公开(公告)号：US5551903A

公开(公告)日：1996-09-03

申请号：US326302

申请日：1994-10-19

Applicant: Nalin Kumar ,  Chenggang Xie

Inventor： Nalin Kumar ,  Chenggang Xie

IPC: G09G3/22 ,  H01J1/304 ,  H01J1/316 ,  H01J9/02 ,  H01J29/08 ,  H01J31/12 ,  H01J61/067 ,  H01J63/06 ,  H01J1/30

CPC classification number: H01J1/316 ,  G09G3/22 ,  H01J1/304 ,  H01J1/3042 ,  H01J29/085 ,  H01J31/127 ,  H01J61/0677 ,  H01J63/06 ,  H01J9/027 ,  H01J2201/304 ,  H01J2201/30426 ,  H01J2201/30457 ,  H01J2201/319 ,  H01J2329/8625 ,  H01J2329/864 ,  Y10S977/891

Abstract: A field emission cathode is provided which includes a substrate and a conductive layer disposed adjacent the substrate. An electrically resistive pillar is disposed adjacent the conductive layer, the resistive pillar having a substantially flat surface spaced from and substantially parallel to the substrate. A layer of diamond is disposed adjacent the flat surface of the resistive pillar.

Abstract translation: 提供场发射阴极，其包括衬底和邻近衬底设置的导电层。 电阻柱设置在导电层附近，电阻柱具有与衬底间隔开并基本上平行于衬底的基本平坦的表面。 在电阻柱的平坦表面附近设置一层金刚石。

公开(公告)号：US5399238A

公开(公告)日：1995-03-21

申请号：US232790

申请日：1994-04-22

Applicant: Nalin Kumar

Inventor： Nalin Kumar

IPC: H01J9/02 ,  H05K3/00 ,  H01J9/00

CPC classification number: H01J9/025 ,  H01J2201/30407 ,  H01J2201/30457 ,  H05K2201/2081 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K3/0023 ,  H05K3/0041

Abstract: A method of making sub-micron low work function field emission tips without using photolithography. The method includes physical vapor deposition of randomly located discrete nuclei to form a discontinuous etch mask. In one embodiment an etch is applied to low work function material covered by randomly located nuclei to form emission tips in the low work function material. In another embodiment an etch is applied to base material covered by randomly located nuclei to form tips in the base material which are then coated with low work function material to form emission tips. Diamond is the preferred low work function material.

Abstract translation: 一种制造亚微米低功函数场发射尖端而不使用光刻的方法。 该方法包括随机定位的离散核的物理气相沉积以形成不连续的蚀刻掩模。 在一个实施例中，蚀刻被施加到由随机定位的核覆盖的低功函数材料，以在低功函数材料中形成发射尖端。 在另一个实施例中，蚀刻被施加到由随机定位的核覆盖的基材上，以在基材中形成尖端，然后用低功函数材料涂覆以形成发射尖端。 钻石是首选的低功能材料。

公开(公告)号：US5317006A

公开(公告)日：1994-05-31

申请号：US771353

申请日：1991-10-04

Applicant: Nalin Kumar

Inventor： Nalin Kumar

IPC: C23C14/34 ,  C23C14/56 ,  H01J37/34 ,  H01L39/24 ,  H01L39/00 ,  C23C14/35

CPC classification number: H01J37/3402 ,  C23C14/3407 ,  C23C14/56 ,  H01J37/3277 ,  H01J37/342 ,  H01L39/2435 ,  Y10S505/731 ,  Y10S505/786 ,  Y10S505/816

Abstract: An improved cathode for a sputtering system includes a metal cylinder and strips of material bonded to the inside of the metal cylinder and/or material sprayed onto the inside of the metal cylinder. The strips may have various specified compositions and/or configurations and/or other characteristics which enhance the ability of the sputtering system to deposit films of high temperature superconductor material on substrates.

