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174 条记录 (耗时 0.018 秒)

    Method for manufacturing an LED chip package structure
    21.
    发明授权
    Method for manufacturing an LED chip package structure 有权
    制造LED芯片封装结构的方法

    公开(公告)号：US07824938B2

    公开(公告)日：2010-11-02

    申请号：US12382760

    申请日：2009-03-24

    申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

    发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

    IPC分类号： H01L21/00

    CPC分类号： H01L25/0753 ,  H01L24/97 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2224/85 ,  H01L2924/00014

    摘要： An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.

    摘要翻译： 具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。 绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。 每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并且与不同的导电针电连接。 此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

    WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AND HEAT-DISSIPATING AREA AND METHOD FOR MAKING THE SAME
    23.
    发明申请
    WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AND HEAT-DISSIPATING AREA AND METHOD FOR MAKING THE SAME 有权
    用于增加导电区域和散热区域的WAFER LEVEL LED封装结构及其制造方法

    公开(公告)号：US20100032706A1

    公开(公告)日：2010-02-11

    申请号：US12346329

    申请日：2008-12-30

    申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    发明人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    IPC分类号： H01L33/00 ,  H01L21/02

    CPC分类号： H01L33/38 ,  H01L33/44 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0016 ,  H01L2924/00014

    摘要： A wafer level LED package structure includes a light-emitting unit, a first conductive unit, a second conductive unit and an insulative unit. The light-emitting unit has a light-emitting body, a positive conductive layer and a negative conductive layer formed on the light-emitting body, and a first insulative layer formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive layer formed on the first positive conductive layer and a second negative conductive layer formed on the first negative conductive layer. The insulative unit has a second insulative layer formed on the first insulative layer and disposed between the second positive conductive layer and the second negative conductive layer.

    摘要翻译： 晶圆级LED封装结构包括发光单元，第一导电单元，第二导电单元和绝缘单元。 发光单元具有形成在发光体上的发光体，正导电层和负导电层，以及形成在正导电层和负导电层之间的第一绝缘层。 第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。 第二导电单元具有形成在第一正导电层上的第二正导电层和形成在第一负导电层上的第二负导电层。 绝缘单元具有形成在第一绝缘层上并设置在第二正导电层和第二负导电层之间的第二绝缘层。

    Method of manufacturing high power light-emitting device package and structure thereof
    25.
    发明授权
    Method of manufacturing high power light-emitting device package and structure thereof 失效
    制造大功率发光器件封装的方法及其结构

    公开(公告)号：US07485480B2

    公开(公告)日：2009-02-03

    申请号：US11524462

    申请日：2006-09-21

    申请人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

    发明人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

    IPC分类号： H01L21/00

    CPC分类号： H01L33/642 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A method of manufacturing high power light-emitting device packages and structure thereof, wherein the method thereof includes the steps of: (a) forming a plurality of lead frames, each of the lead frames includes a heat-dissipating element and a plurality of leads; (b) electroplating an outer surface of the lead frames each; (c) coating conductive gel on a surface of the heat-dissipatings each; (d) arranging at least one light-emitting chip on the conductive gel; (e) forming an encapsulant on each of the lead frames; (f) connecting at least one top electrode of the light-emitting chip with one of the leads; (g) coating silicon gel for covering the at one light-emitting chip, and forming integrally a focusing light convex surface on a top surface of the silicon gel; and (h) cutting off the tie-bars to separate the lead frames from one another, whereby forming a plurality of high power light-emitting device packages.

