizing substrates having openings therein 失效
    层压和电路化具有开口的基板的方法

    公开(公告)号：US5542175A

    公开(公告)日：1996-08-06

    申请号：US359491

    申请日：1994-12-20

    申请人： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  Gerry A. Hackett ,  Jeffrey McKeveny

    发明人： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  Gerry A. Hackett ,  Jeffrey McKeveny

    IPC分类号： H01L21/48 ,  H05K1/18 ,  H05K3/46 ,  H05K3/10

    CPC分类号： H05K3/184 ,  H01L21/4807 ,  H05K3/4697 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/09845 ,  H05K2203/063 ,  H05K2203/308 ,  H05K3/0061 ,  H05K3/4611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： According to the present invention, a method of laminating at least two substrates together and circuitizing at least one surface of the laminate is provided. Pressure is exerted against opposite surfaces of each of said two substrates. An opening extends from a circuit-receiving surface of at least one of said substrates. A plug is provided which is configured to removably fit into said opening and has a support surface thereon which is substantially coplanar with the circuit-receiving surface when said plug is positioned in the opening. The plug is inserted in the opening with the support surface substantially coplanar with the circuit-receiving surface. The substrates are laminated by application of pressure on the opposite surfaces of the substrates. The circuit-receiving surface and the support surface are covered with a sheet of dry film photoresist to seal around the opening with said plug member supporting said sheet of photoresist in the region of the opening. The dry film resist material is patterned and developed in a predetermined pattern, and the surface is circuitized with electrical circuitry. Any remaining photoresist is stripped, and said plug member is removed.

    摘要翻译： 根据本发明，提供了将至少两个基板层合在一起并使层压体的至少一个表面电路化的方法。 对所述两个基板的每一个的相对表面施加压力。 开口从至少一个所述基板的电路接收表面延伸。 提供插头，其构造成可移除地装配到所述开口中并且具有其上的支撑表面，当所述插头位于开口中时，该支撑表面基本上与电路接收表面共面。 插头插入开口中，支撑表面基本上与电路接收表面共面。 通过在衬底的相对表面上施加压力来层压衬底。 电路接收表面和支撑表面被一片干膜光致抗蚀剂覆盖，以在开口的区域中用支撑所述光致抗蚀剂片的插塞构件围绕开口密封。 干膜抗蚀剂材料以预定图案被图案化和显影，并且表面被电路电路化。 剥离任何剩余的光致抗蚀剂，并且去除所述插塞构件。

    PEDIATRIC TISSUE ILLUMINATOR
    13.
    发明申请
    PEDIATRIC TISSUE ILLUMINATOR 审中-公开
    皮质组织照明器

    公开(公告)号：US20120101342A1

    公开(公告)日：2012-04-26

    申请号：US13276321

    申请日：2011-10-19

    申请人： Thomas P. Duffy ,  Gerald T. Harder ,  Kevin Mori

    发明人： Thomas P. Duffy ,  Gerald T. Harder ,  Kevin Mori

    IPC分类号： A61B1/06

    CPC分类号： A61B5/489

    摘要： A pediatric tissue illuminator includes a semi-rigid lighting head removably connected to a powered base unit for illuminating an infant's tissues while stabilizing a limb for venipuncture. The lighting head includes a series of LEDs and is placed behind an infant's arm, thereby directing light therethrough for enhanced viewing. A printed circuit board in the lighting head routes electrical conductors to the LEDs. A translucent soft covering is disposed between the printed circuit board and the infant's body. The base unit includes a control circuit for varying the application of electrical power to the lighting head via an electrical cable. The arm board/light head is inexpensive enough to be disposable. Alternatively, a re-useable light head may be used with disposable semi-rigid housings.

    摘要翻译： 儿科组织照明器包括可移除地连接到动力基座单元上的半刚性照明头，用于照亮婴儿组织，同时稳定肢体以进行静脉穿刺。 照明头包括一系列LED并且被放置在婴儿的手臂后面，从而引导光通过以增强观看。 照明头中的印刷电路板将电导体引导到LED。 在印刷电路板和婴儿身体之间设置半透明的软覆盖物。 基座单元包括用于通过电缆改变对照明头的电功率的控制电路。 手臂板/灯头的价格足够便宜，可以一次性使用。 或者，可重复使用的光头可以与一次性半刚性外壳一起使用。

    Method of fabricating a flex laminate package
    14.
    发明授权
    Method of fabricating a flex laminate package 失效
    柔性层压包装的制造方法

    公开(公告)号：US5620782A

    公开(公告)日：1997-04-15

    申请号：US459929

    申请日：1995-06-02

    申请人： Charles R. Davis ,  Thomas P. Duffy ,  Steven L. Hanakovic ,  Howard L. Heck ,  John T. Kolias ,  John S. Kresge ,  David N. Light ,  Ajit K. Trivedi

    发明人： Charles R. Davis ,  Thomas P. Duffy ,  Steven L. Hanakovic ,  Howard L. Heck ,  John T. Kolias ,  John S. Kresge ,  David N. Light ,  Ajit K. Trivedi

    IPC分类号： H01R4/26 ,  H01R4/58 ,  H01R12/61 ,  H01R13/66 ,  H05K1/00 ,  H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K3/32 ,  H05K3/46 ,  B32B9/00

