公开(公告)号：US08987022B2

公开(公告)日：2015-03-24

申请号：US13344255

申请日：2012-01-05

Applicant: Cheol-jun Yoo ,  Young-hee Song ,  Seong-deok Hwang ,  Sang-hyun Lee

Inventor： Cheol-jun Yoo ,  Young-hee Song ,  Seong-deok Hwang ,  Sang-hyun Lee

IPC: H01L21/00 ,  H01L33/48 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/73 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.

Abstract translation: 可以使用后成型制造并具有改善的散热性能和光学质量的发光器件封装以及制造发光器件封装的方法。 发光器件封装包括：散热垫; 形成在所述散热垫上的发光装置; 一对引线框架，设置成在发光装置和散热垫的两侧彼此间隔开; 围绕所述发光装置的除了所述发光装置的发射表面的侧面的成型构件; 以及用于将引线框架电连接到发光器件的接合线。

公开(公告)号：US08860069B2

公开(公告)日：2014-10-14

申请号：US13365882

申请日：2012-02-03

Applicant: Cheol-jun Yoo ,  Young-hee Song

Inventor： Cheol-jun Yoo ,  Young-hee Song

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame.

Abstract translation: 一种发光器件封装。 发光器件封装包括引线框架，该引线框架包括多个单独的引线; 模制构件，其固定所述多个引线并且包括暴露所述引线框架的开口部; 以及发光器件芯片，其安装在所述引线框架中的所述开口部分中并且通过所述发光器件芯片的上表面部分发射光，其中所述模制构件的高度低于所述发光器件芯片的高度， 相对于引线框架的发光器件芯片。

公开(公告)号：US08679872B2

公开(公告)日：2014-03-25

申请号：US13312572

申请日：2011-12-06

Applicant: Cheol Jun Yoo ,  Young Hee Song ,  Seong Deok Hwang ,  Sang Hyun Lee

Inventor： Cheol Jun Yoo ,  Young Hee Song ,  Seong Deok Hwang ,  Sang Hyun Lee

IPC: H01L21/00 ,  H01L33/60

CPC classification number: H01L33/486 ,  H01L33/505 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48227 ,  H01L2924/15321 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern.

Abstract translation: 提供了一种发光器件封装，包括：具有形成在其至少一个表面上并包括开口的电路图案的衬底; 通过用波长转换材料填充所述开口的至少一部分而形成的波长转换层; 以及设置在所述波长转换层的表面上并电连接到所述电路图案的至少一个发光器件。

公开(公告)号：US20120252145A1

公开(公告)日：2012-10-04

申请号：US13409641

申请日：2012-03-01

Applicant: Cheol Jun YOO ,  Seong Jae Hong

Inventor： Cheol Jun YOO ,  Seong Jae Hong

IPC: H01L33/50 ,  B05C11/00

CPC classification number: H01L33/505 ,  H01L33/38 ,  H01L2933/0041

Abstract: Provided are a mask for an application of paste and a method of manufacturing a semiconductor light emitting device by using the same. The method includes preparing a light emitting structure including first and second conductive semiconductor layers and an active layer disposed therebetween, which has at least one electrode formed on a surface of the light emitting structure; disposing a mask having an open part exposing a portion of the surface of the light emitting structure therethrough and a recess part corresponding the electrode in a region thereof on a surface of the light emitting structure; and applying wavelength conversion material-containing paste to the surface of the light emitting structure through the open part.

Abstract translation: 提供了一种用于施加糊剂的掩模和使用该方法制造半导体发光器件的方法。 该方法包括制备包括第一和第二导电半导体层和设置在其间的有源层的发光结构，其具有形成在发光结构的表面上的至少一个电极; 在所述发光结构的表面上配置具有使所述发光结构体的表面的一部分露出的开口部的掩模和与所述电极对应的凹部， 并通过开放部分将波长转换材料的浆料涂覆到发光结构的表面。

公开(公告)号：US20120184056A1

公开(公告)日：2012-07-19

申请号：US13338678

申请日：2011-12-28

Applicant: Cheol-jun YOO ,  Seong-jae Hong ,  Tsuyoshi Tsutsui ,  Shin-kun Kim

Inventor： Cheol-jun YOO ,  Seong-jae Hong ,  Tsuyoshi Tsutsui ,  Shin-kun Kim

IPC: H01L33/50 ,  B05C11/00 ,  B05C13/02

CPC classification number: B05C1/027 ,  H01L21/6715 ,  H01L21/6838 ,  H01L33/0079 ,  H01L33/50 ,  H01L2933/0041

Abstract: Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.

