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    Integral cooling system for electric components
    11.
    发明授权
    Integral cooling system for electric components 失效
    电器元件整体冷却系统

    公开(公告)号：US5309319A

    公开(公告)日：1994-05-03

    申请号：US860226

    申请日：1992-03-27

    Applicant: Gaetano P. Messina

    Inventor： Gaetano P. Messina

    IPC: F25D17/02 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

    CPC classification number: H01L23/4338 ,  H01L23/4336 ,  H01L2924/0002

    Abstract: An integral cooling system for cooling a plurality of electronic components, including: a cooling fluid manifold for mounting over the plurality of electronic components; a main fluid inflow duct within the manifold for supplying pumped cooling fluid; a main fluid outflow duct within the manifold for removing pumped cooling fluid; for each respective electronic component of the plurality of electronic components: a component cooling chamber within the manifold, for application of cooling fluid to an area immediately adjacent the electronic component; a fluid supplying duct within the manifold to supply cooling fluid from the main fluid inflow duct to the chamber; and, a fluid removing duct within the manifold to remove cooling fluid from the chamber to the main fluid outflow duct. In preferred embodiments, there is a thermally-conductive slug or piston disposed between the respective electronic component and component cooling chamber to prevent direct application of a flow of the pumped cooling fluid to the respective electronic component, and to encourage uniform cooling across the respective electronic component.

    Abstract translation: 一种用于冷却多个电子部件的集成冷却系统，包括：用于安装在所述多个电子部件上的冷却流体歧管; 歧管内的主流体流入管道，用于提供泵送的冷却流体; 歧管内的主流体流出管道，用于去除泵送的冷却流体; 对于所述多个电子部件的每个相应的电子部件：所述歧管内的部件冷却室，用于将冷却流体施加到紧邻所述电子部件的区域; 歧管内的流体供应管道，用于将冷却流体从主流体流入管道供应到腔室; 以及歧管内的流体移除管道，以将冷却流体从腔室移除到主流体流出管道。 在优选实施例中，存在设置在相应的电子部件和部件冷却室之间的导热塞或活塞，以防止将泵送的冷却流体的流直接施加到相应的电子部件，并且促进横跨相应电子元件的均匀冷却 零件。

    Thermal conduction module with integral impingement cooling
    12.
    发明授权
    Thermal conduction module with integral impingement cooling 失效
    具有整体冲击冷却的导热模块

    公开(公告)号：US5177667A

    公开(公告)日：1993-01-05

    申请号：US783631

    申请日：1991-10-25

    Applicant: Nadia H. Graham ,  Kevin P. Moran

    Inventor： Nadia H. Graham ,  Kevin P. Moran

    IPC: H01L23/433

    CPC classification number: H01L23/4336 ,  H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253

    Abstract: A thermal conduction module for cooling an array of integrated circuit chips mounted on a substrate includes a moveable piston for cooling the chips, the piston having a base, urged against an upper surface of the chips, of thermally conductive material. The base has on the lower surface thereof cups or channels between adjacent rows of the chips, and, on the upper surface thereof, parallel channels directly over the chips. The piston includes members extending downward into the upper surface channels for directing a flow of coolant into the upper surface channels and impinging the coolant on the channel bottoms. The flow directing members may be plate-like baffles or nozzles. The piston also includes passages for directing coolant from one upper surface channel to an adjacent upper surface channel in a flow direction perpendicular to the axes of the upper surface channels.

    Abstract translation: 用于冷却安装在基板上的集成电路芯片的阵列的热传导模块包括用于冷却芯片的活动活塞，活塞具有抵靠芯片上表面的导热材料的底部。 底座在其下表面上具有在芯片的相邻行之间的杯或通道，并且在其上表面上具有直接在芯片上的平行通道。 活塞包括向下延伸到上表面通道中的构件，用于将冷却剂流引导到上表面通道中并将冷却剂撞击在通道底部上。 流动引导构件可以是板状挡板或喷嘴。 活塞还包括用于在垂直于上表面通道的轴线的流动方向上将冷却剂从一个上表面通道引导到相邻的上表面通道的通道。

    Apparatus for cooling integrated circuit chips with forced coolant jet
    13.
    发明授权
    Apparatus for cooling integrated circuit chips with forced coolant jet 失效
    用强制冷却剂喷射冷却集成电路芯片的装置

    公开(公告)号：US4750086A

    公开(公告)日：1988-06-07

    申请号：US807713

    申请日：1985-12-11

    Applicant: Faquir C. Mittal

    Inventor： Faquir C. Mittal

    IPC: H01L23/433 ,  H05K7/20

    CPC classification number: H01L23/4336 ,  H01L23/4332 ,  H01L2924/0002 ,  Y10S165/908

    Abstract: The capability of the microbellows cooling technique to remove heat from multi-chip modules is enhanced with a highly conductive, rigid, heat spreader. The heat spreader has a planar surface urged against a planar surface of the chip by the flexible microbellows. The surface area of the heat spreader is greater than the mating surface area of the chip. The heat spreader is attached to the bottom surface of the microbellows. The surface area of the heat spreader which mates with the surface of the chip is highly polished and coated with a highly conductive soft metal. A jet of coolant is forced into the inner surface of the microbellows.

