公开(公告)号：US08106554B2

公开(公告)日：2012-01-31

申请号：US12255848

申请日：2008-10-22

Applicant: Kwang Yong Lee ,  Dong Han Kim

Inventor： Kwang Yong Lee ,  Dong Han Kim

IPC: H02K15/14 ,  B60H1/00

CPC classification number: F04D29/40

Abstract: Disclosed herein is a blower motor assembly for a vehicle. The blower motor assembly comprises an armature assembly, a motor body, a magnet, an upper case, and a lower case. The armature assembly comprises a rotatable armature shaft with an armature. The motor body is an open cylinder that houses the armature assembly. The magnet is installed between the motor body and the armature assembly. The upper case has a through-hole which permits the armature shaft to projects outward through. The lower case is coupled to the upper case. The motor body is installed in an internal space defined by the coupled upper and lower cases. The motor body is fixed in a correspondingly-shaped hollow portion defined by a wall of a motor body fixing portion formed in the lower case. The magnet is fixed to a magnet fixing portion formed in the lower case.

Abstract translation: 这里公开了一种用于车辆的鼓风机马达组件。 鼓风机马达组件包括电枢组件，马达主体，磁体，上壳体和下壳体。 电枢组件包括具有电枢的可旋转电枢轴。 电机主体是容纳电枢组件的开放式气缸。 磁体安装在电机主体和电枢组件之间。 上壳体具有允许电枢轴向外突出的通孔。 下壳体联接到上壳体。 电动机体安装在由上下壳体限定的内部空间中。 马达主体固定在形成在下壳体中的电动机主体固定部分的壁限定的相应形状的中空部分中。 磁体固定在形成在下壳体中的磁铁固定部分。

公开(公告)号：US07873396B2

公开(公告)日：2011-01-18

申请号：US11765228

申请日：2007-06-19

Applicant: Yi-Tae Kang ,  Yong-Jae Kim ,  Sang-Gook Kim ,  Kwang-Yong Lee

Inventor： Yi-Tae Kang ,  Yong-Jae Kim ,  Sang-Gook Kim ,  Kwang-Yong Lee

IPC: H04M1/00

CPC classification number: H04M1/0214

Abstract: A portable terminal is equipped with a first housing, a second housing and a hinge device, the second housing being coupled to one end of the first housing and rotating about a hinge axis extending in a longitudinal direction of the first housing, the hinge device rotatably coupling the first housing and the second housing, the hinge device including: a first hinge base mounted on the first housing or the second housing; a second hinge base mounted on the second housing or the first housing, coupled oppositely to the first hinge base, and rotating about the hinge axis; and a hinge stopper mounted adjacent to the second hinge base, and pivoting around the hinge axis as the second hinge base rotates, wherein the hinge stopper is engaged with the first hinge base in at least one point while the second hinge base rotates, and thus stops rotation of the second hinge base.

Abstract translation: 便携式终端装备有第一壳体，第二壳体和铰链装置，第二壳体联接到第一壳体的一端并围绕在第一壳体的纵向方向上延伸的铰链轴线旋转，铰链装置可旋转 联接第一壳体和第二壳体，铰链装置包括：安装在第一壳体或第二壳体上的第一铰链座; 安装在所述第二壳体或所述第一壳体上的第二铰链座，其与所述第一铰链座相对地联接并围绕所述铰链轴线旋转; 以及铰链止动件，其邻近所述第二铰链座安装，并且当所述第二铰链基座旋转时围绕所述铰链轴线枢转，其中所述铰链止动件在所述第二铰链座旋转时在至少一个点处与所述第一铰链座接合， 停止第二铰链座的旋转。

公开(公告)号：US20100096754A1

公开(公告)日：2010-04-22

申请号：US12588477

申请日：2009-10-16

Applicant: Jonggi Lee ,  SunWon Kang ,  Young Lyong Kim ,  Jongho Lee ,  Chul-Yong Jang ,  Minill Kim ,  Eunchul Ahn ,  Kwang Yong Lee ,  Seungduk Baek ,  Ji-Seok Hong

