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    LED LIGHT BAR STRUCTURE
    261.
    发明申请
    LED LIGHT BAR STRUCTURE 审中-公开
    LED灯条结构

    公开(公告)号：US20130044468A1

    公开(公告)日：2013-02-21

    申请号：US13288938

    申请日：2011-11-03

    Applicant: KANG-YU LAI ,  SHIN-CHANG CHEN

    Inventor： KANG-YU LAI ,  SHIN-CHANG CHEN

    IPC: F21V7/00 ,  F21V21/00

    CPC classification number: F21V19/0025 ,  F21S4/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/183 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/2054

    Abstract: The present invention discloses an LED light bar structure, which includes at least one LED and a circuit board. Each LED has two or an even number of pins. The circuit board has at least one receiving space and at least two recesses, in which the LED is disposed in the receiving space, and each of the pins is engaged in the recess. The present invention solves drawbacks of the LED shifting when being conventionally welded and the LED is difficult to replace.

    Abstract translation: 本发明公开了一种LED灯条结构，其包括至少一个LED和电路板。 每个LED都有两个或两个偶数的引脚。 电路板具有至少一个容纳空间和至少两个凹槽，其中LED布置在容纳空间中，并且每个销接合在凹部中。 本发明解决了当传统焊接并且LED难以替代时LED偏移的缺点。

    Electronic component mounting structure
    262.
    发明授权
    Electronic component mounting structure 有权
    电子元件安装结构

    公开(公告)号：US08325489B2

    公开(公告)日：2012-12-04

    申请号：US12941265

    申请日：2010-11-08

    Applicant: Masaaki Togashi ,  Kouji Yamada

    Inventor： Masaaki Togashi ,  Kouji Yamada

    IPC: H05K7/00

    CPC classification number: H05K1/0231 ,  H05K1/112 ,  H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10674 ,  Y02P70/611

    Abstract: An electronic component mounting structure which can reduce the ESL while saving the space when mounting electronic components is provided. A first electronic component 7 is electrically connected to surface-mounted electrode parts 11A, 12A at metal terminals 26, 27 such that a first capacitor 24 having a greater capacitance and a mounting surface 4a of a multilayer substrate 4 are separated from each other. A second electronic component 8 is arranged between the first capacitor 24 and the mounting surface 4a and electrically connected to surface-mounted electrode parts 12B, 11B at second terminal electrodes 32, 33. The second electronic component 8 overlaps the first capacitor 24 when seen in the laminating direction. The first electronic component 7 is mounted to the multilayer substrate 4 such that first terminal electrodes 22, 23 oppose each other in a predetermined direction D1. The second electronic component 8 is mounted to the multilayer substrate 4 such that the second terminal electrodes 32, 33 oppose each other in the predetermined direction D1.

    Abstract translation: 提供一种电子部件安装结构，其能够在安装电子部件的同时节省空间的同时减小ESL。 第一电子部件7在金属端子26,27处电连接到表面安装电极部分11A，12A，使得具有较大电容的第一电容器24和多层基板4的安装表面4a彼此分离。 第二电子部件8布置在第一电容器24和安装表面4a之间，并且在第二端子电极32,33处与表面安装的电极部分12B，11B电连接。第二电子部件8与第一电容器24重叠， 层压方向。 第一电子部件7安装到多层基板4，使得第一端子电极22,23在预定方向D1上彼此相对。 第二电子部件8安装到多层基板4，使得第二端子电极32,33在预定方向D1上彼此相对。

    STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF
    265.
    发明申请
    STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF 有权
    发光二极管的结构及其组装方法

    公开(公告)号：US20110198663A1

    公开(公告)日：2011-08-18

    申请号：US13095059

    申请日：2011-04-27

    Applicant: Sheng-Jia Sheu ,  Chien-Chang Pei

    Inventor： Sheng-Jia Sheu ,  Chien-Chang Pei

    IPC: H01L33/62

    CPC classification number: H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

    Abstract: A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.

    Abstract translation: 提供发光二极管的结构。 在一个方面，发光二极管结构包括发光二极管，导电框架和基板。 导电框架电连接到发光二极管，并且具有连接导电框架的第一侧和导电框架与第一侧相对的第二侧的固定孔。 固定孔具有梯形内侧壁，其内侧壁的第一半径与第一侧相邻，小于邻近第二侧的内侧壁的第二半径。 衬底具有通过从导电框架的第一侧进入固定孔而被固定在固定孔中的导电柱，并使其导电柱粘附到固定孔的梯形内侧壁。

    LOW PRESSURE MOLDING ENCAPSULATION OF HIGH VOLTAGE CIRCUITRY
    266.
    发明申请
    LOW PRESSURE MOLDING ENCAPSULATION OF HIGH VOLTAGE CIRCUITRY 失效
    低压电路的低压成型封装

    公开(公告)号：US20100314792A1

    公开(公告)日：2010-12-16

    申请号：US12526032

    申请日：2008-02-06

    Applicant: Kenneth E. Wing ,  Scott T. Carroll

    Inventor： Kenneth E. Wing ,  Scott T. Carroll

    IPC: B28B1/48

    CPC classification number: H01R13/5219 ,  B29C45/14639 ,  H01R13/53 ,  H01R24/76 ,  H01R2101/00 ,  H05K1/0254 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10651 ,  H05K2203/1316

    Abstract: A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.