    Abstract translation: 使用高导电性，刚性的散热器，可以提高微波冷却技术从多芯片模块中去除热量的能力。 散热器具有通过柔性微型薄片推压到芯片的平坦表面的平坦表面。 散热器的表面积大于芯片的配合面积。 散热器附着在微波管的底面。 与芯片表面配合的散热器的表面积被高度抛光并涂覆有高导电软金属。 冷却剂射流被迫进入微波导管的内表面。

    COOLER
    18.
    发明申请
    COOLER 审中-公开
    冷却器

    公开(公告)号：US20160365301A1

    公开(公告)日：2016-12-15

    申请号：US15102732

    申请日：2014-11-26

    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA

    Inventor： Yuya TAKANO

    IPC: H01L23/473

    CPC classification number: H01L23/4735 ,  F28F25/06 ,  H01L23/4336 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A cooler (1) includes: a fin (20) having a coolant inflow port (110a); and a nozzle (10) configured to eject the supplied coolant toward the coolant inflow port (110a). The nozzle (10) includes a flow passage wall (13), a tip end (14), a pressure receiving portion (16) and a deformation portion (15). The tip end (14) provides a coolant supply hole (12) that ejects the coolant flowing through the flow passage. The pressure receiving portion (16) is configured to be provided between the flow passage wall (13) and the coolant supply hole (12), and to receive force in an ejection direction of the coolant. The deformation portion (15) is configured to be provided either of between the flow passage wall (13) and the pressure receiving portion (16) and in the pressure receiving portion (16), and to displace the coolant supply hole (12) in the ejection direction of the coolant in response to the force in the ejection direction of the coolant, the force being received by the pressure receiving portion (16).

    Abstract translation: 冷却器（1）包括：具有冷却剂流入口（110a）的翅片（20）; 以及喷嘴（10），其构造成朝向冷却剂流入口（110a）喷射供应的冷却剂。 喷嘴（10）包括流动通道壁（13），顶端（14），受压部分（16）和变形部分（15）。 尖端（14）提供喷射流过流道的冷却剂的冷却剂供应孔（12）。 受压部（16）构造成设置在流路壁（13）和冷却剂供给孔（12）之间，并且在冷却剂的排出方向上受力。 变形部分（15）构造成设置在流动通道壁（13）和受压部分（16）之间和压力接收部分（16）之间，并使冷却剂供给孔（12）位于 响应于冷却剂的喷射方向上的力的冷却剂的喷射方向，所述力由压力接收部分（16）接收。

    Thermal management solution for circuit products
    19.
    发明授权
    Thermal management solution for circuit products 有权
    电路产品热管理解决方案

    公开(公告)号：US09477275B2

    公开(公告)日：2016-10-25

    申请号：US13745553

    申请日：2013-01-18

    Applicant: Arnab Choudhury ,  Je-Young Chang ,  David W. Song ,  Edvin Cetegen ,  Ashish Gupta

    Inventor： Arnab Choudhury ,  Je-Young Chang ,  David W. Song ,  Edvin Cetegen ,  Ashish Gupta

    IPC: H01L23/473 ,  H05K7/20 ,  G06F1/20 ,  H01L23/433

    CPC classification number: G06F1/206 ,  F28F2260/02 ,  G06F2200/201 ,  H01L23/4336 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An apparatus including a cold plate body; a channel module disposed within the cold plate body including a channel body and a plurality of channels projecting through the channel body; and a manifold disposed on the channel module, the manifold including an inlet and an outlet and a first plurality of apertures in fluid communication with the inlet and a second plurality of apertures are in fluid communication with the outlet. A method including introducing a fluid to an integrated cold plate disposed on an integrated circuit device, the integrated cold plate comprising a cold plate body extending about the device, the fluid being introduced into a manifold in fluid communication with a channel module disposed between the manifold and a base plate, the channel module, and including channels to direct the fluid toward the base plate, and collecting the fluid returned to the manifold.

    Abstract translation: 一种包括冷板体的设备; 设置在所述冷板主体内的通道模块，包括通道主体和穿过所述通道主体突出的多个通道; 以及歧管，其设置在所述通道模块上，所述歧管包括入口和出口以及与所述入口流体连通的第一多个孔，并且第二多个孔与所述出口流体连通。 一种方法，包括将流体引入设置在集成电路装置上的集成冷板，所述集成冷板包括围绕所述装置延伸的冷板体，所述流体被引入歧管中，所述歧管与设置在所述歧管之间的通道模块流体连通 和基板，通道模块，并且包括用于将流体引向基板的通道，以及收集返回到歧管的流体。

    Architecture for gas cooled parallel microchannel array cooler
    20.
    发明授权
    Architecture for gas cooled parallel microchannel array cooler 有权
    气冷平行微通道阵列冷却器结构

    公开(公告)号：US09455213B2

    公开(公告)日：2016-09-27

    申请号：US12870651

    申请日：2010-08-27

    Applicant: Scott T. Johnson

    Inventor： Scott T. Johnson

    IPC: F28F7/00 ,  H01L23/467 ,  H01L23/46 ,  H01L23/433 ,  H05K7/20

    CPC classification number: H01L23/467 ,  H01L23/4336 ,  H01L23/46 ,  H01L2924/0002 ,  H05K7/20136 ,  H01L2924/00

    Abstract: Effective utilization of a parallel flow air-cooled microchannel array at the micro electro mechanical systems (MEMS) scale is prohibited by unfavorable flow patterns in simple rectangular arrays. The primary problem encountered is the inability of the flow stream to penetrate a sufficient depth into the fin core to achieve the desired fin efficiency. Embodiments of the present invention overcome this problem using a manifold with open nozzle discharge and integrated lateral exhaust along with a microchannel array cooler with micro spreading cavities for internal air distribution.

    Abstract translation: 在微电子机械系统（MEMS）规模下有效利用并联流风冷微通道阵列是由简单矩形阵列中不利的流动模式所禁止的。 遇到的主要问题是流动流不能将足够的深度穿透到翅片芯中以实现期望的翅片效率。 本发明的实施例使用具有开口喷嘴排放和集成横向排气的歧管以及具有用于内部空气分配的微扩散腔的微通道阵列冷却器来克服这个问题。

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