公开(公告)号：US20180179476A1

公开(公告)日：2018-06-28

申请号：US15577145

申请日：2016-05-26

Applicant: TBF ENVIRONMENTAL TECHNOLOGY INC.

Inventor： David Anthony Pasin ,  Shira Devorah Bogner

IPC: C11D7/50 ,  C09D9/00 ,  C09D7/20 ,  C09D11/00

CPC classification number: C11D7/5018 ,  C09D7/20 ,  C09D9/005 ,  C09D11/00 ,  C11D7/5009 ,  C11D7/5022

Abstract: The present disclosure provides, in part, a solvent composition for use as a heptane replacement. The solvent composition may include a first methylated organosilicon compound, an acetate ester, and either para-Chlorobenzotrifluoride (PCBTF) or a second methylated organosilicon compound or both.

公开(公告)号：US20180141090A1

公开(公告)日：2018-05-24

申请号：US15570855

申请日：2016-05-09

Applicant: ZEON CORPORATION

Inventor： Keiji ANDO ,  Noriyasu OTSUKI

IPC: B08B3/10 ,  B08B3/08 ,  C09D9/00

CPC classification number: B08B3/10 ,  B08B3/08 ,  B08B2220/04 ,  C08J11/06 ,  C08J11/20 ,  C09D9/00 ,  C09D9/005 ,  C11D7/261 ,  C11D7/30 ,  C11D7/5018 ,  C11D7/5022 ,  C11D7/5081

Abstract: A release solvent composition for releasing a thermosetting resin coating film coated on a thermoplastic resin molded article, and the release solvent composition containing 1,1,2,2,3,3,4-heptafluorocyclopentane and aromatic alcohols and having no flash point.

公开(公告)号：US09944890B2

公开(公告)日：2018-04-17

申请号：US15028137

申请日：2013-11-11

Applicant: Halliburton Energy Services, Inc.

Inventor： Philip Nguyen ,  Loan K. Vo

IPC: E21B37/00 ,  E21B37/06 ,  E21B37/08 ,  C09K8/035 ,  C09K8/524 ,  C11D3/20 ,  C11D3/26 ,  C11D3/28 ,  C11D3/43 ,  C11D11/00 ,  B08B3/08 ,  C11D7/06 ,  C11D7/26 ,  C11D7/50 ,  C09K8/56 ,  E21B41/00 ,  E21B43/16 ,  E21B43/267

CPC classification number: C11D11/0041 ,  B08B3/08 ,  C09K8/524 ,  C09K8/56 ,  C11D7/06 ,  C11D7/265 ,  C11D7/5013 ,  C11D7/5022 ,  E21B41/00 ,  E21B43/16 ,  E21B43/267

Abstract: Methods and compositions are provided for removing a residue of resin from the surface of equipment. In one embodiment, the methods comprise: providing a cleaning solution comprising a pH-adjusting agent, a chemical solvent, and water, wherein the chemical solvent is selected from the group consisting of β-lactam, γ-lactam, δ-lactam, ϵ-lactam, 2-pyrrolidone, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone (DMI), caprolactam, cyclohexanone, cyclopentanone, β-butyrolactone, γ-butyrolactone, δ-decalactone, γ-valerolactone, ϵ-caprolactone, butylene carbonate, propylene carbonate, and ethylene carbonate, any combination thereof, and any derivative thereof; allowing the cleaning solution to contact a surface at least partially coated with a layer of resin; and allowing the cleaning solution to at least partially dissolve the resin.

公开(公告)号：US09920286B2

公开(公告)日：2018-03-20

申请号：US15084295

申请日：2016-03-29

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Tomoya Kumagai ,  Takahiro Eto

IPC: H01L21/02 ,  C11D7/50 ,  G03F7/42 ,  B08B3/08 ,  C11D7/08 ,  C11D7/26 ,  C11D7/32

CPC classification number: C11D7/5022 ,  B08B3/08 ,  C11D7/08 ,  C11D7/263 ,  C11D7/3209 ,  C11D7/5009 ,  G03F7/423 ,  G03F7/425 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/02068

Abstract: A cleaning liquid for lithography, and a method for forming a wiring using the cleaning liquid for lithography. The cleaning liquid for includes an alkali or an acid, a solvent, and a silicon compound generating a silanol group through hydrolysis. The method forms a metal wiring layer by embedding a metal in an etching space formed in a low dielectric constant layer of a semiconductor multilayer laminate. In this method, the semiconductor multilayer laminate is cleaned using the cleaning liquid for lithography, after formation of the etching space.