    CPC分类号： H05K3/4635 ,  H01R12/613 ,  H01R13/665 ,  H05K3/462 ,  H01R4/26 ,  H01R4/58 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/09109 ,  H05K2201/09536 ,  H05K2201/10159 ,  H05K3/328 ,  H05K3/4623 ,  H05K3/4641 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49179 ,  Y10T428/24917

    摘要： Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication. The planar circuitization, as data lines, address lines, and control lines of a logic chip or a memory chip are on the individual printed circuit boards and cards, which are connected through the circuitized flex, and communicate with other layers of flex through Z-axis circuitization (vias and through holes) in the laminate. Lamination of the individual subassemblies is accomplished with a low melting adhesive that is chemical compatible with (bondable to) the per fluorocarbon polymer between the subassemblies in the regions intended to be laminated, and, optionally, a high melting mask that is chemically incompatible with (not bondable to) the per fluorocarbon polymer between the subassemblies in the regions not intended to be laminated. The subassembly stack is heated to selectively effect adhesion and lamination in areas thereof intended to be laminated while avoiding lamination in areas not intended to be laminated.

    摘要翻译： 公开了一种并行处理器封装结构和用于制造该结构的方法。 单独的逻辑和存储器元件在印刷电路卡上。 这些印刷电路板和卡依次安装在或连接到从电路化的柔性基板的层叠体向外延伸的电路化柔性基板上。 通过在层压板中实现的开关结构来提供互通。 印刷电路卡安装在或连接到多个电路化的柔性基板上，在电路化柔性电路的每一端具有一个印刷电路卡。 电路化的柔性基板通过中央层压体部分连接分开的印刷电路板和卡。 该层压部分为处理器间，存储器间，处理器间/存储器元件以及处理器到存储器总线互连和通信提供XY平面和Z轴互连。 作为逻辑芯片或存储器芯片的数据线，地址线和控制线的平面电路在通过电路化的柔性连接的各个印刷电路板和卡上，并且通过Z轴与其它柔性层通信， 轴向电路（通孔和通孔）。 各个子组件的层压是通过低熔点粘合剂来实现的，该低熔点粘合剂与要层压的区域中的子组件之间的每个碳氟化合物聚合物化学相容（可粘合），以及任选的与化学不相容的高熔点掩模 不能粘合）在不想层压的区域中的子组件之间的每个碳氟聚合物。 加热组件叠层以选择性地在要层压的区域中进行粘合和层压，同时避免在不想层压的区域中层压。

    High density pattern template: materials and processes for the application of conductive pastes
    17.
    发明授权
    High density pattern template: materials and processes for the application of conductive pastes 失效
    高密度图案模板：应用导电浆料的材料和工艺

    公开(公告)号：US5460921A

    公开(公告)日：1995-10-24

    申请号：US118010

    申请日：1993-09-08

    申请人： Douglas A. Cywar ,  Charles R. Davis ,  Thomas P. Duffy ,  Frank D. Egitto ,  Paul J. Hart ,  Gerald W. Jones ,  Edward McLeskey

    发明人： Douglas A. Cywar ,  Charles R. Davis ,  Thomas P. Duffy ,  Frank D. Egitto ,  Paul J. Hart ,  Gerald W. Jones ,  Edward McLeskey

    IPC分类号： G03F7/00 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46 ,  G03C5/00

    CPC分类号： G03F7/00 ,  H05K3/0032 ,  H05K3/1258 ,  H05K3/4069 ,  H05K1/095 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2203/0191 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/1383 ,  H05K3/0035 ,  H05K3/107 ,  H05K3/4664 ,  Y10S428/901 ,  Y10S430/146 ,  Y10T428/24917

    摘要： The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured. The remaining polymer coating is removed by solvent stripping with non-halogenated solvents. The present invention further includes patterning electronic structures comprising multilayer circuitry using the above method. An excimer laser is used to form vias or through holes in the electronic structure while simultaneously patterning the polymer coating. This results in perfect alignment between the pattern formed in the polymer coating and the vias or through holes. High resolution circuitry is thus attainable when the electronic structure is subsequently metallized with a conductive metal paste.

    摘要翻译： 本发明提供了一种烧蚀光分解和形成金属图案的方法，其获得高分辨率，方便并采用非卤化溶剂。 本发明涉及一种用于形成金属图案的方法，优选在有机基板上，优选在电路板或其组件上进行电路化，该方法包括用可剥离涂层涂覆基材，该涂层包含聚合物树脂，优选丙烯酸酯聚合物树脂 优选紫外线吸收剂。 通过用足够量的紫外线照射至少一部分聚合物涂层，形成对应于所需金属图案的聚合物涂层中的图案，从而消除聚合物涂层的照射部分。 接下来，用导电金属膏涂覆图案化衬底以限定金属图案，并且导电金属膏被固化。 通过用非卤化溶剂的溶剂汽提除去剩余的聚合物涂层。 本发明还包括使用上述方法图案化包括多层电路的电子结构。 准分子激光器用于在电子结构中形成通孔或通孔，同时构图聚合物涂层。 这导致在聚合物涂层中形成的图案与通孔或通孔之间完美对准。 因此，当电子结构随后用导电金属膏进行金属化时，可实现高分辨率电路。