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    Heat dissipative means for integrated circuit chip package
    201.
    发明授权
    Heat dissipative means for integrated circuit chip package 失效
    散热装置用于集成电路芯片封装

    公开(公告)号：US5659458A

    公开(公告)日：1997-08-19

    申请号：US301148

    申请日：1994-09-06

    Applicant: Lyle E. Patchen

    Inventor： Lyle E. Patchen

    IPC: H01L23/367 ,  H01L23/473 ,  H05K1/02 ,  H05K3/30 ,  H05K7/20

    CPC classification number: H01L23/473 ,  H01L23/3677 ,  H05K1/0204 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/064 ,  H05K2201/0979 ,  H05K2201/10333 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K3/303

    Abstract: An integrated circuit chip package has a substrate having first and second mutually parallel sides and a preselected thickness and a space on the first side for the mounting thereon of an electronic component having a body with a flat surface. The substrate further includes a plurality of elongated thermal conductive members, each having a head portion adapted to be in contact with the flat surface of the electronic component. The members further have elongated body portions of a preselected length greater than the thickness of the substrate. The thermal conductive members extend through preselected holes in the substrate whereby heat may be conducted from the flat surface of the component through the thermal conductive member to the other side of the substrate.

    Abstract translation: 集成电路芯片封装具有基板，该基板具有第一和第二相互平行的侧面，并且在第一侧上具有预定厚度和空间，用于安装具有平坦表面的主体的电子部件。 衬底还包括多个细长导热构件，每个具有适于与电子部件的平坦表面接触的头部。 这些构件还具有比衬底厚度大的预选长度的细长主体部分。 导热构件延伸穿过衬底中的预选孔，从而可以将热量从构件的平坦表面通过导热构件传导到衬底的另一侧。

    Apparatus having inner layers supporting surface-mount components
    202.
    发明授权
    Apparatus having inner layers supporting surface-mount components 失效
    具有支撑表面安装部件的内层的装置

    公开(公告)号：US5543586A

    公开(公告)日：1996-08-06

    申请号：US208519

    申请日：1994-03-11

    Applicant: Stanford W. Crane, Jr. ,  Maria M. Portuondo

    Inventor： Stanford W. Crane, Jr. ,  Maria M. Portuondo

    IPC: H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  H05K1/02

    CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H05K1/112 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/4623 ,  H01L2924/0002 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  H05K3/321 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149

    Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire from a device into the well such that the lead or wire is in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

    Abstract translation: 一种包括多层衬底的装置，所述多层衬底包括多层绝缘材料，至少一个阱形成在至少一层中，所述阱从所述多层衬底的外表面延伸到所述多层衬底的内表面 以及形成在多层基板的内表面上的阱内的导电部件; 以及具有延伸到阱中的至少一个导电引线或导线并与形成在多层基板的内表面上的导电部件直接物理接触的器件。 另外，制造装置的方法包括以下步骤：形成包括多层绝缘材料的多层基板，至少一层形成在至少一层中的阱，所述阱从多层的外表面延伸 在多层基板的内表面上形成有在多层基板的内表面上的导电部件， 并且将至少一个导电引线或线从器件延伸到阱中，使得引线或引线与形成在多层衬底的内表面上的导电部件直接物理接触。

    Circuit board spacer
    206.
    发明授权
    Circuit board spacer 失效
    电路板垫片

    公开(公告)号：US5255159A

    公开(公告)日：1993-10-19

    申请号：US603069

    申请日：1990-10-25

    Applicant: Douglas A. Seyk

    Inventor： Douglas A. Seyk

    IPC: B23K1/018 ,  H05K3/30 ,  H05K3/34 ,  H05K7/10 ,  B23K31/02

    CPC classification number: H05K7/1084 ,  B23K1/018 ,  H05K3/306 ,  H05K2201/09072 ,  H05K2201/10704 ,  H05K2201/2036 ,  H05K2203/0271 ,  H05K3/3447

    Abstract: A solder spacer device and method for use in positioning a grid pin array having a plurality of pins over a circuit board having a plurality of pin holes respectively receiving the pins. The spacer is pulled through a central opening in the circuit board after the pins are soldered in the holes to the circuit board. The spacer has a cylindrical body which is positioned in the central opening and has a plurality of radial legs having respective flexure portions for separating the pin grid array from the circuit board during soldering and for folding into the central opening during extraction through the central opening after the soldering is finished.

    Abstract translation: 一种焊接间隔装置和方法，用于将具有多个销的栅极引脚阵列定位在电路板上，该电路板具有分别接收引脚的多个引脚孔。 在将引脚焊接到电路板的孔中之后，将间隔物拉过电路板中的中心开口。 间隔件具有定位在中心开口中的圆柱体，并且具有多个径向支腿，其具有相应的弯曲部分，用于在焊接期间将销栅格阵列与电路板分离，并且在通过中心开口提取之前折叠到中心开口中 焊接完成。

    Integrated preforms
    207.
    发明授权
    Integrated preforms 失效
    集成预制件

    公开(公告)号：US5242097A

    公开(公告)日：1993-09-07

    申请号：US904828

    申请日：1992-06-26

    Applicant: Paul A. Socha

    Inventor： Paul A. Socha

    IPC: B23K35/02 ,  B23K35/14 ,  H05K3/34

    CPC classification number: B23K35/0222 ,  H05K3/3447 ,  H05K3/3478 ,  H05K2201/0305 ,  H05K2201/10424 ,  H05K2201/10704 ,  H05K2203/0415

    Abstract: A solder preform containing a series of islands that are joined together in a matrix by bridging bands. Each band has a reduced cross-sectional area in its midregion. In one form of this invention, at least some of the islands contain pin receiving holes formed therein and solder tabs that are arranged to frictionally engage a pin that is passed into the hole to prevent the preform from being misaligned or dislodged from the pins and which at the time of bonding, prewets the pins to promote flowing of solder to the pins from the islands to form a superior solder joint.

