DYNAMIC RANDOM ACCESS MEMORY SPEED BIN COMPATIBILITY

    公开(公告)号:US20250046353A1

    公开(公告)日:2025-02-06

    申请号:US18927574

    申请日:2024-10-25

    Inventor: Erik V. Pohlmann

    Abstract: Methods, systems, and devices for dynamic random access memory speed bin compatibility are described. For instance, a device (e.g., a memory device, a host device) may combine a first parameter with a second parameter to generate a third parameter, where the first parameter may be associated with a duration for a clock that is coupled with a memory array to perform a clock cycle and the second parameter may be associated with a timing constraint associated with initiating an access operation for the memory array. The device may determine a latency of a column address strobe based on the third parameter relative to (e.g., satisfying) a threshold value and may access one or more memory cells of the memory array based on the latency of the column address strobe.

    CORRECTION MATRIX RESET
    222.
    发明申请

    公开(公告)号:US20250045156A1

    公开(公告)日:2025-02-06

    申请号:US18774652

    申请日:2024-07-16

    Abstract: A decoding operation is performed by receiving a command to read a correction matrix comprising multiple bit-values from memory of a decoder. The decoding operation also includes, responsive to receipt of the command, generating, using circuitry of a decoder, a predetermined correction matrix comprising a same bit-value. The decoding operation further includes providing the predetermined correction matrix to a decision engine to perform the decoding operation.

    INTELLIGENT CHIPKILL MARKING
    223.
    发明申请

    公开(公告)号:US20250045153A1

    公开(公告)日:2025-02-06

    申请号:US18786254

    申请日:2024-07-26

    Abstract: Provided herein is a memory system including logical to physical memory address translation logic to build up a minimum address space containing a memory device address with defects, the translation being based on memory correction attempts. For each correction attempt, the logical address is first translated to a memory device physical address and bit positions at the physical address are compared with an existing error bit pattern to determine if marking should be applied to the memory device. If the bit positions do not match the existing error bit pattern, but errors are corrected from the marked memory device, the existing error bit pattern will be updated to reflect a new error bit pattern.

    Bit mask for syndrome decoding operations

    公开(公告)号:US12218681B2

    公开(公告)日:2025-02-04

    申请号:US17949635

    申请日:2022-09-21

    Abstract: A decoding operation is performed by altering at least one bit of the bit string from a first value to a second value and applying a bit mask to each bit of the bit string that is not altered from the first value to the second value. The decoding operation further includes writing an indication corresponding to a quantity of bits that have been altered from the first value to the second value to an array of memory cells, wherein the indication corresponds to a quantity of errors contained in the bit string, determining that the quantity of errors for the bit string has reached a threshold quantity of errors, and refraining from performing a subsequent operation to alter at least the one bit of the bit string, or a different bit of the bit string, or both, from the first value to the second value in response to determining that the quantity of errors for the bit string has reached the threshold quantity of errors.

    Stacked interposer structures
    226.
    发明授权

    公开(公告)号:US12218119B2

    公开(公告)日:2025-02-04

    申请号:US17931284

    申请日:2022-09-12

    Abstract: An interposer comprises a semiconductor material and includes cache memory under a location on the interposer for a host device. Memory interface circuitry may also be located under one or more locations on the interposer for memory devices. Microelectronic device assemblies incorporating such an interposer and comprising a host device and multiple memory devices are also disclosed, as are methods of fabricating such microelectronic device assemblies.

    Bias voltage schemes during pre-programming and programming phases

    公开(公告)号:US12217801B2

    公开(公告)日:2025-02-04

    申请号:US18076537

    申请日:2022-12-07

    Abstract: Control logic can perform operations including obtaining, for each dummy wordline of a set of dummy wordlines, a respective set of step-up voltage parameters, wherein each set of step-up voltage parameters includes a step ratio corresponding to the dummy wordline, and causing a bias voltage with respect to each dummy wordline of the set of dummy wordlines to be ramped to a respective program inhibit bias voltage in accordance with the respective set of step-up voltage parameters. Additionally or alternatively, control logic can perform memory operations including causing a bias voltage with respect to each dummy wordline to be ramped to a power supply voltage during a seed first sub-phase of a pre-programming phase, and maintaining the bias voltage of the first dummy wordline at a first dummy wordline seed voltage throughout a bitline setting sub-phase of the pre-programming phase.

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