Abstract translation: 制造通过在晶片级在半导体发光元件的发射表面上形成荧光层而发出白光的半导体发光器件的制造方法和装置。 该方法包括：在晶片上形成多个发光器件; 使形成有多个发光装置的晶片变薄; 将薄的晶片设置在载体膜上; 以及在所述晶片上的所述多个发光器件的发射表面上形成荧光体层。

公开(公告)号：US20120178188A1

公开(公告)日：2012-07-12

申请号：US13346505

申请日：2012-01-09

Applicant: Cheol-jun Yoo ,  Seong-jae Hong

Inventor： Cheol-jun Yoo ,  Seong-jae Hong

IPC: H01L33/50 ,  B29C43/18 ,  H01L21/66

CPC classification number: H01L33/50 ,  H01L2224/16245 ,  H01L2224/81 ,  H01L2933/0041

Abstract: A method and apparatus for depositing a phosphor via a compression molding process, the method involving forming a plurality of light-emitting devices on a wafer, evaluating emission characteristics of the plurality of light-emitting devices, and re-arraying and aligning the plurality of light-emitting devices on a carrier substrate according to the emission characteristics; depositing the phosphor on the plurality of re-arrayed light-emitting devices via a compression molding process; and dicing the plurality of re-arrayed light-emitting devices on the carrier substrate.

Abstract translation: 一种用于通过压缩成型工艺沉积磷光体的方法和装置，所述方法包括在晶片上形成多个发光器件，评估多个发光器件的发射特性，并重新排列和对准多个发光器件 根据发射特性在载体基板上的发光器件; 通过压缩成型工艺将磷光体沉积在多个重新排列的发光器件上; 并且在载体基板上切割多个重新排列的发光器件。

公开(公告)号：US08785953B2

公开(公告)日：2014-07-22

申请号：US13428726

申请日：2012-03-23

Applicant: Hak Hwan Kim ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

Inventor： Hak Hwan Kim ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L21/568 ,  H01L33/505 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/83

Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

Abstract translation: 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

公开(公告)号：US20130051061A1

公开(公告)日：2013-02-28

申请号：US13593936

申请日：2012-08-24

Applicant: Cheol-Jun Yoo

Inventor： Cheol-Jun Yoo

IPC: F21V8/00 ,  F21V17/16 ,  F21V17/12

CPC classification number: F21V17/12 ,  F21K9/232 ,  F21K9/61 ,  F21V3/00 ,  F21V5/041 ,  F21V17/16 ,  F21Y2115/10

Abstract: An illumination device includes: a light source including a substrate and a light emitting device mounted on the substrate; a light guide unit mounted on the substrate to cover the light emitting device and guiding light from the light emitting device to an upper side of the substrate to allow the light to be emitted from the upper side; and a main body unit having the light source fastened thereto and including an external connection unit connected to an external power source to supply power to the light source.

Abstract translation: 照明装置包括：光源，包括基板和安装在基板上的发光装置; 导光单元，其安装在所述基板上以覆盖所述发光器件并且将来自所述发光器件的光引导到所述基板的上侧，以允许所述光从所述上侧发射; 以及主体单元，其具有固定在其上的光源，并且包括连接到外部电源的外部连接单元以向光源供电。

公开(公告)号：US20130020600A1

公开(公告)日：2013-01-24

申请号：US13554765

申请日：2012-07-20

Applicant: Cheol Jun YOO

Inventor： Cheol Jun YOO

IPC: H01L33/60

CPC classification number: H01L33/56 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/49107 ,  H01L2224/73265

Abstract: A light emitting diode (LED) package is disclosed. The LED package includes a first metal line layer and a second metal line layer bonded to a circuit substrate, a thin film substrate disposed on the first metal line layer and the second metal line layer and configured to include an opening that exposes the first metal line layer and the second metal line layer, and an LED disposed in the opening and brought into contact with the first metal line layer and the second metal line layer.

Abstract translation: 公开了一种发光二极管（LED）封装。 LED封装包括第一金属线层和与电路基板接合的第二金属线层，设置在第一金属线层和第二金属线层上的薄膜基片，其构造为包括使第一金属线露出的开口 层和第二金属线层，以及设置在开口中并与第一金属线层和第二金属线层接触的LED。

公开(公告)号：US08672308B2

公开(公告)日：2014-03-18

申请号：US13314783

申请日：2011-12-08

Applicant: Cheol-jun Yoo ,  Seong-jae Hong

Inventor： Cheol-jun Yoo ,  Seong-jae Hong

IPC: B25B11/00

CPC classification number: H01L22/20 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/52 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate.

Abstract translation: 一种使用传递模塑沉积磷光体的方法和装置。 该方法包括：在晶片上形成多个发光器件，并通过检查多个发光器件的亮度特性，根据多个发光器件的亮度特性重新排列载体衬底上的发光器件 设备; 使用传递模塑将磷光体沉积在重排的发光器件上; 并分离载体基板上的发光装置。