公开(公告)号：US08033698B2

公开(公告)日：2011-10-11

申请号：US12322463

申请日：2009-02-04

Applicant: Joseph Ivan Rodolph Boivin ,  Phillip Reep

Inventor： Joseph Ivan Rodolph Boivin ,  Phillip Reep

IPC: B60Q1/26

CPC classification number: B60R1/1207 ,  B60Q1/2665 ,  H05K3/306 ,  H05K2201/10106 ,  H05K2201/10424 ,  H05K2201/10484 ,  H05K2201/2036

Abstract: An integrated light-emitting diode (LED) indicator display assembly having a carrier plate including a plurality of LED mounting steps. Electrical contact leads for LEDs carried on the mounting steps extend through openings in the mounting steps and out the bottom side of the carrier plate for engaging a metal fret to power the LED array. Preferably, a vibration dampening member is positioned between the LED and the LED mounting step, and a protective covering is applied over the metal fret along the bottom side of the carrier plate to enclose the metal fret and secures the metal fret in place.

Abstract translation: 一种集成发光二极管（LED）指示显示组件，其具有包括多个LED安装步骤的载体板。 在安装步骤上携带的LED的电接触引线延伸穿过安装步骤中的开口并且延伸到载体板的底侧，用于接合金属支架以为LED阵列供电。 优选地，减震构件位于LED和LED安装步骤之间，并且保护覆盖物沿着承载板的底侧施加在金属架上，以封闭金属支架并将金属支架固定就位。

公开(公告)号：US20100197150A1

公开(公告)日：2010-08-05

申请号：US12364333

申请日：2009-02-02

Applicant: Dalibor Smejtek

Inventor： Dalibor Smejtek

IPC: H01R12/00

CPC classification number: H05K3/366 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/10484

Abstract: A printed circuit assembly includes a base printed circuit having a printed circuit receiving area and a plurality of electrical contacts provided on the printed circuit receiving area. The printed circuit assembly also includes a secondary printed circuit having a secondary substrate including a mating edge and a plurality of secondary contacts provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.

Abstract translation: 印刷电路组件包括具有印刷电路接收区域的基本印刷电路和设置在印刷电路接收区域上的多个电触点。 印刷电路组件还包括二次印刷电路，其具有包括配合边缘的辅助基板和沿着配合边缘设置的多个辅助触点。 二次印刷电路安装在基板印刷电路上，使得二次印刷电路的配合边缘与印刷电路接收区域的基本印刷电路直接接合。 每个次级触点电连接到基本印刷电路的相应的一个电触点。

公开(公告)号：US20100021756A1

公开(公告)日：2010-01-28

申请号：US12506598

申请日：2009-07-21

Applicant: Masahiro YAMAZAKI ,  Yasumasa SHIBATA ,  Yasuo UEDA

Inventor： Masahiro YAMAZAKI ,  Yasumasa SHIBATA ,  Yasuo UEDA

IPC: B32B3/00 ,  B23K1/20

CPC classification number: H05K3/363 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/10484 ,  H05K2201/10606 ,  H05K2203/0195 ,  Y10T428/1241

Abstract: A junction structure and a joining method of substrates are provided that stably can join the substrates and achieve high workability during joining. A second substrate 2 to be joined with solder to a first substrate 1 is bent with elasticity generated by a bending portion 9, and first joints 5 on the first substrate 1 and second joints 6 on the second substrate 2 are joined with solder in a state in which the first substrate 1 is brought into contact with, in a direction that increases the bending angle of the bending portion 9, a part where the joints 6 are formed on the second substrate 2.

