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82 条记录 (耗时 0.023 秒)

    Socket with low inductance side contacts for a microelectronic device package
    14.
    发明授权
    Socket with low inductance side contacts for a microelectronic device package 失效
    具有用于微电子器件封装的低电感侧触点的插座

    公开(公告)号：US06680526B2

    公开(公告)日：2004-01-20

    申请号：US10125000

    申请日：2002-04-17

    申请人： David G. Figueroa ,  Yuan-Liang Li

    发明人： David G. Figueroa ,  Yuan-Liang Li

    IPC分类号： H01L2348

    CPC分类号： H01L23/50 ,  H01L23/49805 ,  H01L2224/16225 ,  H01R13/24

    摘要： A socket coupled to a circuit board to receive a package of microelectronic device has one or more electrical contacts coupled to its outer surfaces. Each contact provides a low inductance shunt connection from the side of the package to the circuit board. The contact includes multiple adjacent, electrically conductive members, each including a rigid portion and a flexible portion projecting from the rigid portion. The flexible portion is positioned to be in physical contact with a corresponding electrical conductor on an outer surface of the package when the package is coupled to the socket. At least one adjacent pair of the electrically conductive members conduct current in opposite directions to provide mutual inductance. The contact further includes a dielectric layer sandwiched between each two adjacent rigid portions of the conductive members.

    摘要翻译： 耦合到电路板以接收微电子器件封装的插座具有联接到其外表面的一个或多个电触点。 每个触点提供从封装侧到电路板的低电感分流连接。 触点包括多个相邻的导电构件，每个包括刚性部分和从刚性部分突出的柔性部分。 当包装件与插座连接时，柔性部分定位成与包装外表面上的对应电导体物理接触。 至少一对相邻的导电构件在相反方向上传导电流以提供互感。 触点还包括夹在导电构件的每两个相邻的刚性部分之间的电介质层。

    Interconnected series of plated through hole vias and method of fabrication therefor
    15.
    发明授权
    Interconnected series of plated through hole vias and method of fabrication therefor 有权
    互连的电镀通孔通孔及其制造方法

    公开(公告)号：US06493861B1

    公开(公告)日：2002-12-10

    申请号：US09473353

    申请日：1999-12-28

    申请人： Yuan-Liang Li ,  David G. Figueroa

    发明人： Yuan-Liang Li ,  David G. Figueroa

    IPC分类号： G06F1750

    CPC分类号： H01F17/0033 ,  H01F41/041 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15312 ,  H05K1/115 ,  H05K1/165 ,  H05K3/06 ,  H05K3/42 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/1006 ,  H05K2203/0723 ,  H01L2224/0401

    摘要： A series of plated through hole (PTH) vias are interconnected by traces that alternate between a top surface and a bottom surface of a dielectric board. The PTH vias in the series can be positioned to create a collinear inductive filter, a coil-type inductive filter, or a transformer. Multiple, electrically isolated series of interconnected PTH vias can be used as a multi-phase inductive filter in one embodiment. In another embodiment, multiple series of interconnected PTH vias are electrically connected by a linking portion of conductive material, resulting in a low-resistance inductive filter. Ferromagnetic material patterns can be embedded in the dielectric board to enhance the inductive characteristics of the interconnected via structures. In one embodiment, a closed-end pattern is provided with two series of interconnected vias coiling around the pattern, resulting in an embedded transformer structure. A method of producing an interconnected series of PTH vias includes providing a dielectric board having a series of holes. In some embodiments, the board includes an embedded ferromagnetic material pattern. The holes and the top and bottom surface of the dielectric board have a conductive material thereupon. Portions of the conductive material are selectively removed, resulting in the embedded inductive filter and/or transformer structure.

    摘要翻译： 一系列电镀通孔（PTH）通孔在电介质板的顶表面和底表面之间交替的迹线互连。 该系列中的PTH通孔可以定位成产生共线感应滤波器，线圈型感应滤波器或变压器。 在一个实施例中，多个电隔离的互连PTH通孔系列可用作多相感应滤波器。 在另一个实施例中，多个互连的PTH通孔系列通过导电材料的连接部分电连接，导致低电阻感应滤波器。 铁磁材料图案可以嵌入电介质板中以增强互连通孔结构的感应特性。 在一个实施例中，闭合端图案具有围绕图案卷绕的两系列互连的通孔，从而形成嵌入式变压器结构。 制造互连的PTH通孔系列的方法包括提供具有一系列孔的电介质板。 在一些实施例中，板包括嵌入的铁磁材料图案。 电介质板的孔和顶表面和底表面具有导电材料。 选择性地去除导电材料的部分，从而产生嵌入的感应滤波器和/或变压器结构。