公开(公告)号：US09914902B2

公开(公告)日：2018-03-13

申请号：US14979787

申请日：2015-12-28

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Bing Du ,  Thomas Dory ,  William A. Wojtczak

IPC: C11D7/50 ,  C11D11/00 ,  C11D7/32 ,  C11D3/43 ,  C11D3/30 ,  H01L21/311 ,  C11D3/00 ,  C11D3/20 ,  C11D3/28 ,  C11D7/26 ,  G03F7/42

CPC classification number: C11D11/0047 ,  C11D3/0026 ,  C11D3/2006 ,  C11D3/28 ,  C11D3/30 ,  C11D3/43 ,  C11D7/261 ,  C11D7/3209 ,  C11D7/3281 ,  C11D7/5009 ,  C11D7/5013 ,  C11D7/5022 ,  G03F7/423 ,  G03F7/425 ,  G03F7/426 ,  H01L21/31133

Abstract: This disclosure relates to photoresist stripping compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one alcohol solvent; 3) at least one quaternary ammonium hydroxide; 4) water; 5) at least one copper corrosion inhibitor selected from 6-substituted-2,4-diamino-1,3,5-triazines; and 6) optionally, at least one defoaming surfactant.

公开(公告)号：US09815097B2

公开(公告)日：2017-11-14

申请号：US14344470

申请日：2012-09-13

Applicant: Jamie J. Juliette ,  Philippe P. Maillot ,  Joy L. Mendoza

Inventor： Jamie J. Juliette ,  Philippe P. Maillot ,  Joy L. Mendoza

IPC: B08B9/00 ,  B08B9/08 ,  B08B9/093 ,  C11D7/50 ,  B08B3/00 ,  B08B3/02 ,  B08B3/04 ,  B08B9/02 ,  B08B9/027

CPC classification number: B08B9/08 ,  B08B3/00 ,  B08B3/02 ,  B08B3/04 ,  B08B9/00 ,  B08B9/02 ,  B08B9/027 ,  B08B9/0804 ,  B08B9/0808 ,  B08B9/0813 ,  B08B9/0817 ,  B08B9/0933 ,  C11D7/5022

Abstract: Provided is a method for removing deposited solid residue from equipment used in the processing of (meth)acrylic acid or esters, including the steps of dissolving the solid residue in a cleaning solution comprising an organic carboxylic acid to produce a solid residue slurry; and removing the solid residue slurry from the equipment.

公开(公告)号：US20170306272A1

公开(公告)日：2017-10-26

申请号：US15488786

申请日：2017-04-17

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Masaya Ueno ,  Hideyoshi Yanagisawa

IPC: C11D11/00 ,  C11D7/32 ,  C11D7/50 ,  H01L21/02 ,  C11D7/26 ,  H01L21/683

CPC classification number: C11D11/0047 ,  C08G77/16 ,  C09J183/04 ,  C11D7/261 ,  C11D7/3209 ,  C11D7/5004 ,  C11D7/5022 ,  C11D7/5027 ,  H01L21/02013 ,  H01L21/02057 ,  H01L21/0209 ,  H01L21/31111 ,  H01L21/31133 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/68381 ,  C08L83/00

Abstract: A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C3-C6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

公开(公告)号：US09790457B2

公开(公告)日：2017-10-17

申请号：US15374075

申请日：2016-12-09

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Ryan Hulse ,  Kane D Cook

IPC: B08B3/00 ,  C11D11/00 ,  C11D7/50 ,  C11D3/24 ,  C11D7/30 ,  B08B3/02 ,  B08B3/08 ,  B08B5/00 ,  B08B3/04

CPC classification number: C11D11/0041 ,  B08B3/00 ,  B08B3/02 ,  B08B3/04 ,  B08B3/08 ,  B08B5/00 ,  C11D3/245 ,  C11D7/30 ,  C11D7/5018 ,  C11D7/5022 ,  C11D11/0029 ,  C23G5/02809 ,  C23G5/02825

Abstract: The present invention relates, in part, to cleaning methods and solvent cleaning compositions including at least one hydrofluoro-olefin or hydrochlorofluoro-olefin solvent for use in connection with cleaning of metal parts, and in certain preferred embodiments cleaning metal parts to be used in an aircraft.

公开(公告)号：US20170216171A1

公开(公告)日：2017-08-03

申请号：US15494183

申请日：2017-04-21

Applicant: Dupont Tate & Lyle Bio Products Company, LLC

Inventor： Ann Wehner ,  Gyorgyi Fenyvesi ,  Carl F. Muska ,  Joseph W. DeSalvo ,  Melissa Joerger ,  Robert Miller ,  Irwin A. Palefsky ,  Raja Hari Poladi

IPC: A61K8/34 ,  A61Q17/04 ,  A61K47/10 ,  A61Q17/00 ,  A61Q5/12 ,  A61Q19/10 ,  A61Q15/00 ,  A61Q1/02 ,  A61Q5/02 ,  A61Q1/14 ,  A61Q1/10 ,  A61Q1/08 ,  A61Q5/06 ,  A61Q9/02 ,  C09K3/18 ,  C09D7/12 ,  A01N25/02 ,  C09D11/03 ,  C09D11/38 ,  A01N3/00 ,  C09D11/16 ,  C08K5/053 ,  A01N1/02 ,  C11D3/20 ,  C11D11/00 ,  C09K5/10 ,  C10M129/08 ,  A21D2/14 ,  A23B7/154 ,  A23K20/105 ,  A23L2/52 ,  A23L3/3463 ,  A23L29/10 ,  A23L33/10 ,  C02F5/10 ,  A61Q19/00