    Abstract translation: 涉及一种低压注塑成型方法，该方法包括高压电路，同时在注射成型材料中结合独特的凹陷式高压连接器接触装置，大大降低了部件尺寸，同时增加了这种类型的电路的能力。 该方法减少了制造时间并保持了清洁的密封接触点，以通过导电橡胶块的方式重复使用。 额外的优点是通过电路板产生空腔; 轴向引线的高压部件可以方便地安装，而无需额外的组装部件，同时完全封装。

    HIGH VOLTAGE RECESSED CONNECTOR CONTACT
    267.
    发明申请
    HIGH VOLTAGE RECESSED CONNECTOR CONTACT 审中-公开
    高电压连接器接点

    公开(公告)号：US20100302746A1

    公开(公告)日：2010-12-02

    申请号：US12526030

    申请日：2008-02-06

    Applicant: Kenneth E. Wing ,  Scott T. Carroll

    Inventor： Kenneth E. Wing ,  Scott T. Carroll

    IPC: H05K7/00 ,  H01R12/30 ,  H05K3/00

    CPC classification number: H01R13/5219 ,  B29C45/14639 ,  H01R13/53 ,  H01R24/76 ,  H01R2101/00 ,  H05K1/0254 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10651 ,  H05K2203/1316

    Abstract: A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.

    Abstract translation: 涉及一种低压注塑成型方法，该方法包括高压电路，同时在注射成型材料中结合独特的凹陷式高压连接器接触装置，大大降低了部件尺寸，同时增加了这种类型的电路的能力。 该方法减少了制造时间并保持了清洁的密封接触点，以通过导电橡胶块的方式重复使用。 额外的优点是通过电路板产生空腔; 轴向引线的高压部件可以方便地安装，而无需额外的组装部件，同时完全封装。

    METHOD OF SOLDERING COMPONENTS ON CIRCUIT BOARDS AND CORRESPONDING CIRCUIT BOARD
    269.
    发明申请
    METHOD OF SOLDERING COMPONENTS ON CIRCUIT BOARDS AND CORRESPONDING CIRCUIT BOARD 审中-公开
    电路板组件和相应电路板焊接方法

    公开(公告)号：US20100218372A1

    公开(公告)日：2010-09-02

    申请号：US12738078

    申请日：2007-10-25

    Applicant: Tiziano Amarilli

    Inventor： Tiziano Amarilli

    IPC: H05K3/30 ,  H05K3/34

    CPC classification number: H05K3/3447 ,  H05K3/005 ,  H05K2201/09854 ,  H05K2201/10651 ,  H05K2203/1178 ,  Y10T29/49139 ,  Y10T29/49144

    Abstract: A method of mounting on a circuit board a component having at least one pin extending therefrom for insertion into a respective hole provided in said circuit board, wherein said component has a coating extending over the proximal end of said at least one pin, said extension of the coating having a circular cross-section is provided. The method may include forming said respective hole as a non noncircular hole.

    Abstract translation: 一种在电路板上安装具有至少一个从其延伸的销以插入设置在所述电路板中的相应孔中的销的部件的方法，其中所述部件具有在所述至少一个销的近端延伸的涂层， 提供具有圆形横截面的涂层。 该方法可以包括将所述相应的孔形成为非圆形孔。

    Surface mountable semiconductor package with solder bonding features
    270.
    发明授权
    Surface mountable semiconductor package with solder bonding features 有权
    具有焊接特性的表面贴装半导体封装

    公开(公告)号：US07737546B2

    公开(公告)日：2010-06-15

    申请号：US11850526

    申请日：2007-09-05

    Applicant: Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

    Inventor： Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

    IPC: H01L23/48 ,  H01L21/50

    CPC classification number: H05K3/3426 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00013 ,  H01L2924/15747 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10848 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00

    Abstract: A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions.

    Abstract translation: 公开了诸如LED的封装电路元件及其制造方法。 封装电路元件包括引线框架，成型体和容纳电路元件的管芯。 引线框架具有第一和第二引线，每个引线具有第一和第二部分。 成形体围绕每个引线的第一部分，并且该裸片与第一和第二引线的第一部分上的第一引线和第二引线电连接。 第一和第二引线中的每一个的第二部分基本上平行于主体的相对的侧表面，并且包括阻止熔融焊料润湿部件与该引线的第一部分之间的每个引线的第二部分的一部分的特征 同时允许熔融焊料润湿第二部分的剩余表面。

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