Abstract translation: 提供了一种基板的接合结构和接合方法，其可以稳定地连接基板，并且在接合期间实现高的可加工性。 将与焊料接合到第一基板1的第二基板2由弯曲部9产生的弹性弯曲，并且第一基板1上的第一接头5和第二基板2上的第二接头6在焊料中以一种状态接合 其中第一基板1沿着增加弯曲部9的弯曲角度的方向与在第二基板2上形成接头6的部分接触。

公开(公告)号：US07625099B2

公开(公告)日：2009-12-01

申请号：US11967842

申请日：2007-12-31

Applicant: James Newton ,  Bijan Bayat

Inventor： James Newton ,  Bijan Bayat

IPC: F21V1/00

CPC classification number: H05K3/301 ,  F21K9/00 ,  F21L14/023 ,  F21V14/02 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K1/148 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/2027

Abstract: An LED lighting array is disclosed wherein a plurality of light emitting devices disposed in at least first and second columns are mounted on a planar mounting surface to form an emission plane. The emission axes of all the LEDs in a first column are parallel with each other and lie in a first plane. The emission axes of the LEDs in an adjacent, second column are also parallel, but a second plane containing the emission axes of the second column is disposed at a predetermined, non-zero angle with respect to the first plane. The non-zero angle is a function of the LED beam width and the distance to a lighting target. This configuration of the LEDs provides an optimum balance at a predetermined target distance between the size of the area illuminated and the brightness of the illumination of the target. In one aspect of the invention the LED lighting array includes at least first, second and third columns of LEDs. In another aspect of the invention an LED task light includes a transparent tube and an LED lighting array disposed within the tube. An electrical drive circuit associated with the mounting substrate within the tube provides pulsed direct current for driving the LED's.

Abstract translation: 公开了一种LED照明阵列，其中设置在至少第一和第二列中的多个发光器件安装在平面安装表面上以形成发射平面。 第一列中的所有LED的发射轴彼此平行并且位于第一平面中。 相邻的第二列中的LED的发射轴也是平行的，但是包含第二列的发射轴的第二平面相对于第一平面设置在预定的非零角度。 非零角度是LED光束宽度和到照明目标的距离的函数。 LED的这种配置在照明区域的尺寸和目标照明的亮度之间的预定目标距离处提供最佳平衡。 在本发明的一个方面，LED照明阵列至少包括第一，第二和第三列的LED。 在本发明的另一方面，LED任务灯包括透明管和设置在管内的LED照明阵列。 与管内的安装基板相关联的电驱动电路提供用于驱动LED的脉冲直流电。

公开(公告)号：US20090201690A1

公开(公告)日：2009-08-13

申请号：US12322463

申请日：2009-02-04

Applicant: Joseph Ivan Rodolph Boivin ,  Phillip Reep

Inventor： Joseph Ivan Rodolph Boivin ,  Phillip Reep

IPC: B60R1/12

CPC classification number: B60R1/1207 ,  B60Q1/2665 ,  H05K3/306 ,  H05K2201/10106 ,  H05K2201/10424 ,  H05K2201/10484 ,  H05K2201/2036

Abstract: An integrated light-emitting diode (LED) indicator display assembly having a carrier plate including a plurality of LED mounting steps. Electrical contact leads for LEDs carried on the mounting steps extend through openings in the mounting steps and out the bottom side of the carrier plate for engaging a metal fret to power the LED array. Preferably, a vibration dampening member is positioned between the LED and the LED mounting step, and a protective covering is applied over the metal fret along the bottom side of the carrier plate to enclose the metal fret and secures the metal fret in place.

Abstract translation: 一种集成发光二极管（LED）指示显示组件，其具有包括多个LED安装步骤的载体板。 在安装步骤上携带的LED的电接触引线延伸穿过安装步骤中的开口并且延伸到载体板的底侧，用于接合金属支架以为LED阵列供电。 优选地，减震构件位于LED和LED安装步骤之间，并且保护覆盖物沿着承载板的底侧施加在金属架上，以封闭金属支架并将金属支架固定就位。

公开(公告)号：US20090141468A1

公开(公告)日：2009-06-04

申请号：US12138592

申请日：2008-06-13

Applicant: Yueh-Hsun Yang

Inventor： Yueh-Hsun Yang

IPC: H05K7/04

CPC classification number: H05K3/301 ,  F21V19/0025 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10295 ,  H05K2201/10484 ,  H05K2201/10962

Abstract: A lead-mounting seat includes a conductive seat body including a lead-mounting plate and spaced apart first and second insert legs that extend from the lead-mounting plate and that have different geometric shapes. The lead-mounting plate is formed with a plurality of lead-mounting holes. Each of the first and second insert legs has a connecting end connected to the lead-mounting plate, and a free end opposite to the connecting end. Each of the first and second insert legs is reduced in width from the connecting end to the free end.

