公开(公告)号：US06185322B2

公开(公告)日：2001-02-06

申请号：US08958095

申请日：1997-10-27

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

摘要翻译： 本发明分别提供用于探测器和自动粒子检测机的数据分析台。 并且，在数据分析站中，以产品为基础描述芯片的配置的坐标与描述缺陷的位置的坐标相同。 此外，该站提供确定每个缺陷属于哪个芯片的功能。 这些数据分析站通过通信线连接。 本发明能够基于芯片分析数据，从而能够掌握每个芯片上的缺陷引起的芯片与芯片的产品特性之间的关系。

公开(公告)号：US06650409B1

公开(公告)日：2003-11-18

申请号：US08617270

申请日：1996-03-14

申请人： Minori Noguchi ,  Yukio Kembo ,  Hiroshi Morioka ,  Hidetoshi Nishiyama ,  Hideaki Doi ,  Masataka Shiba ,  Yoshiharu Shigyo ,  Kazuhiko Matsuoka ,  Kenji Watanabe ,  Yoshimasa Ohshima ,  Fumiaki Endo ,  Yuzo Taniguchi

发明人： Minori Noguchi ,  Yukio Kembo ,  Hiroshi Morioka ,  Hidetoshi Nishiyama ,  Hideaki Doi ,  Masataka Shiba ,  Yoshiharu Shigyo ,  Kazuhiko Matsuoka ,  Kenji Watanabe ,  Yoshimasa Ohshima ,  Fumiaki Endo ,  Yuzo Taniguchi

IPC分类号： G01N2189

CPC分类号： H01L21/67288 ,  G01N21/9501 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/681

摘要： A semiconductor device producing method and a semiconductor device producing system employs a processing apparatus provided with a dust particle detecting apparatus. The dust particle detecting apparatus measures the condition of adhesion of dust particles adhering to a work at least before or after processing the work, manages the condition of incremental adhesion of dust particles to the work resulting from processing for each lot of works or for each work on the basis of the measured condition of adhesion of dust particles measured before or after processing the work, and determines the time when the processing apparatus is to be cleaned or the cycle of cleaning the processing apparatus on the basis of the managed condition of adhesion of dust particles.

摘要翻译： 半导体器件制造方法和半导体器件制造系统采用具有灰尘粒子检测装置的处理装置。 尘埃粒子检测装置至少在工件加工之前或之后测量附着在工件上的灰尘颗粒的附着状态，管理灰尘颗粒对于每批工件或每个工件的加工产生的增加粘附的条件 基于在处理工件之前或之后测量的粉尘颗粒的粘附测量条件，并根据管理的粘附条件确定处理设备要清洁的时间或清洁处理设备的循环 灰尘颗粒。

公开(公告)号：US06624575B2

公开(公告)日：2003-09-23

申请号：US10061160

申请日：2002-02-04

申请人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Tomohiro Murase

发明人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Tomohiro Murase

IPC分类号： H01J1749

CPC分类号： H01J9/241 ,  H01J9/02

摘要： A gas discharge display device having a first substrate, a plurality of first electrodes having a substantially rectangular form being arranged on the first substrate, a plurality of second electrodes, respective ones of the plurality of second electrodes being formed on respective ones of the plurality of first electrodes, and each of the plurality of second electrodes having an extension extending beyond an end of a respective one of the plurality of first electrodes on which respective ones of the plurality of second electrodes are formed and in an oblique direction therefrom. The extension of the plurality of second electrodes extend beyond opposite ends of alternate ones of the plurality of first electrodes.

公开(公告)号：US06529619B2

公开(公告)日：2003-03-04

申请号：US09893889

申请日：2001-06-29

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

摘要翻译： 本发明分别提供用于探测器和自动粒子检测机的数据分析台。 并且在数据分析站中，以产品为基础描述芯片的配置的坐标与描述缺陷的位置的坐标相同。 此外，该站提供确定每个缺陷属于哪个芯片的功能。 这些数据分析站通过通信线连接。 本发明能够基于芯片分析数据，从而能够掌握每个芯片上的缺陷引起的芯片与芯片的产品特性之间的关系。

公开(公告)号：US06471115B1

公开(公告)日：2002-10-29

申请号：US09585391

申请日：2000-06-02

申请人： Masahito Ijuin ,  Toru Nishikawa ,  Ryohei Sato ,  Mitsugu Shirai ,  Yuzo Taniguchi ,  Kosuke Inoue ,  Masahide Harada ,  Tetsuya Hayashida

发明人： Masahito Ijuin ,  Toru Nishikawa ,  Ryohei Sato ,  Mitsugu Shirai ,  Yuzo Taniguchi ,  Kosuke Inoue ,  Masahide Harada ,  Tetsuya Hayashida

IPC分类号： B23K3102

CPC分类号： H01L24/12 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81012 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H05K3/3489 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.

摘要翻译： 本发明是一种通过将焊料材料涂布在印刷电路板上的电子部件或电极上来制造电子电路器件的方法; 该方法包括以下步骤：从焊料材料和电极的表面去除初始表面氧化物膜和有机污染膜，覆盖焊料材料和由电极组成的焊料区域， 在熔化焊料材料的步骤中完成接合之后的液体蒸发，从而防止接合区域表面的再氧化，并且使焊料材料加热熔化，而不使用任何焊剂进行焊接。

公开(公告)号：US06343967B1

公开(公告)日：2002-02-05

申请号：US09851989

申请日：2001-05-10

申请人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Tomohiro Murase

发明人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Tomohiro Murase

IPC分类号： H01J900

CPC分类号： H01J9/241 ,  H01J9/02

摘要： A method of making a gas discharge display panel including the steps of providing a first substrate having a plurality of first electrodes and a plurality of second electrodes, laser processing said first electrodes into a rectangular form, forming the second electrodes on the first electrodes and providing a second substrate having a plurality of third electrodes and being opposed to the first substrate.

