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公开(公告)号:US20240179903A1
公开(公告)日:2024-05-30
申请号:US17993997
申请日:2022-11-25
Applicant: Winbond Electronics Corp.
Inventor: Frederick Chen , Wei-Che Chang
IPC: H01L27/11582 , H01L27/11565
CPC classification number: H01L27/11582 , H01L27/11565
Abstract: Provided is a flash memory device including a gate stack structure, at least three channel pillars, a charge storage structure, at least three source line, and at least three bit lines. The gate stack structure is disposed above a substrate. The gate stack structure includes a plurality of gate layers and a plurality of insulating layers stacked alternately each other. The at least three channel pillars extend through the gate stack structure. The at least three channel pillars are electrically isolated from one another. The charge storage structure is disposed between the plurality of gate layers and the at least three channel pillars. The at least three source line are disposed below the gate stack structure and electrically connected to the at least three channel pillars. The at least three bit lines are disposed above the gate stack structure, and electrically connected to the at least three channel pillars.
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公开(公告)号:US20230329009A1
公开(公告)日:2023-10-12
申请号:US17715065
申请日:2022-04-07
Applicant: Winbond Electronics Corp.
Inventor: Chi-Ching Liu , Chih-Chao Huang , Ming-Che Lin , Frederick Chen , Han-Huei Hsu
CPC classification number: H01L27/2454 , H01L29/0649 , H01L45/124 , H01L29/7851 , H01L45/16 , H01L29/66795
Abstract: Provided is a semiconductor device including: a substrate, a plurality of isolation structures, a plurality of channel layers, and a gate structure. The substrate includes a plurality of fins thereon. The plurality of isolation structures are respectively disposed between the plurality of fins. A top surface of the plurality of isolation structures is higher than a top surface of the plurality of fins to form a plurality of openings. The plurality of channel layers are respectively disposed in the plurality of openings. Each channel layer is in contact with a corresponding fin and extends to cover a lower sidewall of a corresponding isolation structure, thereby forming a U-shaped structure. The gate structure is filled in the plurality of openings and extends to cover the top surface of the plurality of isolation structures.
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公开(公告)号:US11362272B2
公开(公告)日:2022-06-14
申请号:US17002759
申请日:2020-08-25
Applicant: Winbond Electronics Corp.
Inventor: Ping-Kun Wang , Chia-Wen Cheng , He-Hsuan Chao , Frederick Chen , Chang-Tsung Pai , Tzu-Yun Huang , Ming-Che Lin
Abstract: A resistive memory device and a reliability enhancement method thereof are provided. The reliability enhancement method includes the following steps. A forming operation is performed on a plurality of memory cells. The formed memory cells are read to respectively obtain a plurality of formed currents. A reference current is set according to a statistic value of the formed currents. A setting operation is performed on the memory cells. A ratio between a set current of each of the memory cells and the reference current is calculated, and a physical status of each of the memory cells is judged according to the ratio. It is determined whether to perform a fix operation of each of the memory cells or not according to physical status.
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公开(公告)号:US20220076744A1
公开(公告)日:2022-03-10
申请号:US17012077
申请日:2020-09-04
Applicant: Winbond Electronics Corp.
Inventor: Frederick Chen , Ping-Kun Wang , Kuang-Chih Hsieh , Chien-Min Wu , Meng-Hung Lin
Abstract: A memory device includes: a resistive switching layer, a conductive pillar, a barrier layer, a word line, a plurality of resistive layers, and a plurality of bit lines. The resistive switching layer is shaped as a cup and has an inner surface to define an opening. The conductive pillar is disposed in the opening. The barrier layer is disposed between the resistive switching layer and the conductive pillar. The word line is electrically connected to the conductive pillar. The resistive layers are respectively distributed on an outer surface of the resistive switching layer. The bit lines are electrically connected to the resistive layers, respectively.
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公开(公告)号:US11024511B1
公开(公告)日:2021-06-01
申请号:US16853766
申请日:2020-04-21
Applicant: Winbond Electronics Corp.
Inventor: Frederick Chen
IPC: H01L21/308 , H01L21/027 , H01L21/311 , H01L21/033 , H01L21/768 , H01L21/3213 , H01L29/66
Abstract: Provided is a patterning method including: providing a strip layer with a plurality of strips A, in combination with a plurality of strips B and strips C arranged alternately between the strips A; forming a first mask layer having a first opening on the strip layer; removing the strips A and B exposed by the first opening; forming a plurality of first spacers on sidewalls defined by the first opening; forming a plurality of second spacers on sidewalls of the first spacers respectively; forming a second mask layer having a second opening on the strip layer; removing the strips A and C exposed by the second opening; forming a plurality of third spacers defined by the second opening; forming a plurality of fourth spacers on sidewalls of the third spacers respectively; and removing the strips A, the first spacers, and the third spacers to form a pattern layer.
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公开(公告)号:US20170279041A1
公开(公告)日:2017-09-28
申请号:US15076676
申请日:2016-03-22
Applicant: Winbond Electronics Corp.
