公开(公告)号：US20210265280A1

公开(公告)日：2021-08-26

申请号：US16798170

申请日：2020-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Chiang SHIH ,  Hung-Yi LIN ,  Meng-Wei HSIEH ,  Yu Sheng CHANG ,  Hsiu-Chi LIU ,  Mark GERBER

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/528 ,  H01L21/56

Abstract: A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.

公开(公告)号：US11101189B2

公开(公告)日：2021-08-24

申请号：US16885150

申请日：2020-05-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming Yen Lee ,  Chia-Hao Sung ,  Ching-Han Huang ,  Yu-Hsuan Tsai

IPC: H01L21/31 ,  H01L23/31 ,  B81B3/00 ,  B81C1/00 ,  H01L23/538 ,  H01L23/48 ,  H01L23/522 ,  H01L23/52 ,  H01L23/525 ,  H01L21/66 ,  B81C3/00 ,  H01L23/13 ,  H01L23/12 ,  H01L23/28 ,  B81B7/00

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

公开(公告)号：US20210257988A1

公开(公告)日：2021-08-19

申请号：US16794112

申请日：2020-02-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Kuo-Hua LAI ,  Hui-Chung LIU

IPC: H03H9/24 ,  H03H3/007 ,  H03H9/05 ,  H03H9/08 ,  H03H9/10

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US20210257331A1

公开(公告)日：2021-08-19

申请号：US16793991

申请日：2020-02-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yun-Ching HUNG ,  Yung-Sheng LIN ,  Chin-Li KAO

IPC: H01L23/00

Abstract: Present disclosure provides a semiconductor package, including a first substrate having a first active surface and a first trench recessed from the first active surface, a second substrate having a second trench facing the first trench, and a pathway cavity defined by the first trench and the second trench. The first trench comprises a first metal protrusion and a first insulating protrusion. A method for manufacturing the semiconductor package described herein is also disclosed.

公开(公告)号：US11094858B2

公开(公告)日：2021-08-17

申请号：US16529569

申请日：2019-08-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun Chen

IPC: H01L33/00 ,  H01L23/48 ,  H01L21/00 ,  H01L33/56 ,  H01L33/54 ,  H01L51/52 ,  H01L23/31 ,  H01L23/538 ,  H01L21/56 ,  H01L23/522 ,  H01L23/00 ,  G02B3/00 ,  H01S5/183

Abstract: A tape includes at least one tape unit. The tape unit includes a base structure having a first portion and a second portion. The first portion has a first surface and a second surface opposite to the first surface. The second portion protrudes from the second surface of the first portion, and has a third surface opposite to the first surface of the first portion and a lateral surface extending between the second surface and the third surface. An area of the first portion from a top view is greater than an area of the second portion from a top view.

公开(公告)号：US20210246015A1

公开(公告)日：2021-08-12

申请号：US16783914

申请日：2020-02-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chieh-An YEH ,  Tai-Hung KUO

IPC: B81B7/00 ,  B81C1/00 ,  G01D11/24

Abstract: A sensor device package and method of manufacturing the same are provided. The sensor device package includes a carrier, a sensor component, an encapsulation layer and a protection film. The sensor component is disposed on the carrier, and the sensor component includes an upper surface and edges. The encapsulation layer is disposed on the carrier and encapsulates the edges of the sensor component. The protection film covers at least a portion of the upper surface of the sensor component.

公开(公告)号：US11070427B2

公开(公告)日：2021-07-20

申请号：US15858954

申请日：2017-12-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jian Feng Lee ,  Yu-Jung Chang

IPC: G06F15/16 ,  H04L12/24 ,  G06F8/65 ,  H04L29/08 ,  H04W8/24 ,  G06F8/654

Abstract: An electronic device for updating firmware in a target device over the air includes a dispatching module and a firmware over the air (FOTA) core. The dispatching module is configured to establish a communication link between the electronic device and the target device. The FOTA core is configured to receive information corresponding to updated firmware via the established communication link.

公开(公告)号：US11069605B2

公开(公告)日：2021-07-20

申请号：US16399909

申请日：2019-04-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen Hung Huang

IPC: H01L23/498 ,  H01L25/065 ,  H01L21/48 ,  H01L25/00

Abstract: A wiring structure includes at least one upper conductive structure, a lower conductive structure and an intermediate layer. The upper conductive structure includes at least one upper dielectric layer, at least one upper circuit layer in contact with the upper dielectric layer, and at least one bonding portion electrically connected to the upper circuit layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonding the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure.

公开(公告)号：US11063013B2

公开(公告)日：2021-07-13

申请号：US16413480

申请日：2019-05-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi-Han Chen ,  Hung-Yi Lin

IPC: H01L23/00 ,  H01L25/18 ,  H01L23/538 ,  H01L23/498 ,  G02B6/30 ,  G02B6/42

Abstract: A semiconductor package structure includes a first semiconductor die having an active surface and a passive surface opposite to the active surface, a conductive element leveled with the first semiconductor die, a first redistribution layer (RDL) being closer to the passive surface than to the active surface, a second RDL being closer to the active surface than to the passive surface, and a second semiconductor die over the second RDL and electrically coupled to the first semiconductor die through the second RDL. A first conductive path is established among the first RDL, the conductive element, the second RDL, and the active surface of the first semiconductor die.

公开(公告)号：US20210210398A1

公开(公告)日：2021-07-08

申请号：US16734023

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/31 ,  H01L23/66 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor device package includes a substrate, a first electronic component and a first encapsulant. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface of the substrate. The first encapsulant is disposed on the first surface of the substrate and covers the first electronic component. The first encapsulant has a first surface facing away the first surface of the substrate and includes a recess at an edge of the first surface of the first encapsulant.