Inventor： Jonggi Lee ,  SunWon Kang ,  Young Lyong Kim ,  Jongho Lee ,  Chul-Yong Jang ,  Minill Kim ,  Eunchul Ahn ,  Kwang Yong Lee ,  Seungduk Baek ,  Ji-Seok Hong

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L24/13 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/06 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0233 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/1191 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Provided is a semiconductor package, a semiconductor module and a method for fabricating the semiconductor package. The method provides a substrate including a bonding pad. The method forms a dielectric layer for exposing the bonding pad on the substrate. The method forms a redistribution line which is electrically connected to the bonding pad, on the dielectric layer. The method forms an external terminal which is electrically connected to the bonding pad without using a solder mask which limits a position of the external terminal, on the redistribution line.

Abstract translation: 提供半导体封装，半导体模块和制造半导体封装的方法。 该方法提供了包括接合焊盘的衬底。 该方法形成用于使衬底上的焊盘露出的介电层。 该方法形成在电介质层上电连接到接合焊盘的再分配线。 该方法形成外部端子，该外部端子电连接到接合焊盘，而不使用在再分配线上限制外部端子的位置的焊接掩模。

公开(公告)号：US20090102297A1

公开(公告)日：2009-04-23

申请号：US12255848

申请日：2008-10-22

Applicant: Kwang Yong LEE ,  Dong Han Kim

Inventor： Kwang Yong LEE ,  Dong Han Kim

IPC: H02K15/14

CPC classification number: F04D29/40

Abstract: Disclosed herein is a blower motor assembly for a vehicle. The blower motor assembly comprises an armature assembly, a motor body, a magnet, an upper case, and a lower case. The armature assembly comprises a rotatable armature shaft with an armature. The motor body is an open cylinder that houses the armature assembly. The magnet is installed between the motor body and the armature assembly. The upper case has a through-hole which permits the armature shaft to projects outward through. The lower case is coupled to the upper case. The motor body is installed in an internal space defined by the coupled upper and lower cases. The motor body is fixed in a correspondingly-shaped hollow portion defined by a wall of a motor body fixing portion formed in the lower case. The magnet is fixed to a magnet fixing portion formed in the lower case.

Abstract translation: 这里公开了一种用于车辆的鼓风机马达组件。 鼓风机马达组件包括电枢组件，马达主体，磁体，上壳体和下壳体。 电枢组件包括具有电枢的可旋转电枢轴。 电机主体是容纳电枢组件的开放式气缸。 磁体安装在电机主体和电枢组件之间。 上壳体具有允许电枢轴向外突出的通孔。 下壳体联接到上壳体。 电动机体安装在由上下壳体限定的内部空间中。 马达主体固定在形成在下壳体中的电动机主体固定部分的壁限定的相应形状的中空部分中。 磁体固定在形成在下壳体中的磁铁固定部分。

公开(公告)号：US07499376B2

公开(公告)日：2009-03-03

申请号：US11633456

申请日：2006-12-05

Applicant: Jin Won Kim ,  Seung Min Park ,  Il Gon Park ,  Kwang Yong Lee ,  Doo Seop Eom ,  Won Hee Lee ,  Woo Young Lee ,  Tae Young Kim

Inventor： Jin Won Kim ,  Seung Min Park ,  Il Gon Park ,  Kwang Yong Lee ,  Doo Seop Eom ,  Won Hee Lee ,  Woo Young Lee ,  Tae Young Kim

IPC: G01S3/80

CPC classification number: G01S5/18 ,  G01S5/0289

Abstract: Provided are a system and method for position awareness that can be used indoors in a large-scale environment and can minimize generation of radio frequency (RF) and ultrasonic waves in a wireless sensor network including low-priced sensor nodes capable of precise position measurement, thus improving energy efficiency by reducing unnecessary power consumption. The method includes the steps of: (a) calculating initial position coordinates using beacon information received from adjacent beacons through a broadcast beacon solicitation signal, sending a synchronization signal to the beacons, and synchronizing the beacons; (b) receiving ultrasonic waves generated from the adjacent beacons activated by a broadcast start message, and calculating position coordinates; and (c) when the calculated position coordinates correspond to a predetermined hand-off threshold position, transmitting a hand-off process message to a newly activated beacon, and executing a hand-off process routine.