    Abstract translation: 包含一系列岛的焊料预制件，其通过桥接带在矩阵中连接在一起。 每个带在其中区具有减小的横截面积。 在本发明的一种形式中，至少一些岛包含形成在其中的销接收孔和被布置成摩擦地接合穿过孔的销的焊接片，以防止预成型件从销偏移或脱离，并且哪个 在接合时，预先润湿引脚以促进焊料从岛上引导到管脚上以形成优异的焊点。

    Mechanical translator for semiconductor chips
    208.
    发明授权
    Mechanical translator for semiconductor chips 失效
    半导体芯片的机械转换器

    公开(公告)号：US5061989A

    公开(公告)日：1991-10-29

    申请号：US498273

    申请日：1990-03-22

    Applicant: Yao T. Yen ,  Joonees K. Chay

    Inventor： Yao T. Yen ,  Joonees K. Chay

    IPC: H05K1/14 ,  H05K7/10

    CPC classification number: H05K7/1084 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10704

    Abstract: Disclosed herein is a mechanical translator for use in replacing one semiconductor chip with another. A translator allows a first semiconductor chip to be replaced with second semiconductor chip. The translator includes a module having a first surface with a plurality of pins in a first pattern that is compatible with the contact pins of the first semiconductor chip and having a plurality of electrically conductive pads in a second pattern that is compatible with the contact pins of the second semiconductor. The module includes translating semiconductor logic for translating the electrical signals designed to be supplied to and received from the first second semiconductor chip to be compatible with the electronic signals supplied to and received from the second semiconductor chip. The electrical pads are appropriately connected to the translating logic. Also included is an adapter having pattern of pins and sockets compatible with the pattern of pins and sockets of the replacing semiconductor chip. The adapter is connectable in piggy back fashion with the module.

    Abstract translation: 这里公开了一种用于将另一个半导体芯片替换的机械转换器。 翻译器允许用第二半导体芯片替换第一半导体芯片。 所述转换器包括具有第一表面的模块，所述第一表面具有第一图案中的多个销，所述第一图案与所述第一半导体芯片的所述接触销相兼容，并且具有与第二图案中的所述接触销相兼容的第二图案中的多个导电焊盘 第二个半导体。 该模块包括转换半导体逻辑，用于转换被设计为提供给第一第二半导体芯片并从第一第二半导体芯片接收的电信号，以与提供给第二半导体芯片并从第二半导体芯片接收的电子信号兼容。 电焊盘适当地连接到平移逻辑。 还包括具有与替换半导体芯片的引脚和插座的图案兼容的引脚和插座的图案的适配器。 该适配器可以以背部式与模块连接。

    Adaptor for computers
    210.
    发明授权
    Adaptor for computers 失效
    电脑适配器

    公开(公告)号：US4997377A

    公开(公告)日：1991-03-05

    申请号：US483483

    申请日：1990-02-22

    Applicant: Kazuhiro Goto ,  Robert C. Kostash ,  Reid G. McBain

    Inventor： Kazuhiro Goto ,  Robert C. Kostash ,  Reid G. McBain

    IPC: H01R12/04 ,  H01R31/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36 ,  H05K7/14

    CPC classification number: H05K7/1451 ,  H05K1/118 ,  H05K1/141 ,  H05K1/147 ,  H01R31/00 ,  H05K2201/056 ,  H05K2201/09172 ,  H05K2201/10325 ,  H05K2201/10704 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/36

    Abstract: An adaptor (14) for adding electronic components to a computer has been disclosed. The adaptor (14) includes a flexible printed circuit strip (34) having holes (38) in a first end section (36) for receiving a PGA package (16) and conductive pads (66) at a second end section (46) arranged in a predetermined pattern and conductive traces connected to and extending between the holes (38) and pads (66). The adaptor further includes a preform (80) having castellations (84) on each edge. The second end section (46) is wrapped around the preform (80) so that the conductive pads (66) are in registration with the castellations (84).

    Abstract translation: 已经公开了用于将电子部件添加到计算机的适配器（14）。 适配器（14）包括柔性印刷电路条（34），该柔性印刷电路条（34）在第一端部（36）中具有用于接收PGA封装（16）的孔（38）和在第二端部（46）处布置的导电焊盘（66） 以预定图案和与孔（38）和垫（66）连接并在其间延伸的导电迹线。 适配器还包括在每个边缘上具有雉ations（84）的预成型件（80）。 第二端部（46）围绕预成型件（80）缠绕，使得导电垫（66）与雉in（84）对准。

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