CPC classification number: A61K8/345 ,  A01N1/021 ,  A01N3/00 ,  A01N25/02 ,  A21D2/14 ,  A23B7/154 ,  A23K20/105 ,  A23L2/52 ,  A23L3/3463 ,  A23L29/035 ,  A23L29/04 ,  A23L29/10 ,  A23L33/10 ,  A23L33/12 ,  A23V2002/00 ,  A61K8/0208 ,  A61K8/375 ,  A61K8/92 ,  A61K9/0019 ,  A61K9/06 ,  A61K9/282 ,  A61K31/22 ,  A61K36/02 ,  A61K36/185 ,  A61K36/28 ,  A61K36/355 ,  A61K36/61 ,  A61K36/738 ,  A61K47/10 ,  A61K47/14 ,  A61K47/44 ,  A61K2800/10 ,  A61K2800/75 ,  A61Q1/02 ,  A61Q1/08 ,  A61Q1/10 ,  A61Q1/14 ,  A61Q5/00 ,  A61Q5/02 ,  A61Q5/065 ,  A61Q5/10 ,  A61Q5/12 ,  A61Q9/02 ,  A61Q9/04 ,  A61Q11/00 ,  A61Q13/00 ,  A61Q15/00 ,  A61Q17/00 ,  A61Q17/005 ,  A61Q17/04 ,  A61Q19/00 ,  A61Q19/002 ,  A61Q19/005 ,  A61Q19/007 ,  A61Q19/008 ,  A61Q19/04 ,  A61Q19/10 ,  B01D11/0288 ,  C02F5/10 ,  C07C67/08 ,  C07C69/16 ,  C07C69/28 ,  C07C69/44 ,  C07C69/58 ,  C07C69/60 ,  C07C69/78 ,  C08K5/053 ,  C08K5/103 ,  C08K2201/018 ,  C09D7/63 ,  C09D11/03 ,  C09D11/16 ,  C09D11/38 ,  C09G1/08 ,  C09K3/18 ,  C09K3/185 ,  C09K5/10 ,  C09K5/20 ,  C10M129/08 ,  C10M2207/022 ,  C10M2207/04 ,  C10M2207/283 ,  C10M2209/086 ,  C10M2215/042 ,  C10M2215/223 ,  C10M2229/0425 ,  C10N2230/64 ,  C10N2240/08 ,  C11C3/003 ,  C11D1/667 ,  C11D3/2003 ,  C11D3/2044 ,  C11D3/2068 ,  C11D3/2093 ,  C11D3/3418 ,  C11D3/38663 ,  C11D7/266 ,  C11D7/5022 ,  C11D11/0017 ,  C11D11/0023 ,  C12P7/18 ,  C12P7/42 ,  C12P7/62 ,  Y02W10/37 ,  C08L67/04

Abstract: Disclosed herein are biodegradable compositions comprising 1,3-propanediol, wherein the 1,3-propanediol in said biodegradable composition has a bio-based carbon content of about 1% to 100%. In addition, it is preferred that the 1,3-propanediol be biologically-derived, and wherein upon biodegradation, the biologically-derived 1,3-propanediol contributes no anthropogenic CO2 emissions to the atmosphere.

公开(公告)号：US20170200619A1

公开(公告)日：2017-07-13

申请号：US15316358

申请日：2015-06-02

Applicant: ENTEGRIS, INC.

Inventor： Emanuel I. COOPER ,  Steven LIPPY ,  Lingyan SONG

IPC: H01L21/311 ,  H01L21/027 ,  C09K13/08 ,  C09K13/10 ,  C11D11/00 ,  C11D7/50 ,  C11D7/08 ,  C11D7/28 ,  C11D7/36 ,  C11D7/34 ,  C11D7/26 ,  C11D7/32 ,  C11D7/22 ,  C11D7/14 ,  H01L21/02

CPC classification number: H01L21/31133 ,  C09K13/08 ,  C09K13/10 ,  C11D7/08 ,  C11D7/14 ,  C11D7/22 ,  C11D7/265 ,  C11D7/28 ,  C11D7/3263 ,  C11D7/3281 ,  C11D7/34 ,  C11D7/36 ,  C11D7/5022 ,  C11D11/0047 ,  C23F1/26 ,  H01L21/02063 ,  H01L21/02071 ,  H01L21/0276 ,  H01L21/31111

Abstract: A liquid removal composition and process for removing anti-reflective coating (ARC) material and/or post-etch residue from a substrate having same thereon. The composition achieves at least partial removal of ARC material and/or post-etch residue in the manufacture of integrated circuitry with minimal etching of metal species on the substrate, such as aluminum, copper and cobalt alloys, and without damage to low-k dielectric and nitride-containing materials employed in the semiconductor architecture.