Abstract translation: 提供一种用于位置感知的系统和方法，其可以在大规模环境中室内使用，并且可以在包括能够进行精确位置测量的低价传感器节点的无线传感器网络中最小化射频（RF）和超声波的产生， 从而通过减少不必要的功率消耗来提高能量效率。 该方法包括以下步骤：（a）使用通过广播信标请求信号从相邻信标接收到的信标信息来计算初始位置坐标，向信标发送同步信号，并同步信标; （b）接收由广播开始消息激活的相邻信标产生的超声波，并计算位置坐标; 以及（c）当计算出的位置坐标对应于预定的切换阈值位置时，将切换处理消息发送到新激活的信标，并且执行切换处理程序。

公开(公告)号：US20170103929A1

公开(公告)日：2017-04-13

申请号：US15201675

申请日：2016-07-05

Applicant: Bo-Ra LEE ,  Jae-Ho JEONG ,  Nam-Gyu BAEK ,  Hyo-Seok WOO ,  Hyun-Sook YOON ,  Kwang-Yong LEE

Inventor： Bo-Ra LEE ,  Jae-Ho JEONG ,  Nam-Gyu BAEK ,  Hyo-Seok WOO ,  Hyun-Sook YOON ,  Kwang-Yong LEE

IPC: H01L21/66 ,  H01L27/115 ,  H01L23/00 ,  H01L29/423

CPC classification number: H01L22/34 ,  H01L23/562 ,  H01L27/1157 ,  H01L27/11575 ,  H01L27/11582

Abstract: A semiconductor chip includes: a gate pattern on a substrate; an interlayer insulation layer on the gate pattern; a first wiring structure on the interlayer insulation layer; and a defect detection circuit electrically connected to the gate pattern and the first wiring structure. The first wiring structure is electrically connected to the gate pattern via a contact plug through the interlayer insulation layer. The defect detection circuit is electrically connected to the gate pattern and the first wiring structure, and the defect detection circuit is configured to detect defects in the first wiring structure and at least one of the gate pattern and the substrate.

公开(公告)号：US09159680B2

公开(公告)日：2015-10-13

申请号：US13486155

申请日：2012-06-01

Applicant: Sang-Wook Park ,  Kwang-Yong Lee ,  Ho-Geon Song

Inventor： Sang-Wook Park ,  Kwang-Yong Lee ,  Ho-Geon Song

IPC: H01L21/28 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L24/03 ,  H01L24/05 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/03003 ,  H01L2224/03334 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0603 ,  H01L2224/06153 ,  H01L2924/01327 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of fabricating a semiconductor device includes preparing a semiconductor substrate having a circuit unit on an upper surface thereof, a metal pad electrically connected to the circuit unit, and a passivation layer that covers the circuit unit and exposes the metal pad, forming a first re-wiring layer that is electrically connected to the metal pad and is formed by a printing method to extend from the metal pad on the passivation layer and forming a second re-wiring layer on the first re-wiring layer using the first re-wiring layer as a seed by using an electro-plating process.

Abstract translation: 制造半导体器件的方法包括制备在其上表面上具有电路单元的半导体衬底，电连接到电路单元的金属焊盘以及覆盖电路单元并暴露金属焊盘的钝化层，形成第一 电连接到金属焊盘的再布线层，并且通过印刷方法形成，以从钝化层上的金属焊盘延伸，并且在第一重新布线层上形成第二重新布线层，使用第一重新布线 层作为种子使用电镀方法。