Inventor: Frederick Chen
IPC: H01L45/00
CPC classification number: H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/1246 , H01L45/146 , H01L45/1608 , H01L45/1641
Abstract: A resistive random access memory is provided. The resistive random access memory includes a bottom electrode, a top electrode, a resistance changeable layer, an oxygen reservoir layer and a reactive oxygen barrier layer. The bottom electrode is disposed on a substrate. The top electrode is disposed above the bottom electrode. The resistance changeable layer is disposed between the bottom electrode and the top electrode. The oxygen reservoir layer is disposed between the resistance changeable layer and the top electrode. The reactive oxygen barrier layer is disposed inside the oxygen reservoir layer.
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公开(公告)号:US20170125673A1
公开(公告)日:2017-05-04
申请号:US15064603
申请日:2016-03-09
Applicant: Winbond Electronics Corp.
Inventor: Po-Yen Hsu , Ting-Ying Shen , Chia-Hua Ho , Chih-Cheng Fu , Frederick Chen
IPC: H01L45/00
CPC classification number: H01L45/146 , H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/124 , H01L45/1253 , H01L45/16 , H01L45/1675 , H01L45/1683
Abstract: Provided are a resistive memory and a method of fabricating the resistive memory. The resistive memory includes a first electrode, a second electrode, a variable resistance layer, an oxygen exchange layer, and a protection layer. The first electrode and the second electrode are arranged opposite to each other. The variable resistance layer is arranged between the first electrode and the second electrode. The oxygen exchange layer is arranged between the variable resistance layer and the second electrode. The protection layer is arranged at least on sidewalls of the oxygen exchange layer.
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公开(公告)号:US20160351623A1
公开(公告)日:2016-12-01
申请号:US14726626
申请日:2015-06-01
Applicant: Winbond Electronics Corp.
Inventor: Frederick Chen , Ping-Kun Wang , Shao-Ching Liao
CPC classification number: H01L27/2436 , H01L27/2463 , H01L27/2472 , H01L45/04 , H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/1246 , H01L45/1253 , H01L45/1273 , H01L45/146 , H01L45/147
Abstract: A resistive random access memory is provided. The resistive memory cell includes a substrate, a transistor on the substrate, a bottom electrode on the substrate and electrically connected to the transistor source/drain, several top electrodes on the bottom electrode, several resistance-switching layers between the top and bottom electrode, and several current limiting layers between the resistance-switching layer and top electrodes. The cell could improve the difficulty on recognizing 1/0 signal by current at high temperature environment and save the area on the substrate by generating several conductive filaments at one transistor location.
Abstract translation: 提供了一种电阻式随机存取存储器。 电阻式存储单元包括衬底,衬底上的晶体管,衬底上的底部电极,并电连接到晶体管源极/漏极,底部电极上的几个顶部电极,顶部和底部电极之间的几个电阻切换层, 以及电阻切换层和顶部电极之间的若干电流限制层。 该电池可以提高在高温环境下通过电流识别1/0信号的难度,并通过在一个晶体管位置产生几个导电细丝来节省基板上的面积。
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公开(公告)号:US20160315255A1
公开(公告)日:2016-10-27
申请号:US15067184
申请日:2016-03-11
Applicant: Winbond Electronics Corp.
Inventor: Frederick Chen , Ping-Kun Wang , Shao-Ching Liao , Meng-Hung Lin
IPC: H01L45/00
CPC classification number: H01L45/1266 , H01L45/08 , H01L45/1233 , H01L45/146
Abstract: A resistive random access memory (RRAM) including a first electrode, a second electrode, and a variable-resistance oxide layer disposed between the first electrode and the second electrode is provided. The RRAM further includes an oxygen exchange layer, an oxygen-rich layer, and a first oxygen barrier layer. The oxygen exchange layer is disposed between the variable-resistance oxide layer and the second electrode. The oxygen-rich layer is disposed between the oxygen exchange layer and the second electrode. The first oxygen barrier layer is disposed between the oxygen exchange layer and the oxygen-rich layer.
Abstract translation: 提供了包括设置在第一电极和第二电极之间的第一电极,第二电极和可变电阻氧化物层的电阻随机存取存储器(RRAM)。 RRAM还包括氧交换层,富氧层和第一氧阻隔层。 氧交换层设置在可变电阻氧化物层和第二电极之间。 富氧层设置在氧交换层和第二电极之间。 第一氧阻隔层设置在氧交换层和富氧层之间。
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公开(公告)号:US11972799B2
公开(公告)日:2024-04-30
申请号:US17683356
申请日:2022-03-01
Applicant: Winbond Electronics Corp.
Inventor: Frederick Chen , Ping-Kun Wang , Chia-Hung Lin , Jun-Yao Huang
IPC: G11C13/00
CPC classification number: G11C13/004 , G11C13/0007 , G11C2013/0045
Abstract: A filament forming method includes: performing first stage to apply first bias including gate and drain voltages to a resistive memory unit plural times until read current reaches first saturating state, latching read current in first saturating state as saturating read current, determining whether rate of increase of saturating read current is less than first threshold value; when rate of increase of saturating read current is not less than first threshold value, performing second stage to apply second bias, by increasing gate voltage and decreasing drain voltage, to the resistive memory unit plural times until read current reaches second saturating state, latching read current in second saturating state as saturating read current and determining whether rate of increase of saturating read current is less than first threshold value; finishing the method when rate of increase of saturating read current is less than first threshold value and saturating read current reaches target current value.
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