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    High density pattern template: materials and processes for the application of conductive pastes
    1.
    发明授权
    High density pattern template: materials and processes for the application of conductive pastes 失效
    高密度图案模板：应用导电浆料的材料和工艺

    公开(公告)号：US5460921A

    公开(公告)日：1995-10-24

    申请号：US118010

    申请日：1993-09-08

    申请人： Douglas A. Cywar ,  Charles R. Davis ,  Thomas P. Duffy ,  Frank D. Egitto ,  Paul J. Hart ,  Gerald W. Jones ,  Edward McLeskey

    发明人： Douglas A. Cywar ,  Charles R. Davis ,  Thomas P. Duffy ,  Frank D. Egitto ,  Paul J. Hart ,  Gerald W. Jones ,  Edward McLeskey

    IPC分类号： G03F7/00 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46 ,  G03C5/00

    CPC分类号： G03F7/00 ,  H05K3/0032 ,  H05K3/1258 ,  H05K3/4069 ,  H05K1/095 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2203/0191 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/1383 ,  H05K3/0035 ,  H05K3/107 ,  H05K3/4664 ,  Y10S428/901 ,  Y10S430/146 ,  Y10T428/24917

    摘要： The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured. The remaining polymer coating is removed by solvent stripping with non-halogenated solvents. The present invention further includes patterning electronic structures comprising multilayer circuitry using the above method. An excimer laser is used to form vias or through holes in the electronic structure while simultaneously patterning the polymer coating. This results in perfect alignment between the pattern formed in the polymer coating and the vias or through holes. High resolution circuitry is thus attainable when the electronic structure is subsequently metallized with a conductive metal paste.

    摘要翻译： 本发明提供了一种烧蚀光分解和形成金属图案的方法，其获得高分辨率，方便并采用非卤化溶剂。 本发明涉及一种用于形成金属图案的方法，优选在有机基板上，优选在电路板或其组件上进行电路化，该方法包括用可剥离涂层涂覆基材，该涂层包含聚合物树脂，优选丙烯酸酯聚合物树脂 优选紫外线吸收剂。 通过用足够量的紫外线照射至少一部分聚合物涂层，形成对应于所需金属图案的聚合物涂层中的图案，从而消除聚合物涂层的照射部分。 接下来，用导电金属膏涂覆图案化衬底以限定金属图案，并且导电金属膏被固化。 通过用非卤化溶剂的溶剂汽提除去剩余的聚合物涂层。 本发明还包括使用上述方法图案化包括多层电路的电子结构。 准分子激光器用于在电子结构中形成通孔或通孔，同时构图聚合物涂层。 这导致在聚合物涂层中形成的图案与通孔或通孔之间完美对准。 因此，当电子结构随后用导电金属膏进行金属化时，可实现高分辨率电路。

    Structure for preventing adhesive bleed onto surfaces
    5.
    发明授权
    Structure for preventing adhesive bleed onto surfaces 失效
    用于防止粘合剂渗透到表面上的结构

    公开(公告)号：US06252307B1

    公开(公告)日：2001-06-26

    申请号：US09537959

    申请日：2000-03-28

    申请人： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

    发明人： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

    IPC分类号： H01L2100

    CPC分类号： B82Y30/00 ,  B82Y10/00 ,  H01L21/4864 ,  H01L23/49894 ,  H01L24/80 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14

    摘要： A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide “Self-Assembled Monolayers” (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface. The hydrocarbon segment presents a surface on the noble metal that has the characteristics of the hydrocarbon portion of the molecule which has a low surface tension, and, thus, prevents wetting of the noble metal by an epoxy adhesive component. The SAMs, once they provide protection from the bleed of the die attach adhesives, self desorb during the wire bonding or soldering temperatures.

    摘要翻译： 提供了一种方法和结构，用于当将I / C芯片附着到基板上时，防止粘合剂（例如环氧树脂）在电介质基板的表面上的贵金属线接合焊盘上的润湿或渗出。 该方法包括用化学成分处理引线接合焊盘，该化学组合物防止由环氧树脂的部件渗透到引线接合焊盘的表面上。 化学成分是一种在金表面提供“自组装单层”（SAM）的化学成分。 这些组合物的特征在于具有连接到烃部分如（CH 2）x链的至少一个基团的硫醇或二硫化物的分子。 与贵金属化学键合的分子的硫醇或含硫部分的亲和性提供了分子与金属表面相对较强的附着。 烃段在贵金属上呈现具有低分子表面张力的分子的特征的表面，并且因此防止了环氧粘合剂组分对贵金属的润湿。一旦它们提供 防止裸片的泄漏附着粘合剂，在引线接合或焊接温度期间自身解吸。