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    Semiconductor device
    201.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号：US6054752A

    公开(公告)日：2000-04-25

    申请号：US107507

    申请日：1998-06-30

    Applicant: Kazukuni Hara ,  Yuichi Takeuchi ,  Tsuyoshi Yamamoto ,  Rajesh Kumar ,  Mitsuhiro Kataoka

    Inventor： Kazukuni Hara ,  Yuichi Takeuchi ,  Tsuyoshi Yamamoto ,  Rajesh Kumar ,  Mitsuhiro Kataoka

    IPC: H01L21/04 ,  H01L29/06 ,  H01L29/24 ,  H01L29/78 ,  H01L29/34 ,  H01L29/40

    CPC classification number: H01L29/7813 ,  H01L29/0611 ,  H01L29/0638 ,  H01L29/66068 ,  H01L29/7802 ,  H01L29/1608

    Abstract: A semiconductor device comprises a semiconductor substrate including a first conductivity type first semiconductor layer and a second conductivity type second semiconductor layer formed on the first semiconductor layer. A unit cell for controlling current flowing between a source electrode and a drain electrode is formed in the semiconductor substrate. A trench is formed in a peripheral region of the unit cell to form mesa structure. A field relaxing layer is formed between an insulating film on a side face of the second trench and both the first semiconductor layer and the second semiconductor layer in order to relax concentration of an electric field in the insulating film.

    Abstract translation: 半导体器件包括：半导体衬底，包括形成在第一半导体层上的第一导电型第一半导体层和第二导电型第二半导体层。 在半导体衬底中形成用于控制在源电极和漏电极之间流动的电流的单元。 在单电池的周边区域形成沟槽，形成台面结构。 在第二沟槽的侧面上的绝缘膜与第一半导体层和第二半导体层之间形成场弛豫层，以使绝缘膜中的电场的集中化。

    Decoder having a split queue system for processing intstructions in a first queue separate from their associated data processed in a second queue
    202.
    发明授权
    Decoder having a split queue system for processing intstructions in a first queue separate from their associated data processed in a second queue 失效
    解码器具有分离队列系统，用于处理与在第二队列中处理的相关联的数据分离的第一队列中的指令

    公开(公告)号：US5668985A

    公开(公告)日：1997-09-16

    申请号：US204992

    申请日：1994-03-01

    Applicant: Adrian L. Carbine ,  Gary L. Brown ,  Bradley D. Hoyt ,  Donald D. Parker ,  Rajesh Kumar

    Inventor： Adrian L. Carbine ,  Gary L. Brown ,  Bradley D. Hoyt ,  Donald D. Parker ,  Rajesh Kumar

    IPC: G06F9/22 ,  G06F9/30 ,  G06F9/38

    CPC classification number: G06F9/30167 ,  G06F9/223 ,  G06F9/30145 ,  G06F9/3875

    Abstract: A split queue system for a decoder that supplies one or more micro-operations and data associated with the micro-operations. A main queue is coupled to receive one or more micro-operations from the decoder, and supply it to a next processing stage to provide a process micro-operation. A shadow queue is coupled to receive data associated with the micro-operation, in the same cycle that the micro-operation is supplied to the main queue. A control circuit is coupled to the main queue for issuing micro-operation from the main queue into the next processing stage in a first cycle, and in a second cycle issuing, the micro-operation therefrom. Also in the second cycle, the control circuit issues the data associated with the micro-operation from the shadow queue, so that the data is synchronized with its associated processed micro-operation.

    Abstract translation: 用于解码器的分离队列系统，其提供与微操作相关联的一个或多个微操作和数据。 主队列被耦合以从解码器接收一个或多个微操作，并将其提供给下一个处理阶段以提供处理微操作。 耦合影子队列以在微操作被提供给主队列的同一周期中接收与微操作相关联的数据。 控制电路耦合到主队列，用于在第一周期中从主队列发出微操作到下一个处理级，并且在第二周期中从其发出微操作。 同样在第二周期中，控制电路从影子队列发出与微操作相关联的数据，使得数据与其相关联的处理的微操作同步。

    Sub-topology discovery for operating hybrid solutions
    203.
    发明授权
    Sub-topology discovery for operating hybrid solutions 有权
    操作混合解决方案的子拓扑发现