Abstract translation: 用于溅射系统的改进的阴极包括金属圆筒和粘合到金属圆筒内部和/或喷射到金属圆筒内部的材料的材料条。 条带可以具有各种指定的组成和/或构造和/或其他特性，其增强了溅射系统将高温超导体材料的膜沉积在衬底上的能力。

公开(公告)号：US5290732A

公开(公告)日：1994-03-01

申请号：US896126

申请日：1992-06-09

Applicant: Nalin Kumar ,  Chenggang Xie ,  Rama R. Goruganthu ,  Mohammed K. Ghazi

Inventor： Nalin Kumar ,  Chenggang Xie ,  Rama R. Goruganthu ,  Mohammed K. Ghazi

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/00 ,  H01L21/285

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01J2201/30457 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H05K2201/2081 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K3/0023 ,  H05K3/0041

Abstract: Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, and multiple sources for depositing alloyed (tin-lead) bumps with constant composition.

Abstract translation: 提高了诸如多芯片模块和集成电路芯片的衬底上的金属凸块的电离金属簇束沉积。 本发明公开了用于去除在凸起周围沉积在衬底上的不需要的金属的湿蚀刻技术，以及用于沉积具有恒定组成的合金（锡铅）凸块的多个源。

公开(公告)号：US5254493A

公开(公告)日：1993-10-19

申请号：US841311

申请日：1992-02-24

Applicant: Nalin Kumar

Inventor： Nalin Kumar

IPC: H05K1/16 ,  H05K3/06 ,  H05K3/46 ,  H01L21/70

CPC classification number: H05K1/16 ,  H05K1/162 ,  H05K1/167 ,  H05K2201/0317 ,  H05K2201/09563 ,  H05K2203/0315 ,  H05K2203/1142 ,  H05K3/061 ,  H05K3/4647 ,  Y10S148/136

Abstract: A process for fabricating integrated resistors in high density interconnect substrates for multi-chip modules. In addition, the resistor material can be converted selectively into an insulator for optionally allowing for the simultaneous fabrication of integrated resistors and capacitors in relatively few steps. The process is well suited for copper/polyimide substrates.

Abstract translation: 一种用于制造用于多芯片模块的高密度互连基板中的集成电阻器的方法。 此外，电阻器材料可以选择性地转换成绝缘体，以可选地允许在相对较少的步骤中同时制造集成电阻器和电容器。 该工艺非常适用于铜/聚酰亚胺基板。

公开(公告)号：US5229358A

公开(公告)日：1993-07-20

申请号：US621390

申请日：1990-12-03

Applicant: Nalin Kumar

Inventor： Nalin Kumar

IPC: C23C14/34 ,  C23C14/56 ,  H01J37/34 ,  H01L39/24

CPC classification number: H01J37/3277 ,  C23C14/3407 ,  C23C14/56 ,  H01J37/3402 ,  H01J37/342 ,  H01L39/2451 ,  H01L39/248 ,  Y10S505/731 ,  Y10S505/74 ,  Y10S505/786

Abstract: A superconducting wire which includes a base wire and at least a superconduction layer formed on the base wire. The superconduction layer may be formed by using a sputtering system for depositing a film of high temperature superconductor material on the base wire. The superconducting wire may further include an adhesion layer, a diffusion barrier layer and/or a protection layer. Several superconducting wires may be grouped together in a metal matrix to form a composite superconducting wire.

Abstract translation: 一种超导线，其包括形成在基线上的基线和至少一个超导层。 可以通过使用用于在基线上沉积高温超导体材料的膜的溅射系统来形成超导层。 超导线还可以包括粘合层，扩散阻挡层和/或保护层。 可以将几根超导线组合在金属基体中以形成复合超导线。

公开(公告)号：US5196102A

公开(公告)日：1993-03-23

申请号：US741928

申请日：1991-08-08

Applicant: Nalin Kumar

Inventor： Nalin Kumar

IPC: C23C14/00 ,  C23C14/04 ,  C23C14/22

CPC classification number: C23C14/221 ,  C23C14/0021 ,  C23C14/048

Abstract: A method of applying a compound of a metal and a reactive gas onto a surface by depositing a metal from a liquid metal cluster ion source onto said surface in the presence of a gas on the surface to combine with the deposited metal while isolating the gas from the source of the metal cluster ions.