    摘要翻译： 一种制造大功率发光器件封装的方法及其结构，其方法包括以下步骤：（a）形成多个引线框架，每个引线框架包括散热元件和多个引线 ; （b）电镀每个引线框架的外表面; （c）在散热表面上涂覆导电凝胶; （d）在所述导电性凝胶上配置至少一个发光芯片; （e）在每个引线框架上形成密封剂; （f）将所述发光芯片的至少一个顶部电极与所述引线中的一个连接; （g）涂覆硅胶以覆盖一个发光芯片，并且在硅凝胶的顶表面上一体地形成聚焦光凸面; 和（h）切断连接杆以将引线框架彼此分离，从而形成多个高功率发光器件封装。

    Fan structure
    27.
    发明申请
    Fan structure 审中-公开
    风扇结构

    公开(公告)号：US20050265834A1

    公开(公告)日：2005-12-01

    申请号：US10855381

    申请日：2004-05-28

    申请人： Jia-Yeh Wang ,  Chih-Ming Cheng ,  Ta-Yun Tai ,  Wen-Sung Li

    发明人： Jia-Yeh Wang ,  Chih-Ming Cheng ,  Ta-Yun Tai ,  Wen-Sung Li

    IPC分类号： F04D29/04 ,  F04D29/058 ,  F04D29/64 ,  H02K5/167 ,  H02K7/08 ,  H02K7/14 ,  H02K11/00 ,  H02K21/22

    CPC分类号： F04D29/058 ,  F04D25/062 ,  F04D29/646 ,  H02K7/083 ,  H02K7/14 ,  H02K21/22

    摘要： A fan structure of the present invention has a base having a first supporting piece, a motor stator mounted on the base, a motor rotor defined corresponding to the motor stator, a fan blade having a hub located at a central portion thereof, one end of the hub abutting the first supporting piece. The motor rotor is mounted on an inner wall of the fan blade. An upper cover body covers a periphery of the fan blade, the upper cover body has an oblique resilient portion defined on a top portion thereof, the resilient portion defines a second support piece thereon, and the second support piece abuts another end of the hub. The improved fan structure is a bearingless structure, which can simplify the overall structure, is easy to assemble, effectively reduces manufacturing costs and improves a rotating stability of the hub.

    摘要翻译： 本发明的风扇结构具有基座，其具有第一支撑件，安装在基座上的电机定子，对应于电动机定子的电动机转子，具有位于其中心部分的毂的风扇叶片， 轮毂邻接第一支撑件。 马达转子安装在风扇叶片的内壁上。 上盖主体覆盖风扇叶片的周边，上盖主体具有限定在其顶部的倾斜弹性部分，弹性部分在其上限定第二支撑件，第二支撑件邻接毂的另一端。 改进的风扇结构是无轴承结构，可以简化整体结构，易于组装，有效降低制造成本，提高轮毂的旋转稳定性。

    White light-emitting device
    29.
    发明申请
    White light-emitting device 审中-公开
    白色发光装置

    公开(公告)号：US20050236958A1

    公开(公告)日：2005-10-27

    申请号：US10830009

    申请日：2004-04-23

    申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Yu

    发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Yu

    IPC分类号： C09K11/77 ,  H01L33/50 ,  H05B33/00

    CPC分类号： C09K11/7734 ,  C09K11/7731 ,  H01L33/502 ,  H01L33/504 ,  Y02B20/181

    摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a phosphor mixture coated on the blue light-emitting diode and made of a red phosphor, a green phosphor and a yellow phosphor. The red phosphor can be CaS:Eu or SrS:Eu; the green phosphor can be SrGa2S4:Eu or Ca8EuMnMg(SiO4)4C12; and the yellow phosphor can be YAG:Ce or ThAG:Ce. The red phosphor, the green phosphor and the yellow phosphor emit, respectively, red light, green light and yellow light after receiving blue light from the blue light-emitting diode to mix a white light with a good color-rendering property.

    摘要翻译： 白色光源具有放置在其上的蓝色发光二极管的基板和涂布在蓝色发光二极管上并由红色荧光体，绿色荧光体和黄色荧光体构成的荧光体混合物。 红色荧光体可以是CaS：Eu或SrS：Eu; 绿色荧光体可以是SrGa 2 S 4：Eu或Ca 8 O 5 MnMg（SiO 4） 4 12 黄色荧光体可以是YAG：Ce或ThAG：Ce。 在从蓝色发光二极管接收蓝光后，红色荧光体，绿色荧光体和黄色荧光体分别发出红色光，绿色光和黄色光，以混合具有良好显色性能的白色光。