    公开(公告)号：US09497081B2

    公开(公告)日：2016-11-15

    申请号：US13289330

    申请日：2011-11-04

    Applicant: Carlos M. Pignataro ,  Rajesh Kumar ,  Marc Holloman

    Inventor： Carlos M. Pignataro ,  Rajesh Kumar ,  Marc Holloman

    IPC: H04L12/24 ,  H04L12/751

    CPC classification number: H04L41/145 ,  H04L41/0856 ,  H04L41/12 ,  H04L41/147 ,  H04L41/22 ,  H04L45/02

    Abstract: Network topology information may be determined for a plurality of network devices on a network. System identifier information may then be determined for each of the plurality of network devices on the network. The system identifier information may be a list of network solutions that each network device actually or potentially belongs to. The system may then flag the system identifier information to indicate whether each solution is an actual or a potential solution.

    Abstract translation: 可以为网络上的多个网络设备确定网络拓扑信息。 然后可以为网络上的多个网络设备中的每一个确定系统标识符信息。 系统标识符信息可以是每个网络设备实际上或可能属于的网络解决方案的列表。 系统然后可以标记系统标识符信息以指示每个解决方案是实际的还是潜在的解决方案。

    Scalable language infrastructure for electronic system level tools
    205.
    发明授权
    Scalable language infrastructure for electronic system level tools 有权
    电子系统级工具的可扩展语言基础设施

    公开(公告)号：US08856731B2

    公开(公告)日：2014-10-07

    申请号：US13356472

    申请日：2012-01-23

    Applicant: Rajesh Kumar ,  Sanjay Kumar Jain

    Inventor： Rajesh Kumar ,  Sanjay Kumar Jain

    IPC: G06F9/44 ,  G06F9/45

    CPC classification number: G06F8/36

    Abstract: Systems and methods of scalable language infrastructure for electronic system level tools. In accordance with embodiments of the present invention, knowledge about types, functions and the like is encapsulated in a plurality of intelligent components called active component extension modules that are external to the infrastructure. The infrastructure implements a communication mechanism between the clients and these intelligent components, and acts as a common backbone. The infrastructure itself does not maintain any knowledge about any client, types, functions, etc. In accordance with a method embodiment of the present invention, a request is received from a client of a language infrastructure. The request is forwarded from the language infrastructure to an active component extension module. The active component extension module performs a service responsive to the request.

    Abstract translation: 用于电子系统级工具的可扩展语言基础设施的系统和方法。 根据本发明的实施例，关于类型，功能等的知识被封装在被称为活动组件扩展模块的多个智能组件中，该组件在基础设施外部。 基础架构实现了客户端和这些智能组件之间的通信机制，并且作为通用骨干网。 基础设施本身并不保持关于任何客户端，类型，功能等的任何知识。根据本发明的方法实施例，从语言基础设施的客户端接收请求。 该请求从语言基础设施转发到活动组件扩展模块。 活动组件扩展模块响应于该请求执行服务。

    Methods of manufacturing printed circuit boards
    210.
    发明授权
    Methods of manufacturing printed circuit boards 有权
    制造印刷电路板的方法

    公开(公告)号：US08567053B2

    公开(公告)日：2013-10-29

    申请号：US13153254

    申请日：2011-06-03

    Applicant: Rajesh Kumar ,  Monte P. Dreyer ,  Michael J. Taylor

    Inventor： Rajesh Kumar ,  Monte P. Dreyer ,  Michael J. Taylor

    IPC: H01K3/10

    CPC classification number: H05K3/4623 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T29/532

    Abstract: Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

    Abstract translation: 使用盲孔和内部微通孔来制造印刷电路板来耦合子组件的系统和方法。 本发明的一个实施例提供一种制造印刷电路的方法，包括附接多个金属层载体以形成第一子组件，该第一子组件包括在第一表面上的至少一个铜箔焊盘，将封装材料施加到第一子组件的第一表面上 固化封装材料和第一子组件; 在所述固化的包封材料的表面上施加层压粘合剂，在所述层压粘合剂和所述固化的封装材料中形成至少一个通孔，以暴露所述至少一个铜箔垫，附接多个金属层载体以形成第二子组件， 以及附接第一子组件和第二子组件。

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