    Dual-socket interposer and method of fabrication therefor
    16.
    发明授权
    Dual-socket interposer and method of fabrication therefor 失效
    双插座插入器及其制造方法

    公开(公告)号：US06469908B2

    公开(公告)日：2002-10-22

    申请号：US10076893

    申请日：2002-02-14

    申请人： P. R. Patel ,  Yuan-Liang Li ,  David G. Figueroa ,  Shamala Chickamenahalli ,  Huong T. Do

    发明人： P. R. Patel ,  Yuan-Liang Li ,  David G. Figueroa ,  Shamala Chickamenahalli ,  Huong T. Do

    IPC分类号： H05K710

    CPC分类号： H05K1/141 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K1/0262 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2201/10704 ,  H01L2224/0401

    摘要： An interposer includes two separate sets of pins, and inserts into two sockets on a printed circuit board. One set of pins supplies power to a step down converter (SDC) mounted on the interposer. The second set of pins provide inputs and outputs to an integrated circuit mounted on the interposer. One or more conductive traces in or on the interposer electrically connect an output of the SDC to an input of the integrated circuit, thus supplying regulated power to the integrated circuit through the interposer. The SDC and integrated circuit can be directly mounted on the interposer, or either or both can be mounted on packages that connect to the interposer. The SDC and integrated circuit can be flip chips or can be connected to the interposer or package using wirebonds. The packages can be pinned or connectable by solder bumps.

    摘要翻译： 插入器包括两组独立的引脚，并插入到印刷电路板上的两个插槽中。 一组引脚为安装在插入器上的降压转换器（SDC）供电。 第二组引脚为安装在插入器上的集成电路提供输入和输出。 插入器中或之上的一个或多个导电迹线将SDC的输出电连接到集成电路的输入，从而通过插入器向集成电路提供稳压电力。 SDC和集成电路可以直接安装在插入器上，或者两者都可以安装在连接到插入器的封装上。 SDC和集成电路可以是倒装芯片，也可以使用引线连接到插入器或封装。 封装可以通过焊料凸块固定或连接。

    Inductive filters and methods of fabrication therefor
    17.
    发明授权
    Inductive filters and methods of fabrication therefor 有权
    电感式滤波器及其制造方法

    公开(公告)号：US07518248B2

    公开(公告)日：2009-04-14

    申请号：US11462611

    申请日：2006-08-04

    申请人： Yuan-Liang Li ,  David G. Figueroa

    发明人： Yuan-Liang Li ,  David G. Figueroa

    IPC分类号： H01L23/52

    CPC分类号： H01F17/0033 ,  H01F41/041 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15312 ,  H05K1/115 ,  H05K1/165 ,  H05K3/06 ,  H05K3/42 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/1006 ,  H05K2203/0723 ,  H01L2224/0401

    摘要： A series of plated through hole (PTH) vias are interconnected by traces that alternate between a top surface and a bottom surface of a dielectric board. The PTH vias in the series can be positioned to create a collinear inductive filter, a coil-type inductive filter, or a transformer. Multiple, electrically isolated series of interconnected PTH vias can be used as a multi-phase inductive filter in one embodiment. In another embodiment, multiple series of interconnected PTH vias are electrically connected by a linking portion of conductive material, resulting in a low-resistance inductive filter. Ferromagnetic material patterns can be embedded in the dielectric board to enhance the inductive characteristics of the interconnected via structures. In one embodiment, a closed-end pattern is provided with two series of interconnected vias coiling around the pattern, resulting in an embedded transformer structure. A method of producing an interconnected series of PTH vias includes providing a dielectric board having a series of holes. In some embodiments, the board includes an embedded ferromagnetic material pattern. The holes and the top and bottom surface of the dielectric board have a conductive material thereupon. Portions of the conductive material are selectively removed, resulting in the embedded inductive filter and/or transformer structure.

    摘要翻译： 一系列电镀通孔（PTH）通孔在电介质板的顶表面和底表面之间交替的迹线互连。 该系列中的PTH通孔可以定位成产生共线感应滤波器，线圈型感应滤波器或变压器。 在一个实施例中，多个电隔离的互连PTH通孔系列可用作多相感应滤波器。 在另一个实施例中，多个互连的PTH通孔系列通过导电材料的连接部分电连接，导致低电阻感应滤波器。 铁磁材料图案可以嵌入电介质板中以增强互连通孔结构的感应特性。 在一个实施例中，闭合端图案具有围绕图案卷绕的两系列互连的通孔，从而形成嵌入式变压器结构。 制造互连的PTH通孔系列的方法包括提供具有一系列孔的电介质板。 在一些实施例中，板包括嵌入的铁磁材料图案。 电介质板的孔和顶表面和底表面之间具有导电材料。 选择性地去除导电材料的部分，从而产生嵌入的感应滤波器和/或变压器结构。