Abstract translation: 引线安装座包括导电座体，其包括引线安装板和从引线安装板延伸并具有不同几何形状的间隔开的第一和第二插入腿。 引线安装板形成有多个引线安装孔。 第一和第二插入腿中的每一个具有连接到引线安装板的连接端和与连接端相对的自由端。 第一和第二插入腿中的每一个从连接端到自由端的宽度减小。

公开(公告)号：US07489524B2

公开(公告)日：2009-02-10

申请号：US11143201

申请日：2005-06-02

Applicant: Ronald Green ,  Sridhar Krishnan ,  Stuart E. Wilson ,  James Gill Shook ,  Ming Tsai ,  Andy Stavros

Inventor： Ronald Green ,  Sridhar Krishnan ,  Stuart E. Wilson ,  James Gill Shook ,  Ming Tsai ,  Andy Stavros

IPC: H05K1/11

CPC classification number: H05K3/368 ,  H05K1/145 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10484

Abstract: An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

Abstract translation: 提供了一种组件，其包括具有顶表面的第一电路板，设置在第一介电元件上的第一介电元件和第一导电迹线。 此外，第二电路板具有底表面，第二介电元件和设置在第二电介质元件上的第二导电迹线，其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。 该组件还包括具有第三电介质元件的互连电路板，第三电介质元件具有前表面，与前表面相对的后表面，在前表面和后表面之间延伸的顶端，在前表面和后表面之间延伸的底端，以及 布置在电介质元件上的多个互连迹线。 互连元件的底端邻接第一电路板的顶表面，并且顶端邻接第二电路板的底表面，其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通 互连线。

公开(公告)号：US20060262584A1

公开(公告)日：2006-11-23

申请号：US11461265

申请日：2006-07-31

Applicant: Robert Wallace ,  Robert Norman ,  Eliyahou Harari

Inventor： Robert Wallace ,  Robert Norman ,  Eliyahou Harari

IPC: G11C5/00

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡可以提供必要的控制器电路，并且因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。

公开(公告)号：US07046512B2

公开(公告)日：2006-05-16

申请号：US10958379

申请日：2004-10-06

Applicant: Reinhard Lecheler ,  Oskar Schallmoser

Inventor： Reinhard Lecheler ,  Oskar Schallmoser

IPC: G06F1/20

CPC classification number: H05B41/02 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10484

Abstract: The invention relates to a circuit for operation of a lamp with a component 4 to be cooled and with a heat sink 6, 6′ which includes an angle of 10°–70° with a circuit board 1.

Abstract translation: 本发明涉及一种用于操作具有要冷却的部件4和具有与电路板1成10°-70°角的散热片6,6'的灯的电路。

公开(公告)号：US20060018104A1

公开(公告)日：2006-01-26

申请号：US11080672

申请日：2005-03-16

Applicant: Hiroki Katayama ,  Yoshiaki Ishigami

Inventor： Hiroki Katayama ,  Yoshiaki Ishigami

IPC: H05K7/06

CPC classification number: H05K3/3442 ,  H05K1/0239 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/09072 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10121 ,  H05K2201/10484 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounted structure has: a circuit board; two semiconductor elements that are mounted on the circuit board; and an AC coupling capacitor that is operable to cut off signals with a predetermined frequency or less and is provided between the two semiconductor elements. The AC coupling capacitor is mounted on the circuit board such that a part or a whole of the AC coupling capacitor is away from the surface of the circuit board.

Abstract translation: 电子部件安装结构具有：电路板; 安装在电路板上的两个半导体元件; 以及AC耦合电容器，其可操作以以预定频率或更小的频率切断信号，并且设置在两个半导体元件之间。 AC耦合电容器安装在电路板上，使得AC耦合电容器的一部分或全部远离电路板的表面。