摘要翻译： 一种制造气体放电显示面板的方法，包括以下步骤：提供具有多个第一电极和多个第二电极的第一基板，将所述第一电极激光加工成矩形，在第一电极上形成第二电极，并提供 第二基板，具有多个第三电极并与第一基板相对。

公开(公告)号：US06249242B1

公开(公告)日：2001-06-19

申请号：US09369400

申请日：1999-08-06

申请人： Kenji Sekine ,  Hiroshi Kondoh ,  Keigo Kamozaki ,  Hideyuki Nagaishi ,  Kazuo Matsuura ,  Terumi Nakazawa ,  Michio Tanimoto ,  Hideaki Sasaki ,  Yuzo Taniguchi

发明人： Kenji Sekine ,  Hiroshi Kondoh ,  Keigo Kamozaki ,  Hideyuki Nagaishi ,  Kazuo Matsuura ,  Terumi Nakazawa ,  Michio Tanimoto ,  Hideaki Sasaki ,  Yuzo Taniguchi

IPC分类号： G01S1393

CPC分类号： H01L23/66 ,  G01S7/03 ,  G01S7/032 ,  G01S2013/9325 ,  H01L24/48 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/1903 ,  H01Q1/3233 ,  H01Q21/0087 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A high-frequency transmitter-receiver apparatus includes a transceiver circuit realized in a planar structure by a dielectric substrate and a semiconductor chip and a planar antenna formed on a dielectric substrate are provided on front and rear surfaces, respectively, of a single electrically conductive base plate. Signal lines of the planar circuit and the planar antenna are electrically interconnected by a coaxial line which extends through said base plate.

摘要翻译： 一种高频发射机 - 接收机设备包括分别由介质基片和半导体芯片实现的平面结构的收发器电路以及形成在电介质基片上的平面天线分别设置在单个导电基底 盘子。 平面电路和平面天线的信号线通过延伸穿过所述基板的同轴线电互连。

公开(公告)号：US5274434A

公开(公告)日：1993-12-28

申请号：US778363

申请日：1991-10-17

申请人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Yuzo Taniguchi

发明人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Yuzo Taniguchi

IPC分类号： G01N21/94 ,  G01N21/956 ,  G01R31/308 ,  H01J37/00 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68 ,  G01N21/89 ,  G02B27/46 ,  G06F15/46

CPC分类号： H01L21/681 ,  B82Y15/00 ,  G01N21/94 ,  G01R31/308 ,  H01J37/00 ,  H01L21/67253 ,  H01L21/67276 ,  H01L21/67288 ,  H01L22/20 ,  G01N2021/8822 ,  G01N21/95623 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L22/12

摘要： In a mass production line of a semiconductor manufacturing process, foreign particle inspection method and apparatus for preventing occurrence of large quantities of defects and for keeping a necessary yield. The inspection apparatus is made up in a small-sized apparatus and disposed at inlet/outlet of processing apparatuses of the production line or to a transfer system between the processing apparatuses. The inspection apparatus includes at least one monitor for real-time sampling foreign particles possible deposited on wafer which is being carried by the transfer system, thereby enabling simplification in construction of the production line and reduction of manufacturing cost. The inspection apparatus may comprise a refractive index changeable type lens array, a spatial filter and a pattern data elimination circuit, and makes possible to conduct foreign particle inspection on repetitively-patterned portions of the wafers during transfer. With the spatial filter for eliminating repetitive data of the repetition patterns the small-sized compact inspection apparatus is capable of real-time inspecting the foreign particles on the wafers at a high speed.

摘要翻译： 在半导体制造方法的大规模生产线中，用于防止发生大量缺陷并保持必要成品率的外来颗粒检查方法和装置。 检查装置由小型装置构成，配置在生产线的处理装置的出入口处或处理装置之间的转印系统。 该检查装置包括至少一个监视器，用于实时采样可能沉积在由转印系统携带的晶片上的异物，从而能够简化生产线的构造和降低制造成本。 检查装置可以包括折射率可变型透镜阵列，空间滤光器和图案数据消除电路，并且可以在转印期间对晶片的重复构图部分进行异物检查。 利用用于消除重复图案的重复数据的空间滤波器，小型紧凑型检查装置能够以高速实时检查晶片上的异物。

公开(公告)号：US4019669A

公开(公告)日：1977-04-26

申请号：US613542

申请日：1975-09-15

申请人： Michio Tanimoto ,  Yuzo Taniguchi

发明人： Michio Tanimoto ,  Yuzo Taniguchi

IPC分类号： B23K20/00 ,  H01L21/60 ,  H01L21/603 ,  H05K13/06 ,  B65H59/16

CPC分类号： H01L24/85 ,  H01L24/78 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082

摘要： A wire bonder which includes a spool from which wire is drawn out, a capillary bonding head adapted to hold the wire and to extend the wire downwardly from the spool, and a tensioning mechanism. The tensioning mechanism includes a nozzle for directing a jet of gas against the wire with the nozzle being disposed in opposition to two guide plates disposed along the flow path of the gas ejected from the nozzle. The guide plates are spaced apart from each other to provide a space through which wire is passed from the spool to the capillary bonding head.

摘要翻译： 一种引线接合器，其包括从其引出线的线轴，用于保持线并将线从线轴向下延伸的毛细管接合头和张紧机构。 张紧机构包括用于将喷射气体引导到导线上的喷嘴，其中喷嘴被设置成与沿着从喷嘴喷出的气体的流动路径设置的两个引导板相对。 引导板彼此间隔开，以提供线从线轴通过毛细结合头的空间。