公开(公告)号：US20120309167A1

公开(公告)日：2012-12-06

申请号：US13486155

申请日：2012-06-01

Applicant: Sang-Wook PARK ,  Kwang-Yong Lee ,  Ho-Geon Song

Inventor： Sang-Wook PARK ,  Kwang-Yong Lee ,  Ho-Geon Song

IPC: H01L21/28 ,  H01L21/78

CPC classification number: H01L24/03 ,  H01L24/05 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/03003 ,  H01L2224/03334 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0603 ,  H01L2224/06153 ,  H01L2924/01327 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of fabricating a semiconductor device includes preparing a semiconductor substrate having a circuit unit on an upper surface thereof, a metal pad electrically connected to the circuit unit, and a passivation layer that covers the circuit unit and exposes the metal pad, forming a first re-wiring layer that is electrically connected to the metal pad and is formed by a printing method to extend from the metal pad on the passivation layer and forming a second re-wiring layer on the first re-wiring layer using the first re-wiring layer as a seed by using an electro-plating process.

Abstract translation: 制造半导体器件的方法包括制备在其上表面上具有电路单元的半导体衬底，电连接到电路单元的金属焊盘以及覆盖电路单元并暴露金属焊盘的钝化层，形成第一 电连接到金属焊盘的再布线层，并且通过印刷方法形成，以从钝化层上的金属焊盘延伸，并且在第一重新布线层上形成第二重新布线层，使用第一重新布线 层作为种子使用电镀方法。

公开(公告)号：US20120173744A1

公开(公告)日：2012-07-05

申请号：US13395419

申请日：2010-09-10

Applicant: Kwang-Yong Lee ,  Soon-Hwan Kwon

Inventor： Kwang-Yong Lee ,  Soon-Hwan Kwon

IPC: H04W76/02 ,  G06F15/16

CPC classification number: G06K9/3266 ,  H04W8/205 ,  H04W12/003 ,  H04W12/00522 ,  H04W84/12

Abstract: A method and apparatus for wireless connection with an external device using image recognition in a mobile communication terminal is provided. In the method for wireless connection with an external device using image recognition in a mobile communication terminal, an image including network connection information is acquired by a camera. The network connection information is acquired by recognizing the image through an image recognition algorithm. The wireless connection with the external device is performed using the acquired network connection information.

Abstract translation: 提供了一种在移动通信终端中使用图像识别的与外部设备进行无线连接的方法和装置。 在移动通信终端中使用图像识别的外部设备进行无线连接的方法中，通过摄像机获取包含网络连接信息的图像。 通过图像识别算法识别图像来获取网络连接信息。 使用所获取的网络连接信息来执行与外部设备的无线连接。

公开(公告)号：US08015835B2

公开(公告)日：2011-09-13

申请号：US12261481

申请日：2008-10-30

Applicant: Kwang Yong Lee ,  Young Jo Park ,  Dong Han Kim ,  Jung Yong Park ,  Jae Ho Jeong

Inventor： Kwang Yong Lee ,  Young Jo Park ,  Dong Han Kim ,  Jung Yong Park ,  Jae Ho Jeong

IPC: F25B5/00 ,  B60H1/32 ,  A47C7/74

CPC classification number: B60H1/00285 ,  B60H1/323 ,  B60H2001/00307 ,  B60H2001/00942

Abstract: An internal cooling apparatus for automobiles includes a first expansion valve for spraying a coolant to a main evaporator through a high-pressure pipe, a compressor receiving the coolant evaporated in the main evaporator through a low-pressure pipe, a condenser receiving the coolant compressed in the compressor, and a plurality of sub-evaporators each being installed inside of a seat to contact an automobile passenger. One end of each of the sub-evaporators is communicated with the high-pressure pipe and the other end thereof is communicated with the low-pressure pipe such that part of the coolant sprayed through the first expansion valve is supplied to the compressor via each of the sub-evaporators.

Abstract translation: 用于汽车的内部冷却装置包括：第一膨胀阀，用于通过高压管将冷却剂喷射到主蒸发器;压缩机，其通过低压管接收在主蒸发器中蒸发的冷却剂;冷凝器，接收压缩在 压缩机和多个副蒸发器，其各自安装在座椅内部以接触汽车乘客。 每个副蒸发器的一端与高压管连通，另一端与低压管连通，使得通过第一膨胀阀喷射的冷却剂的一部分通过 副蒸发器。