Abstract translation: 一种通过在表面存在气体的情况下将金属从液态金属簇离子源沉积到所述表面上以将金属和反应性气体的化合物施加到表面上以与沉积的金属结合的方法，同时将气体从 金属簇离子的来源。

公开(公告)号：US06731849B1

公开(公告)日：2004-05-04

申请号：US10444904

申请日：2003-05-22

Applicant: Bawa Singh ,  Nalin Kumar ,  Vipulkumar Patel ,  Krishna Linga ,  Ali Ouali

Inventor： Bawa Singh ,  Nalin Kumar ,  Vipulkumar Patel ,  Krishna Linga ,  Ali Ouali

IPC: G02B602

CPC classification number: G02B6/2558 ,  C03C25/226 ,  C23C14/3407 ,  C23C14/352 ,  C23C14/562 ,  G02B6/02395 ,  G02B6/25 ,  Y10T428/2964

Abstract: An improved coating for optical fibers is described. The present invention is a dimensionally precise and uniform coating with low-porosity. The improved coating is applied via sputtering within a vacuum chamber. Environmental conditions are monitored within a cylindrical magnetron during sputtering. Sputtering is adjusted or temporarily ceased when environmental conditions approach a damage threshold. Sputtered particles within a plasma cloud are dimensionally similar and adhere to an optical fiber in a volume efficient arrangement forming a more precise, denser, and more adherent coating. Embodiments of the present invention provide improved pull strength by compressively constraining the optical fiber within the coating and by closing microcracks.

Abstract translation: 描述了一种改进的光纤涂层。 本发明是具有低孔隙率的尺寸精确且均匀的涂层。 改进的涂层通过溅射在真空室内进行。 在溅射期间，在圆柱形磁控管内监测环境条件。 当环境条件接近损伤阈值时，溅射被调整或暂时停止。 等离子体云中的溅射颗粒在尺寸上相似并且以体积有效的布置粘附到光纤上，形成更精确，更致密和更粘附的涂层。 本发明的实施例通过在涂层内压缩约束光纤并且通过闭合微裂纹来提供改进的拉伸强度。

公开(公告)号：US06629869B1

公开(公告)日：2003-10-07

申请号：US08474277

申请日：1995-06-07

Applicant: Nalin Kumar ,  Chenggang Xie

Inventor： Nalin Kumar ,  Chenggang Xie

IPC: H01J902

CPC classification number: H01J1/316 ,  G09G3/22 ,  H01J1/304 ,  H01J1/3042 ,  H01J9/027 ,  H01J29/085 ,  H01J31/127 ,  H01J61/0677 ,  H01J63/06 ,  H01J2201/304 ,  H01J2201/30426 ,  H01J2201/30457 ,  H01J2201/319 ,  H01J2329/8625 ,  H01J2329/864 ,  Y10S977/891

Abstract: A field emission cathode is provided which includes a substrate and a conductive layer desposed adjacent the substrate. An electrically resistive pillar is disposed adjacent the conductive layer, the resistive pillar having a substantially flat surface spaced from and substantially parallel to the substrate. A layer of diamond is disposed adjacent the surface of the resistive pillar.

Abstract translation: 提供场发射阴极，其包括衬底和邻近衬底设置的导电层。 电阻柱设置在导电层附近，电阻柱具有与衬底间隔开并基本上平行于衬底的基本平坦的表面。 金刚石层邻近电阻柱的表面设置。

公开(公告)号：US06552563B1

公开(公告)日：2003-04-22

申请号：US08748893

申请日：1996-11-14

Applicant: Zvi Yaniv ,  Nalin Kumar ,  Nathan Potter

Inventor： Zvi Yaniv ,  Nalin Kumar ,  Nathan Potter

IPC: G01R3100

CPC classification number: G09G3/006

Abstract: A device for testing flat panel displays includes an interface having compliant bumps mounted thereon, which make electrical contact with pads on the display panel. The interface may have a hole formed therein for allowing the passage of light therethrough when the interface is mounted on the display panel. The compliant bumps ensure that all of the bumps make sufficient electrical contact with the pads.