Abstract:
A semiconductor acceleration sensor of a single integral type has a semiconductor substrate, a first nitride layer, a first poly-silicon layer, a second nitride layer, a second poly-silicon layer, a third nitride layer and a third poly-silicon layer which are fabricated in order. A movable section is formed in a part of the second poly-silicon layer placed in a cavity enclosed and sealed by the first nitride layer, the first poly-silicon layer, the second nitride layer, the second poly-silicon layer, the third nitride layer and the third poly-silicon layer. A fabrication method of the semiconductor acceleration sensor of a single integral type is also disclosed.
Abstract:
A micromechanical sensor unit for detecting acceleration has pendulums each with a spiral spring and a seismic mass. Supports each being connected to a respective one of the pendulums, and position sensors, each two of the position sensors is associated with a respective one of the pendulums. Each position sensor and an associated pendulum form a switch with a defined triggering threshold and at least two switches respond to the same direction of acceleration. At least one switch is a safing sensor with a separate tap of a sensor signal.
Abstract:
A semiconductor sensor provided with a planar circuit board and a resin package for protecting the circuit board. Further, a sensing element is mounted on the circuit board and outer electrodes are attached to a side edge portion of the circuit board. Moreover, includes the resin package, a groove, in which the circuit board is disposed. Thus the semiconductor sensor can be easily fabricated. Consequently, the manufacturing cost of a product or sensor can be reduced.
Abstract:
Process for the production of accelerometers using the silicon on insulator method. The process comprises the following stages: a) producing a conductive monocrystalline silicon film on a silicon substrate and separated from the latter by an insulating layer; b) etching the silicon film and the insulating layer up to the substrate in order to fix the shape of the mobile elements and the measuring device; c) producing electric contacts for the measuring devices; d) partial elimination of the insulating layer in order to free the mobile elements, the remainder of the insulating layer rendering integral the substrate and the moving elements.
Abstract:
A micro mechanical component of the present invention comprises a base, and at least one drive portion supported on the base and relatively driving to the base, in which the drive portion is formed from a diamond layer. Thus, because the drive portion has excellent mechanical strength and modulus of elasticity, the operational performance can be greatly improved as a micro mechanical component processed in a fine shape, from the conventional level. Further, because the drive portion exhibits excellent device characteristics under severe circumstances, the range of applications as a micro mechanical component can be widely expanded from the conventional range.
Abstract:
A surface type acceleration sensor includes a p-type single crystal silicon base plate, a cantilever functioning as a cantilever structure portion, and a plurality of strain gauges. The cantilever is disposed in a recess portion formed on the front face of the p-type single crystal silicon base plate so that the cantilever can be displaced in the upward and downward direction. The cantilever includes an epitaxial growth layer principally made of n-type single crystal silicon. The strain gauge is made of p-type silicon and formed on an upper face of the base end portion of the cantilever.
Abstract:
An acceleration sensing device having a cantilevered acceleration sensing beam mounted at one of its ends on a base mounted on a package substrate. Strain caused by the movement of a weight disposed at a free end of the acceleration sensing beam is detected with a bridge circuit. When the base separates from the package substrate, an abnormal state sensing electrode of the weight comes into electrical contact with the package substrate, which is a ground terminal, so that an output from a differential amplifier of the bridge circuit is fixed to a low (or high) level, warning of the abnormal state.
Abstract:
A digital accelerometer manufactured from arrays 11a-11e of micro-mechanical sensing elements 12. The sensing elements 12 of different arrays 11a-11e are designed for detecting acceleration in a particular rotational or translational direction, such that their response to acceleration in other directions is minimized. Further, the sensing elements 12 have size and proof mass parameters that may be adjusted to vary their frequency response and sensitivity to amplitude of acceleration. Arrays 11a-11e of sensing elements 12 provide detection of a range of frequency levels and amplitudes at each frequency. At an appropriate frequency and amplitude of an applied acceleration, a sensing element 12 moves to contact an electrode 126, producing an electrical signal, which may be stored as a data bit. The sensing elements, when used in combination with memory 15 and processing devices 16, results in an intelligent accelerometer whose fabrication techniques are compatible with those used for the digital processing devices.
Abstract:
A motion sensor is provided for sensing motion or acceleration of a body, such as an accelerometer for use in an on-board automotive safety control system or navigational system. The motion sensor is a piezoresistive motion sensor that operates in a closed loop force rebalance mode. As such, the motion sensor may be considered a hybrid of piezoresistive sensors and capacitive force rebalance sensors. The sensor achieves this novel combination through a mechanically-biased proof mass that enables-the use of a single electrode for maintaining the proof mass in a null position during the operation of the sensor.
Abstract:
A detector for detecting a physical quantity as a quantity of electricity has a detection portion, a portion for stimulating the detection portion and a signal processing portion, wherein a calibration signal is supplied from the signal processing portion to the detection portion via the stimulating portion so as to measure a specific response of the detection portion, whereby self-calibration and correction of the characteristic of the detector are performed in accordance with an amount of a change in the response.